Abstract:
In a lead-free solder, a semiconductor package and a method of manufacturing the semiconductor package, the lead-free solder includes about 3.5 percent by weight to about 6 percent by weight of silver, about 0.05 percent by weight to about 0.5 percent by weight of copper and a remainder of tin. The lead-free solder is employed in the semiconductor package. The lead-free solder has high impact resistance and high heat resistance to reduce failures of the semiconductor package.
Abstract:
An outdoor unit for an air conditioner is disclosed. The outdoor unit according to the present invention comprises a housing which has an air inlet and an air outlet, a ventilation fan rotatably mounted in the housing, and a fan guard connected to the housing to cover the air outlet. Here, the fan guard comprises a plurality of closed ribs arranged sequentially and concentrically between a center and an outline thereof, and a plurality of radial ribs arranged in radial directions to interconnect the plurality of closed ribs, in such a manner that some of the closed ribs, which are disposed at intermediate positions near tips of the ventilation fan, are at a further distance from the ventilation fan than the other closed ribs, which are disposed near the center and the outline. Accordingly, since the fan guard is convexly raised at a position corresponding to the tips of the ventilation fan, thereby guaranteeing a predetermined space between the fan guard and the tips where the airflow is fastest, the flow resistance and the flow-induced noise can be reduced.
Abstract:
A suction nozzle of a vacuum cleaner includes jet units for jetting air into positions where air streams collide with each other as air is drawn into a suction port of the nozzle from both side portions thereof, so as to prevent substantially the collision of air streams.
Abstract:
A semiconductor memory device includes a first conductive line on a semiconductor substrate, an interlayer insulating layer on the first conductive line, a second conductive line on the interlayer insulating layer, and a memory cell in an hole through the interlayer insulating layer wherein the first and second conductive lines cross, the memory cell including a discrete resistive memory material region disposed in the hole and electrically connected between the first and second conductive lines. The resistive memory material region may be substantially contained within the hole. In some embodiments, contact between the resistive memory material region and the interlayer insulating layer is substantially limited to sidewalls of the interlayer insulating layer in the hole.
Abstract:
Example embodiments of the present invention include a socket for testing a semiconductor package. The socket comprises a body having a through hole. A lower magnet is disposed in a lower region of the through hole, and a first type magnetic pole of the lower magnet is directed upward. An upper magnet is disposed in an upper region of the through hole, wherein the first type magnetic pole of the upper magnet is directed toward the lower magnet. The upper and lower magnets are structured to absorb a shock wave which is generated when the semiconductor package is arranged for testing. A conductive medium is disposed between the lower magnet and the upper magnet to electrically couple contactors of the semiconductor package to a base substrate of the socket.
Abstract:
A system for facilitating the handling and transporting of semiconductor packages includes a stock of trays in which semiconductor packages can be held, and a tray carrier by which a stack of the trays can be easily handled using automated equipment and without producing dust. The tray carrier includes a frame having an open bottom end through which a stack of trays can be inserted into the frame, belt drums mounted on both sides of the bottom end of the frame, fork blocks mounted to the frame under the belt drums, and a belt extending from the belt drums through the fork blocks and across the open bottom end of the frame. When the tray carrier is placed over a stack of the trays, the belt surrounds the top and sides of the stack of trays. The fork blocks include prongs that are movable into the space constituting the open bottom end of the frame so as to support the bottom of the stack of trays. The tray carrier also has fork handles for actuating the fork blocks, and locking handles for locking the fork blocks in place.
Abstract:
A liquid crystal display and control method thereof, having a liquid crystal display panel, a light emitting diode device which is disposed on the rear of the liquid crystal display panel and which is divided into a plurality of partitioned areas that are capable of being driven independently, a light guide part disposed for each of the partitioned areas, an image calculating part for dividing the liquid crystal display panel into a plurality of regions and calculating the brightness of each region by using image data, and an inverter and an inverter controller to provide differentiated power to the partitioned areas based on the calculated brightness.