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公开(公告)号：US11888397B2
公开(公告)日：2024-01-30
申请号：US17531024
申请日：2021-11-19
Applicant: STMicroelectronics S.r.l.
Inventor： Niccolo' Brambilla , Sandro Rossi , Valeria Bottarel
CPC classification number: H02M3/158 , H02M1/0009
Abstract: A DC-DC switching converter includes power switches selectively coupling an output terminal with a first voltage or with a second voltage. A driver stage is coupled with the power switches for driving the power switches. A driver control stage is coupled with the driver stage for controlling the operation of the driver stage. An output current sensing circuit is coupled with the output terminal and with the driver control stage, and is configured to sense a sign of an output current delivered by the DC-DC switching converter at the output terminal and to generate control signals for the driver control stage. The driver control stage controls the operation of the driver stage according to states of the control signals received from the output current sensing circuit, for selectively delaying the activation of the power switches depending on the sensed sign of the output current.
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公开(公告)号：US11888304B2
公开(公告)日：2024-01-30
申请号：US16666989
申请日：2019-10-29
Applicant: STMicroelectronics S.r.l.
Inventor： Vittorio D'Angelo , Salvatore Cannavacciuolo , Sergio Lecce , Valerio Bendotti , Orazio Pennisi
CPC classification number: H02H1/063 , H02H9/046 , H02J7/0014
Abstract: An integrated circuit with a hot-plug protection circuit includes input pins and an output pin. The input pins are electrically coupled to a common node in the hot-plug protection circuit via respective electrical connections. The integrated circuit includes clamping circuitry coupled between the common node and the output pin, the clamping circuitry activatable as a result of a voltage spike applied across the clamping circuitry. The plurality of electrical connections and the clamping circuitry provide respective current discharge paths between the input pins in the input pins and the output pin, the respective current discharge paths configured to become conductive as a result of a voltage spike applied to any of the input pins in the plurality of input pins being transferred to the common node via the respective electrical connection in the plurality of electrical connections electrically coupling said any of said input pins to the common node.
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公开(公告)号：US20240021718A1
公开(公告)日：2024-01-18
申请号：US18477372
申请日：2023-09-28
Applicant: STMICROELECTRONICS S.r.l.
Inventor： Ferdinando IUCOLANO , Cristina TRINGALI
IPC: H01L29/778 , H01L21/285 , H01L29/06 , H01L29/47 , H01L29/66
CPC classification number: H01L29/7786 , H01L21/28581 , H01L29/0649 , H01L29/475 , H01L29/66462 , H01L29/7787 , H01L29/2003
Abstract: An HEMT includes a semiconductor body, which includes a semiconductor heterostructure, and a conductive gate region. The gate region includes: a contact region, which is made of a first metal material and contacts the semiconductor body to form a Schottky junction; a barrier region, which is made of a second metal material and is set on the contact region; and a top region, which extends on the barrier region and is made of a third metal material, which has a resistivity lower than the resistivity of the first metal material. The HEMT moreover comprises a dielectric region, which includes at least one front dielectric subregion, which extends over the contact region, delimiting a front opening that gives out onto the contact region; and wherein the barrier region extends into the front opening and over at least part of the front dielectric subregion.
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公开(公告)号：US20240019688A1
公开(公告)日：2024-01-18
申请号：US18220554
申请日：2023-07-11
Applicant: STMicroelectronics S.r.l.
Inventor： Massimiliano MERLI , Roberto CARMINATI , Nicolo' BONI , Sonia COSTANTINI , Carlo Luigi PRELINI
CPC classification number: G02B26/0858 , B81B3/007 , B81C1/00658 , B81B2201/042
Abstract: Disclosed herein is a micro-electro-mechanical mirror device having a fixed structure defining an external frame delimiting a cavity, a tiltable structure extending into the cavity, a reflecting surface carried by the tiltable structure and having a main extension in a horizontal plane, and an actuation structure coupled between the tiltable structure and the fixed structure. The actuation structure is formed by a first pair of actuation arms causing rotation of the tiltable structure around a first axis parallel to the horizontal plane. The actuation arms are elastically coupled to the tiltable structure through elastic coupling elements and are each formed by a bearing structure and a piezoelectric structure. The bearing structure of each actuation arm is formed by a soft region of a first material and the elastic coupling elements are formed by a bearing layer of a second material, the second material having greater stiffness than the first material.
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公开(公告)号：US20240019475A1
公开(公告)日：2024-01-18
申请号：US18348993
申请日：2023-07-07
Applicant: STMICROELECTRONICS S.r.l.
Inventor： Matteo QUARTIROLI
Abstract: The integrated sensor has a clock which provides a clock signal having a clock frequency; a digital detector which detects a power grid signal and generates a reference digital signal indicative of the power grid signal and having a sample rate which is a function of the clock frequency; and a timing monitoring stage which receives the reference digital signal and a nominal signal indicative of a nominal timing of the reference digital signal. The timing monitoring stage also compares the reference digital signal with the nominal signal and, in response, provides an error signal indicative of a timing error between the reference digital signal and the nominal signal.
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Patent Agency Ranking
公开(公告)号：US20240014718A1
公开(公告)日：2024-01-11
申请号：US18345863
申请日：2023-06-30
Applicant: STMICROELECTRONICS S.r.l.
Inventor： Luca SEGHIZZI , Federico VERCESI , Gianluca LONGONI
CPC classification number: H02K15/026 , H02K15/0068 , H02K2215/00
Abstract: A stator for an electric actuator or motor, including: a solid body; a ferromagnetic core region between the layers of semiconductor material, electrically insulated from the layers of semiconductor material; a plurality of conductive through vias through the solid body; a first plurality of conductive strips, which extend parallel to one another above the core; and a second plurality of conductive strips, which extend parallel to one another above the core and opposite to the first plurality of conductive strips; wherein the first plurality of conductive strips, the plurality of conductive through vias, and the second plurality of conductive strips form a winding or coil of the stator.
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公开(公告)号：US20240014286A1
公开(公告)日：2024-01-11
申请号：US18345767
申请日：2023-06-30
Applicant: STMICROELECTRONICS S.r.l.
Inventor： Mario Giuseppe SAGGIO , Cateno Marco CAMALLERI , Alfio GUARNERA
CPC classification number: H01L29/4933 , H01L29/1608 , H01L29/7802 , H01L21/049 , H01L29/66068
Abstract: A power MOSFET device includes a semiconductor body having a first main surface. The semiconductor body includes an active area facing the first main surface. The power MOSFET device includes an isolated-gate structure, which extends over the active area and includes a gate-oxide layer, which is made of insulating material and extends over the first main surface, and a gate region buried in the gate-oxide layer so as to be electrically insulated from the semiconductor body. The gate region includes a gate layer of polysilicon and at least one first silicide electrical-modulation region and one second silicide electrical-modulation region, which extend in the gate layer so as to face a top surface of the gate layer and to be arranged alongside one another and spaced apart from one another in a first plane.
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公开(公告)号：US20240012871A1
公开(公告)日：2024-01-11
申请号：US17859769
申请日：2022-07-07
Inventor： Antonio DE VITA , Thomas BOESCH , Giuseppe DESOLI
CPC classification number: G06F17/15 , G06F7/5443
Abstract: A convolutional accelerator includes a feature line buffer, a kernel buffer, a multiply-accumulate cluster, and iteration control circuitry. The convolutional accelerator, in operation, convolves a kernel with a streaming feature data tensor. The convolving includes decomposing the kernel into a plurality of sub-kernels and iteratively convolving the sub-kernels with respective sub-tensors of the streamed feature data tensor. The iteration control circuitry, in operation, defines respective windows of the streamed feature data tensors, the windows corresponding to the sub-tensors.
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公开(公告)号：US20240006277A1
公开(公告)日：2024-01-04
申请号：US18369652
申请日：2023-09-18
Applicant: STMicroelectronics S.r.l.
Inventor： Alberto ARRIGONI , Giovanni GRAZIOSI , Aurora SANNA
IPC: H01L23/495 , H01L21/48
CPC classification number: H01L23/49589 , H01L21/4825 , H01L23/49503 , H01L23/4952
Abstract: Disclosed herein is a method for manufacturing a semiconductor product package. The method includes arranging a leadframe with one or more leads such that each lead has an inner end facing a portion of a die-pad, attaching a semiconductor chip to the die-pad, attaching a first electrically conductive mass to the die-pad such that it is aligned with the inner end of a lead protruding over the die-pad, attaching an electrical component to the first electrically conductive mass such that a longitudinal axis of the electrical component is arranged traverse to the die-pad, and coupling a second electrically conductive mass between a termination of the electrical component and the inner end of the lead.
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公开(公告)号：US11864361B2
公开(公告)日：2024-01-02
申请号：US16934991
申请日：2020-07-21
Applicant: STMICROELECTRONICS S.r.l.
Inventor： Cristiano Gianluca Stella , Francesco Salamone
IPC: H05K7/20 , H01L23/373 , H01L25/07
CPC classification number: H05K7/209 , H01L23/3735 , H01L25/071
Abstract: The device has a first support element forming a first thermal dissipation surface and carrying a first power component; a second support element forming a second thermal dissipation surface and carrying a second power component, a first contacting element superimposed to the first power component; a second contacting element superimposed to the second power component; a plurality of leads electrically coupled with the power components through the first and/or the second support elements; and a thermally conductive body arranged between the first and the second contacting elements. The first and the second support elements and the first and the second contacting elements are formed by electrically insulating and thermally conductive multilayers.
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