公开(公告)号：US20070148875A1

公开(公告)日：2007-06-28

申请号：US11316692

申请日：2005-12-22

申请人： Ming Sun ,  Demei Gong ,  Yueh Ho

发明人： Ming Sun ,  Demei Gong ,  Yueh Ho

IPC分类号： H01L21/336

CPC分类号： H01L24/13 ,  H01L21/563 ,  H01L23/3114 ,  H01L24/11 ,  H01L2224/05026 ,  H01L2224/05155 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/00014

摘要： A common drain dual MOSFET chip scale package and a method of fabricating same are provided. The method of fabricating a plurality of common drain dual MOSFET chip scale packages includes the steps of providing a wafer having a plurality of common drain dual MOSFET devices disposed thereon, insulating a back drain metal surface of the wafer, under bump metallizing ball grid array pads on each of the common drain dual MOSFET devices, stenciling a solder mask to the wafer to expose the ball grid array pads, reflowing solder paste or pre-formed solder balls to form ball grid arrays of solder bumps, and dicing the wafer into the plurality of chip scale packages

摘要翻译： 提供了一种常见的漏极双MOSFET芯片级封装及其制造方法。 制造多个公共漏极双MOSFET芯片级封装的方法包括以下步骤：提供具有设置在其上的多个公共漏极双MOSFET器件的晶片，绝缘晶片的后漏极金属表面，凸块下金属化球栅阵列焊盘 在每个公共漏极双MOSFET器件上，将焊接掩模模板到晶片以暴露球栅阵列焊盘，回流焊膏或预形成的焊球以形成焊球凸块的球栅阵列，并将晶片切割成多个 的芯片级封装

公开(公告)号：US20070085187A1

公开(公告)日：2007-04-19

申请号：US11318300

申请日：2005-12-22

申请人： Ming Sun ,  Yueh Ho

发明人： Ming Sun ,  Yueh Ho

IPC分类号： H01L23/02

CPC分类号： H01L23/5389 ,  H01L23/3677 ,  H01L23/49816 ,  H01L23/49844 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An electronic package for containing at least a top packaging module vertically stacked on a bottom packaging module. Each of the packaging modules includes a semiconductor chip packaged and connected by via connectors and connectors disposed on a laminated board fabricated with a standard printed-circuit board process wherein the top and bottom packaging module further configured as a surface mountable modules for conveniently stacking and mounting to prearranged electrical contacts without using a leadframe. At least one of the top and bottom packaging modules is a multi-chip module (MCM) containing at least two semiconductor chips. At least one of the top and bottom packaging modules includes a ball grid array (BGA) for surface mounting onto the prearranged electrical contacts. At least one of the top and bottom packaging modules includes a plurality of solder bumps on one of the semiconductor chips for surface mounting onto the prearranged electrical contacts. The laminated board of the bottom packaging modules further has a thermal expansion coefficient substantially the same as a printed circuit board (PCB) whereby a surface mount onto the PCB is less impacted by a temperature change

摘要翻译： 一种用于至少包含垂直堆叠在底部包装模块上的顶部包装模块的电子包装。 每个封装模块包括通过通孔连接器和连接器连接的半导体芯片，该连接器和连接器设置在用标准印刷电路板工艺制造的层压板上，其中顶部和底部封装模块还被配置为用于方便地堆叠和安装的表面可安装模块 以预先布置的电触点，而不使用引线框架。 顶部和底部封装模块中的至少一个是包含至少两个半导体芯片的多芯片模块（MCM）。 顶部和底部封装模块中的至少一个包括用于表面安装到预先布置的电触点上的球栅阵列（BGA）。 顶部和底部封装模块中的至少一个包括在半导体芯片之一上的多个焊料凸块，用于表面安装到预先布置的电触点上。 底部封装模块的层叠板还具有与印刷电路板（PCB）基本相同的热膨胀系数，由此PCB上的表面安装较少受到温度变化的影响

公开(公告)号：US20070080443A1

公开(公告)日：2007-04-12

申请号：US11220759

申请日：2005-09-07

申请人： Ming Sun ,  Yueh Ho

发明人： Ming Sun ,  Yueh Ho

IPC分类号： H01L23/12

CPC分类号： H01L23/49816 ,  H01L23/3677 ,  H01L23/49844 ,  H01L23/5389 ,  H01L2224/16225 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/00

摘要： This invention discloses an electronic package for containing a vertical semiconductor chip that includes a laminated board having a via connector and conductive traces distributed on multiple layers of the laminated board connected to the via connector. The semiconductor chip having at least one electrode connected to the conductive traces for electrically connected to the conductive traces at a different layer on the laminated board and the via connector dissipating heat generated from the vertical semiconductor. A ball grid array (BGA) connected to the via connector functioning as contact at a bottom surface of the package for mounting on electrical terminals disposed on a printed circuit board (PCB) wherein the laminated board having a thermal expansion coefficient in substantially a same range the PCB whereby the BGA having a reliable electrical contact with the electrical terminals.

摘要翻译： 本发明公开了一种用于容纳垂直半导体芯片的电子封装件，该电子封装件包括具有通孔连接器的层压板和分布在连接到通孔连接器的叠层板的多层上的导电迹线。 所述半导体芯片具有至少一个连接到所述导电迹线的电极，所述至少一个电极与所述层压板上的不同层上的所述导电迹线电连接，并且所述通孔连接器消散由所述垂直半导体产生的热量。 连接到通孔连接器的球栅阵列（BGA），所述通孔连接器用作在封装的底表面处的接触件，用于安装在布置在印刷电路板（PCB）上的电端子上，其中所述层压板的热膨胀系数在基本相同的范围内 该PCB由此使BGA与电气端子具有可靠的电接触。

公开(公告)号：US20050262675A1

公开(公告)日：2005-12-01

申请号：US11003987

申请日：2004-12-02

申请人： Ming Sun

发明人： Ming Sun

IPC分类号： H01G9/00 ,  H01G9/10

CPC分类号： H01G9/10 ,  H01G11/80 ,  H01G11/82 ,  H01G11/84 ,  Y02E60/13 ,  Y10T29/417

摘要： This invention demonstrates a method for making a device of storing energy, enhancing the efficiency of manufacture and the reliability of products. The electrode plates of storing energy are accumulated according to the working voltage needed to form a pre-structuring unit of storing energy. The electrolyte leak of a capacitor and the unequal voltage of an accumulative unit, which are the main factors of the fail in a conventional capacitor, are solved by using three layers of sealing gel. And then, the electrolyte is to back fill in by vacuum and to seal the units to accomplish the device of storing energy. Each porous electrode in the device has two faces at the same time, which are used for the positive and negative poles respectively. The electrode plates are assembled with bipolar structure, the same as the series connection of the storing-energy devices, which can reduce the volume and mass of the device and the cost of the manufacture. Such kind of energy-storing units can be adjusted according to the need of customers in layers of units or sizes of the area of the electrodes, which are of great advantage to mass production.

摘要翻译： 本发明示出了制造储存能量，提高制造效率和产品可靠性的装置的方法。 存储能量的电极板根据形成储存能量的预构件单元所需的工作电压而积累。 通过使用三层密封胶来解决电容器的电解液泄漏以及作为常规电容器故障的主要因素的累积单元的不同电压。 然后，电解液通过真空回填并密封单元以完成存储能量的装置。 器件中的每个多孔电极同时具有两个面，分别用于正极和负极。 电极板组装有双极结构，与存储能量装置的串联连接相同，这可以减少装置的体积和质量以及制造成本。 这种储能单元可以根据客户的要求调整电极面积的单位或尺寸，这对于批量生产具有很大的优势。

公开(公告)号：US06938791B2

公开(公告)日：2005-09-06

申请号：US10690939

申请日：2003-10-22

申请人： James David Robertson ,  Bernard Primiano ,  Ming Sun

发明人： James David Robertson ,  Bernard Primiano ,  Ming Sun

IPC分类号： A47F3/04 ,  B60N3/10 ,  F25B21/02 ,  B65D51/18

CPC分类号： A47F3/0404 ,  B60H1/00592 ,  B60N3/104 ,  F25B21/02 ,  F25B2321/0251 ,  F25D2400/12

摘要： A lid for a cold box has a shell-like configuration with front and rear shell members hingedly connected. The front shell member pivots relative to the rear shell member to provide access to the interior of the cold box when the front shell member is lifted by a handle. A viewing window is provided in the front shell member. The rear shell member is vented to provide passageways for the intake and outtake of air.

摘要翻译： 用于冷箱的盖子具有壳状构造，其中前壳体构件和后壳构件铰接地连接。 前壳体构件相对于后壳构件枢转，以在前壳体由手柄提升时提供对冷箱内部的通路。 在前壳构件中设置观察窗。 后壳构件被排出以提供用于进气和空气排出的通道。

公开(公告)号：US06779670B2

公开(公告)日：2004-08-24

申请号：US10620913

申请日：2003-07-16

申请人： Bernard Primiano ,  Ming Sun

发明人： Bernard Primiano ,  Ming Sun

IPC分类号： A47F104

CPC分类号： A47F1/12

摘要： An elongate display track device has one or more intermediate sections, a front section with a front piece and product identification panels, and a rear section with a stop member. The sections are frangibly connected to alter the length of the track device. The sections are releasably connected by keys and keyways. The length is changed by removing one or more intermediate sections, then re-attaching the rear section to provide the stop member. The front piece provides a surface along its bottom for a product identification label. Arms upstanding from the front track section support a panel which provides a surface for product identification.

摘要翻译： 细长的显示轨道装置具有一个或多个中间部分，具有前部件和产品标识面板的前部部分和具有止动部件的后部部分。 这些部分是易碎连接的，以改变轨道装置的长度。 这些部分通过键和键槽可释放地连接。 通过移除一个或多个中间部分来改变长度，然后重新附接后部以提供停止部件。 前部件沿其底部提供了一个表面，用于产品识别标签。 从前轨道部分直立的武器支撑一个面板，该面板为产品识别提供了一个表面。

公开(公告)号：US06679389B1

公开(公告)日：2004-01-20

申请号：US10207319

申请日：2002-07-29

申请人： James David Robertson ,  Ming Sun

发明人： James David Robertson ,  Ming Sun

IPC分类号： A47F500

CPC分类号： A47F1/12 ,  A47F7/28

摘要： A front panel for a display rack has a base, upstanding sidewalls connected along their bottom end portions to the base, face members connected to the front edges of the sidewalls, and an elongate connecting member connected to the top end portions of the face members. The base, face members and connecting member define a viewing window for the display rack through which a beverage container in a display rack in a refrigerator can be viewed. The base and connecting member curve outward to position a beverage container forward in the display rack. A pair of downwardly extending fingers fit into receiving slots in a front segment of the rack to fasten the front panel to the front segment of the display rack.

摘要翻译： 用于展示架的前面板具有基部，沿其底端部连接到底座的直立侧壁，连接到侧壁的前边缘的面构件和连接到面构件的顶端部的细长连接构件。 基座，面部构件和连接构件定义了用于显示架的观察窗，通过该观察窗可以观看冰箱中的显示架中的饮料容器。 基部和连接构件向外弯曲，以将饮料容器向前定位在显示架中。 一对向下延伸的指状物装配到齿条的前段中的接收槽中，以将前面板紧固到显示架的前部。

公开(公告)号：US06503206B1

公开(公告)日：2003-01-07

申请号：US09917608

申请日：2001-07-27

申请人： Luya Li ,  Yunquan Chen ,  Rakesh Kumar Sethi ,  Ming Sun

发明人： Luya Li ,  Yunquan Chen ,  Rakesh Kumar Sethi ,  Ming Sun

IPC分类号： A61B502

CPC分类号： A61B5/02125 ,  A61B5/0205 ,  A61B5/024 ,  A61B5/1455

摘要： Apparatus for monitoring one or more vital signs of a subject has a number of sensors. There is at least one redundant sensor. Each sensor originates a signal. A selection system determines performance criteria for a number of groups of signals. Each group includes one or more signals. The apparatus computes a predicted value for a vital sign by either computing a value from each group of signals and taking a weighted average with weights based upon the performance criterion or by selecting one of the groups of signals for which the performance criterion is best and computing the output value from that group of signals. The output values are relatively insensitive to artifacts and to errors caused by the disconnection or malfunctioning of one sensor.

摘要翻译： 用于监测受试者的一个或多个生命体征的装置具有多个传感器。 至少有一个冗余传感器。 每个传感器产生一个信号。 选择系统确定多组信号的性能标准。 每组包括一个或多个信号。 该装置通过计算来自每组信号的值并且基于性能标准采取具有权重的加权平均值或通过选择性能标准最佳的信号组中的一个来计算生命体征的预测值，并且计算 来自该组信号的输出值。 输出值对于伪影和由一个传感器的断开或故障引起的错误相对不敏感。

公开(公告)号：US20150224523A1

公开(公告)日：2015-08-13

申请号：US14544883

申请日：2015-03-02

申请人： Ming Sun

发明人： Ming Sun

IPC分类号： B05B7/24 ,  B05B1/30

CPC分类号： B05B7/2443 ,  B05B1/3013 ,  B05B7/12

摘要： The dispenser comprises an eductor for the drawing of a concentrate fluid from a liquid reservoir container into an input carrier fluid by means of the flow of the other fluid utilizing a venturi effect. In this dispenser the concentration of the concentrate fluid in the input fluid can be varied to differing preset amounts. The dispenser contains an elongated channel having an input for the input fluid and dispensing nozzle at an exit end for dispensing the chemical concentrate fluid in a diluted form. There is a transverse intersecting channel intermediate the input end and the exit end. The transverse intersecting channel has an insert that is moveable in the intersecting channel, apertures of the moveable insert being alignable with apertures in the transverse intersecting channel and the liquid reservoir container holding the concentrate fluid. One aperture is in alignment with the elongated channel and another aperture in alignment with a channel from the liquid reservoir container. The channels from the liquid reservoir container will have a plurality of various sized apertures to provide for the flow of differing amounts of chemical concentrate fluid into the input fluid at a given input fluid flow rate. This results in a product stream of the input fluid diluted to a set concentration. By adjusting the moveable insert in the transverse intersecting channel and/or the input fluid flow rate the concentration of the chemical concentrate in the product fluid is changed.

摘要翻译： 分配器包括喷射器，用于通过使用文丘里效应的其它流体的流动将浓缩液从液体储存容器抽入输入载体流体。 在该分配器中，输入流体中的浓缩液的浓度可以变化到不同的预设量。 分配器包含细长通道，其具有用于输入流体的输入和在出口端处的分配喷嘴，用于以稀释形式分配化学浓缩液。 在输入端和出口端之间有一个横向相交通道。 横向相交通道具有可在交叉通道中移动的插入件，可移动插入件的孔可与横向相交通道中的孔对准，以及容纳浓缩液的储液容器。 一个孔与细长通道对准，另一个孔与来自储液容器的通道对准。 来自液体储存容器的通道将具有多个各种尺寸的孔，以在给定的输入流体流速下提供不同量的化学浓缩液流入输入流体的流量。 这导致输入流体的产物流稀释到设定的浓度。 通过调整横向交叉通道中的可移动插入件和/或输入流体流速，产品流体中化学浓缩物的浓度变化。

公开(公告)号：US20150102425A1

公开(公告)日：2015-04-16

申请号：US14052711

申请日：2013-10-12

申请人： Ming Sun ,  Kai Liu ,  Xiao Tian Zhang ,  Yueh Se Ho ,  Leeshawn Luo

发明人： Ming Sun ,  Kai Liu ,  Xiao Tian Zhang ,  Yueh Se Ho ,  Leeshawn Luo

IPC分类号： H01L23/495 ,  H01L29/78 ,  H01L29/66 ,  H01L23/00

CPC分类号： H01L23/49562 ,  H01L23/492 ,  H01L23/4928 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/83 ,  H01L24/97 ,  H01L29/66477 ,  H01L29/78 ,  H01L2224/291 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/83205 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/83895 ,  H01L2224/97 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2924/014

摘要： A power device package for containing, protecting and providing electrical contacts for a power transistor includes a top and bottom lead frames for directly no-bump attaching to the power transistor. The power transistor is attached to the bottom lead frame as a flip-chip with a source contact and a gate contact directly no-bumping attaching to the bottom lead frame. The power transistor has a bottom drain contact attaching to the top lead frame. The top lead frame further includes an extension for providing a bottom drain electrode substantially on a same side with the bottom lead frame. In a preferred embodiment, the power device package further includes a joint layer between device metal of source, gate or drain and top or bottom lead frame, through applying ultrasonic energy.

摘要翻译： 用于容纳，保护和提供用于功率晶体管的电触头的功率器件封装包括用于直接不连接到功率晶体管的顶部和底部引线框架。 功率晶体管作为具有源极接触的倒装芯片附接到底部引线框架，并且栅极接触件直接地不连接到底部引线框架上。 功率晶体管具有附接到顶部引线框架的底部漏极接触。 顶部引线框架还包括用于提供与底部引线框架基本上在同一侧上的底部漏极电极的延伸部分。 在优选实施例中，功率器件封装还包括通过施加超声波能量的源极，栅极或漏极以及顶部或底部引线框架的器件金属之间的接合层。