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    Thermoelectric-enhanced, inlet air cooling for an electronics rack
    116.
    发明授权
    Thermoelectric-enhanced, inlet air cooling for an electronics rack 有权

    公开(公告)号：US09629286B2

    公开(公告)日：2017-04-18

    申请号：US14870297

    申请日：2015-09-30

    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

    Inventor： Levi A. Campbell ,  Milnes P. David ,  Dustin W. Demetriou ,  Michael J. Ellsworth, Jr. ,  Roger R. Schmidt ,  Robert E. Simons

    IPC: H05K7/20

    CPC classification number: H05K7/20781 ,  H05K7/20736 ,  H05K7/20836

    Abstract: Thermoelectric-enhanced, rack-level cooling of airflow entering an electronics rack is provided by a cooling apparatus, which includes: an air-to-liquid heat exchanger; a coolant loop coupled to the heat exchanger, the coolant loop including a first loop portion and a second loop portion, where the heat exchanger exhausts heated coolant to the first loop portion and receives cooled coolant from the second loop portion. The cooling apparatus further includes a heat rejection unit and a thermoelectric heat pump(s). The heat rejection unit is coupled to the coolant loop between the first and second loop portions, and provides partially-cooled coolant to the second loop portion. The thermoelectric heat pump is disposed with the first and second loop portions coupled to opposite sides to transfer heat from the partially-cooled coolant within the second loop portion to provide the cooled coolant before entering the air-to-liquid heat exchanger.

    Air-moving assembly with auxiliary turbine drive
    117.
    发明授权
    Air-moving assembly with auxiliary turbine drive 有权
    具有辅助涡轮驱动的气动组件

    公开(公告)号：US09504188B1

    公开(公告)日：2016-11-22

    申请号：US14953634

    申请日：2015-11-30

    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

    Inventor： Levi A. Campbell ,  Milnes P. David ,  Dustin W. Demetriou ,  Michael J. Domitrovits ,  Michael J. Ellsworth, Jr. ,  John V. Palmer ,  Sal M. Rosato

    IPC: H05K7/20 ,  H02P29/02 ,  F16D43/00

    CPC classification number: H05K7/20745 ,  F16D27/04 ,  F16D27/09 ,  F16D41/07 ,  H05K7/20136 ,  H05K7/2079

    Abstract: Apparatuses and methods are provided for facilitating air-cooling of, for instance, one or more electronics racks within a data center. The apparatus includes an air-moving assembly and an auxiliary turbine drive. The air-moving assembly includes a shaft, one or more mechanical fans coupled to the shaft to rotate, at least in part, with the shaft, and a motor coupled to the shaft to rotatably drive the shaft. The auxiliary turbine drive is coupled to the shaft of the air-moving assembly to provide backup rotational energy to the shaft to facilitate continued rotation of the shaft during interruption in power to the motor. In one implementation, the auxiliary turbine drive is configured to facilitate, for a specified time period, continued rotation of the shaft at a specified percentage, or greater, rotational speed of the shaft compared with a shaft speed when rotatably driven by the motor.

    Abstract translation: 提供了用于促进例如数据中心内的一个或多个电子机架的空气冷却的装置和方法。 该装置包括空气移动组件和辅助涡轮驱动装置。 空气移动组件包括轴，一个或多个机械风扇，其耦合到所述轴以至少部分地与所述轴一起旋转;以及电动机，其联接到所述轴以可旋转地驱动所述轴。 辅助涡轮机驱动器联接到空气移动组件的轴，以向轴提供备用旋转能量，以便于在电动机断电期间轴的继续旋转。 在一个实施方案中，辅助涡轮机驱动器构造成在规定的时间段内促进轴以与由马达旋转驱动的轴速度相比在轴的特定百分比或更大的转速下继续旋转轴。

    Controlled cooling of an electronic system for reduced energy consumption
    118.
    发明授权
    Controlled cooling of an electronic system for reduced energy consumption 有权
    控制冷却电子系统以降低能耗

    公开(公告)号：US09410751B2

    公开(公告)日：2016-08-09

    申请号：US13775529

    申请日：2013-02-25

    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

    Inventor： Milnes P. David ,  Madhusudan K. Iyengar ,  Roger R. Schmidt

    IPC: F28F27/00 ,  H05K7/20 ,  G05B15/02

    CPC classification number: F28F27/00 ,  G05B15/02 ,  G05B2219/2614 ,  H05K7/20836

    Abstract: Energy efficient control of a cooling system cooling an electronic system is provided. The control includes automatically determining at least one adjusted control setting for at least one adjustable cooling component of a cooling system cooling the electronic system. The automatically determining is based, at least in part, on power being consumed by the cooling system and temperature of a heat sink to which heat extracted by the cooling system is rejected. The automatically determining operates to reduce power consumption of the cooling system and/or the electronic system while ensuring that at least one targeted temperature associated with the cooling system or the electronic system is within a desired range. The automatically determining may be based, at least in part, on one or more experimentally obtained models relating the targeted temperature and power consumption of the one or more adjustable cooling components of the cooling system.

    Abstract translation: 提供了冷却电子系统的冷却系统的能量效率控制。 该控制包括自动确定冷却系统的冷却系统的至少一个可调冷却部件的至少一个经调节的控制设置。 该自动确定至少部分地基于由冷却系统消耗的功率和由冷却系统提取的热量被拒绝的散热器的温度。 自动确定用于降低冷却系统和/或电子系统的功率消耗，同时确保与冷却系统或电子系统相关联的至少一个目标温度在期望的范围内。 至少部分地，自动确定可以基于与冷却系统的一个或多个可调冷却部件的目标温度和功率消耗相关联的一个或多个实验获得的模型。

    Cooling method with automated seasonal freeze protection
    119.
    发明授权
    Cooling method with automated seasonal freeze protection 有权
    具有自动季节性防冻保护的冷却方式

    公开(公告)号：US09357682B2

    公开(公告)日：2016-05-31

    申请号：US13758143

    申请日：2013-02-04

    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

    Inventor： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons ,  Prabjit Singh ,  Jing Zhang

    IPC: F28F13/00 ,  H05K7/20

    CPC classification number: H05K7/20836 ,  F28F2265/14

    Abstract: An automated multi-fluid cooling method is provided for cooling an electronic component(s). The method includes obtaining a coolant loop, and providing a coolant tank, multiple valves, and a controller. The coolant loop is at least partially exposed to outdoor ambient air temperature(s) during normal operation, and the coolant tank includes first and second reservoirs containing first and second fluids, respectively. The first fluid freezes at a lower temperature than the second, the second fluid has superior cooling properties compared with the first, and the two fluids are soluble. The multiple valves are controllable to selectively couple the first or second fluid into the coolant in the coolant loop, wherein the coolant includes at least the second fluid. The controller automatically controls the valves to vary first fluid concentration level in the coolant loop based on historical, current, or anticipated outdoor air ambient temperature(s) for a time of year.

    Abstract translation: 提供了用于冷却电子部件的自动多流体冷却方法。 该方法包括获得冷却剂回路，以及提供冷却剂箱，多个阀和控制器。 在正常操作期间，冷却剂回路至少部分地暴露于室外环境空气温度，并且冷却剂箱分别包括容纳第一和第二流体的第一和第二储存器。 第一流体在比第二流体低的温度下冻结，第二流体与第一流体相比具有优异的冷却性能，并且两种流体是可溶的。 多个阀是可控制的，以选择性地将第一或第二流体耦合到冷却剂回路中的冷却剂中，其中冷却剂至少包括第二流体。 控制器根据一年中的历史，当前或预期的室外空气环境温度，自动控制阀门改变冷却剂回路中的第一个液体浓度水平。

    Liquid-cooling apparatus with integrated coolant filter
    120.
    发明授权
    Liquid-cooling apparatus with integrated coolant filter 有权
    集成冷却液过滤器的液冷装置

    公开(公告)号：US09357674B2

    公开(公告)日：2016-05-31

    申请号：US14132230

    申请日：2013-12-18

    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

    Inventor： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    IPC: H05K7/20

    CPC classification number: H05K7/20218 ,  H05K7/2039 ,  H05K7/20772 ,  Y10T29/4935

    Abstract: Cooling apparatuses, cooled electronic modules, and methods of fabrication are provided which facilitate heat transfer from an electronic component(s). The cooling apparatus includes a liquid-cooled heat sink with a thermally conductive structure having a coolant-carrying compartment including a region of reduced cross-sectional coolant flow area. The heat sink includes a coolant inlet and outlet in fluid communication with the compartment, and the region of reduced cross-sectional coolant flow area provides an increased effective heat transfer coefficient between a main heat transfer surface of the conductive structure and the coolant. The cooling apparatus further includes a coolant loop coupled to the coolant inlet and outlet to facilitate flow of coolant through the coolant-carrying compartment, and a coolant filter positioned to filter contaminants from the coolant passing through the heat sink. The coolant filter has a larger cross-sectional coolant flow area than the region of reduced cross-sectional coolant flow area.

    Abstract translation: 提供冷却装置，冷却的电子模块和制造方法，其促进从电子部件的热传递。 冷却装置包括具有导热结构的液冷式散热器，该导热结构具有包括减小横截面冷却剂流动面积的区域的冷却剂输送室。 散热器包括与隔室流体连通的冷却剂入口和出口，并且减小的横截面冷却剂流动区域的区域提供了导电结构的主传热表面与冷却剂之间增加的有效传热系数。 冷却装置还包括联接到冷却剂入口和出口的冷却剂回路，以便于冷却剂流过冷却剂携带室，以及冷却剂过滤器，其被定位成过滤来自穿过散热器的冷却剂的污染物。 冷却剂过滤器具有比截面冷却剂流动面积减小的区域更大的横截面冷却剂流动面积。

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