公开(公告)号：US06241578B1

公开(公告)日：2001-06-05

申请号：US09357843

申请日：1999-07-21

申请人： Tetsuji Togawa ,  Nobuyuki Takada

发明人： Tetsuji Togawa ,  Nobuyuki Takada

IPC分类号： B24B900

CPC分类号： B24D15/02 ,  B24B37/013 ,  B24B41/061 ,  B24B49/16

摘要： A carrier device is adapted for use in a polishing apparatus with a turntable having a polishing surface. The carrier device includes a carrier for carrying an article to be polished and a control device operatively associated with the carrier. The control device includes an actuator operable to cause the carrier to urge the article against the polishing surace of the turntable to polish the article, a sensor operatively associated with the actuator and operable to sense a pressure as applied to the article when the article is urged against the polishing surface of the turntable and a control unit operatively associated with the actuator and the sensor so as to monitor the pressure during a polishing operation. The control unit is operable to control operation of the actuator in response to the pressure as monitored so as to keep the pressure at a target level and halt the polishing operation when the pressure is deviated from a predetermined range over a predetermined period of time.

摘要翻译： 载体装置适用于具有抛光表面的转台的抛光装置。 载体装置包括用于承载待抛光制品的载体和与载体可操作地相关联的控制装置。 所述控制装置包括致动器，所述致动器可操作以使所述载体将所述物品推向所述转盘的抛光轮廓以抛光所述物品，所述传感器与所述致动器可操作地相关联并且可操作以感测当所述物品被推动时施加到所述物品上的压力 抵靠转盘的抛光表面和与致动器和传感器可操作地相关联的控制单元，以便在抛光操作期间监测压力。 控制单元可操作以响应于所监视的压力来控制致动器的操作，以便当压力在预定时间段内偏离预定范围时将压力保持在目标水平并停止抛光操作。

公开(公告)号：US6116986A

公开(公告)日：2000-09-12

申请号：US969738

申请日：1997-11-13

申请人： Tetsuji Togawa ,  Kuniaki Yamaguchi

发明人： Tetsuji Togawa ,  Kuniaki Yamaguchi

IPC分类号： B24B37/04 ,  B24B57/00 ,  H01L21/00 ,  B24B1/00

CPC分类号： H01L21/67057 ,  B24B37/04 ,  B24B57/02

摘要： A polishing plant includes a polishing apparatus having a top ring for holding a workpiece and a turn table for polishing a surface of the workpiece held by the top ring. A cleaning apparatus has cleaning machines for cleaning the workpiece polished by the polishing apparatus. At least one drainage pipe connected to the polishing apparatus discharges a waste liquid from the polishing apparatus, and at least one drainage pipe connected to the cleaning apparatus to discharges a waste liquid from the cleaning apparatus are provided as separate plural of drainage pipe lines, depending on the type of waste liquid. By use of the polishing plant of the present invention, treatment waste liquids can be efficiently conducted.

摘要翻译： 抛光装置包括具有用于保持工件的顶环的抛光装置和用于抛光由顶环保持的工件的表面的转台。 清洁装置具有清洁由抛光装置抛光的工件的清洁机。 连接到抛光装置的至少一个排水管从抛光装置排出废液，并且连接到清洁装置以从清洁装置排出废液的至少一个排放管被设置为分开的多个排水管道，依赖于 关于废液的类型。 通过使用本发明的抛光装置，可以有效地进行处理废液。

公开(公告)号：US6050884A

公开(公告)日：2000-04-18

申请号：US807810

申请日：1997-02-26

申请人： Tetsuji Togawa ,  Kuniaki Yamaguchi ,  Shunichiro Kojima ,  Toyomi Nishi

发明人： Tetsuji Togawa ,  Kuniaki Yamaguchi ,  Shunichiro Kojima ,  Toyomi Nishi

IPC分类号： B08B3/02 ,  B24B37/34 ,  B24B41/00 ,  H01L21/00 ,  B24B7/22

CPC分类号： B24B37/345 ,  B08B3/02 ,  B24B41/005 ,  H01L21/67051

摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a turntable having a polishing surface thereon, and a top ring for holding a workpiece to be polished and pressing the workpiece against the polishing surface on the turntable. A pusher is disposed in a position for transferring the workpiece to and from the top ring, and has a workpiece support which can be lifted to a position close to the top ring for transferring the workpiece to and from the top ring. When the workpiece support receives a polished workpiece and is lowered, a cleaning liquid is ejected substantially simultaneously from three cleaning nozzle units that are disposed in respective three positions to clean the upper and lower surfaces of the workpiece and the lower surface of the top ring.

摘要翻译： 抛光装置用于将诸如半导体晶片的工件抛光到平面镜面。 抛光装置包括其上具有抛光表面的转台和用于保持要抛光的工件的顶环，并将工件压靠在转台上的抛光表面上。 推动器设置在用于将工件传递到顶环的位置并且具有可以被提升到靠近顶环的位置的工件支撑件，用于将工件传送到顶环和从顶环移出。 当工件支撑件接收到抛光的工件并且被降低时，基本上同时从设置在三个位置的清洁喷嘴单元喷射清洁液体，以清洁工件的上表面和下表面以及顶环的下表面。

公开(公告)号：US6042455A

公开(公告)日：2000-03-28

申请号：US208987

申请日：1998-12-11

申请人： Tetsuji Togawa ,  Kuniaki Yamaguchi ,  Nobuyuki Takada

发明人： Tetsuji Togawa ,  Kuniaki Yamaguchi ,  Nobuyuki Takada

IPC分类号： B24B37/34 ,  B24B53/007 ,  B24B53/017 ,  B24B55/06 ,  B24B55/12 ,  H01L21/00 ,  B24B49/00

CPC分类号： H01L21/67219 ,  B24B37/345 ,  B24B53/017 ,  B24B55/06 ,  B24B55/12

摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes an enclosing structure having an outer wall and at least one door, a polishing section enclosed by the enclosing structure for polishing a surface of a workpiece by holding the workpiece and pressing the workpiece against a polishing surface of a turntable, a sensor for detecting an opening or closing of the door, and an exhaust system for exhausting ambient air from an interior of the enclosing structure. The polishing apparatus further includes an adjusting mechanism for adjusting an amount of air which is exhausted from the interior of the enclosing structure. The amount of air exhausted from the interior of the enclosing structure is reduced by the adjusting mechanism when the door is closed, and the amount of air exhausted from the interior of the enclosing structure is increased by the adjusting mechanism when the door is opened.

摘要翻译： 抛光装置用于将诸如半导体晶片的工件抛光到平面镜面。 抛光装置包括具有外壁和至少一个门的封闭结构，由封闭结构封闭的抛光部分，用于通过保持工件并将工件压靠在转台的抛光表面上来抛光工件的表面，传感器 用于检测门的打开或关闭;以及用于从封闭结构的内部排出环境空气的排气系统。 抛光装置还包括调节机构，用于调节从封闭结构内部排出的空气量。 当门关闭时，通过调节机构减少从封闭结构内部排出的空气量，并且当门打开时通过调节机构从封闭结构的内部排出的空气量增加。

公开(公告)号：US5961380A

公开(公告)日：1999-10-05

申请号：US12826

申请日：1998-01-23

申请人： Tetsuji Togawa ,  Kuniaki Yamaguchi ,  Kunihiko Sakurai

发明人： Tetsuji Togawa ,  Kuniaki Yamaguchi ,  Kunihiko Sakurai

IPC分类号： B65G49/07 ,  H01L21/677 ,  H01L21/687 ,  B24B47/02

CPC分类号： H01L21/67766 ,  H01L21/68707 ,  Y10S451/914

摘要： A robotic transport apparatus is capable of providing an effective waterproofing function of working components without using mechanical seals. The robotic transport apparatus includes a robot body, an arm assembly extendably attached to the robot body, and a workpiece holding section attached to the arm assembly. A pan member for waterproofing of the robot body is provided between the workpiece holding section and the robot body and has an area not smaller than the workpiece holding section.

摘要翻译： 机器人运输装置能够在不使用机械密封的情况下提供工作部件的有效防水功能。 机器人运输装置包括机器人主体，可伸缩地附接到机器人主体的臂组件和附接到臂组件的工件保持部。 在工件保持部和机器人体之间设置用于机器人主体防水的盘构件，并且具有不小于工件保持部的面积。

公开(公告)号：US5944941A

公开(公告)日：1999-08-31

申请号：US947856

申请日：1997-10-09

申请人： Tetsuji Togawa ,  Kuniaki Yamaguchi

发明人： Tetsuji Togawa ,  Kuniaki Yamaguchi

IPC分类号： B08B17/00 ,  H01L21/00

CPC分类号： H01L21/67023 ,  B08B17/00

摘要： The present invention provides a dry/wet work turning-over machine which can be used with both a dry hand and a wet hand and in which, even when the dry hand having a vacuum suction mechanism is inserted into a water-proof cover surrounding a work turning-over device, liquid is not adhered to the hand. In the dry/wet work turning-over machine, the work turning-over device is surrounded by the water-proof cover. An opening is formed in the water-proof cover at an upper surface of a front side thereof and a front part of an upper surface thereof. A screen for closing the opening is attached to the opening. The screen is rotated in a downward direction by a rotation driving mechanism.

摘要翻译： 本发明提供一种能够与干手和湿手一起使用的干湿式车间翻转机，即使将具有真空吸引机构的干手插入到围绕 工作翻转装置，液体不粘在手上。 在干/湿式翻转机中，工作翻转装置被防水罩包围。 在防水罩的前表面的上表面和其上表面的前部形成开口。 用于关闭开口的屏幕附接到开口。 屏幕通过旋转驱动机构沿向下的方向旋转。

公开(公告)号：US5643067A

公开(公告)日：1997-07-01

申请号：US571598

申请日：1995-12-13

申请人： Seiji Katsuoka ,  Kunihiko Sakurai ,  Tetsuji Togawa

发明人： Seiji Katsuoka ,  Kunihiko Sakurai ,  Tetsuji Togawa

IPC分类号： B24B53/00 ,  B24B53/007 ,  B24B53/017 ,  B24B21/18 ,  B24B33/00 ,  B24B47/26 ,  B24B55/00

CPC分类号： B24B53/017 ,  B24B53/00

摘要： A dressing apparatus is used to resurface a polishing surface of a polish cloth used to polish semiconductor wafers. A dressing brush which spins on its own axis is also coupled to a drive shaft of a main drive of the dressing apparatus through a planetary gear mechanism so that the brush will rotate or orbit about the drive shaft. Therefore, the dressing brush traces a complex path and its dressing action is spread over a wide surface area of the polishing cloth to produce thorough resurfacing of the polishing surface. The service life of the cloth is significantly increased and contributes to improving the overall efficiency of preparing high quality polished semiconductor wafers. For economy, the dressing apparatus can be mounted easily on a conventional polishing apparatus having a dressing facility.

摘要翻译： 修整装置用于重新表面抛光用于抛光半导体晶片的抛光布的抛光表面。 在其自身的轴线上旋转的修整刷也通过行星齿轮机构联接到修整设备的主驱动器的驱动轴，使得电刷将围绕驱动轴旋转或轨道。 因此，修整刷跟踪复杂的路径，并且其修整作用分布在抛光布的宽表面区域上，以产生抛光表面的彻底表面。 布的使用寿命显着增加，有助于提高制备高质量抛光半导体晶片的整体效率。 为了经济，敷料装置可以容易地安装在具有修整设备的常规抛光装置上。

公开(公告)号：US08870625B2

公开(公告)日：2014-10-28

申请号：US12292685

申请日：2008-11-24

申请人： Tetsuji Togawa ,  Keisuke Namiki ,  Satoru Yamaki

发明人： Tetsuji Togawa ,  Keisuke Namiki ,  Satoru Yamaki

IPC分类号： B24B49/00 ,  B24B53/02 ,  B24B37/013 ,  B24B49/10 ,  B24B53/017 ,  B24B49/16

CPC分类号： B24B53/017 ,  B24B37/013 ,  B24B49/10 ,  B24B49/16

摘要： A dressing method is used to dress a polishing pad of a polishing apparatus for polishing a substrate. This method includes repetitively moving the dresser on an upper surface of the polishing pad in a radial direction of the polishing pad so as to perform a dressing process on the polishing pad, during the dressing process, measuring a height of an upper surface of the polishing pad at a predetermined point in one of plural zones on the polishing surface, and repeating the repetitive moving of the dresser and the measuring of the height of the upper surface of the polishing pad so as to measure the height of the upper surface of the polishing pad in all of the plural zones.

摘要翻译： 使用修整方法来打磨抛光装置的抛光垫以抛光基底。 该方法包括在抛光垫的径向上重复地将修整器沿抛光垫的径向重复地移动到抛光垫的上表面上，以便在修整过程中对抛光垫进行修整处理，测量抛光上表面的高度 在抛光表面上的多个区域中的一个区域中的预定点处的垫，并且重复修整器的重复移动和测量抛光垫的上表面的高度，以便测量抛光上表面的高度 在所有多个区域中的垫。

公开(公告)号：US08445360B2

公开(公告)日：2013-05-21

申请号：US13027551

申请日：2011-02-15

申请人： Masayuki Nakanishi ,  Tetsuji Togawa ,  Kenya Ito ,  Masaya Seki ,  Kenji Iwade ,  Takeo Kubota

发明人： Masayuki Nakanishi ,  Tetsuji Togawa ,  Kenya Ito ,  Masaya Seki ,  Kenji Iwade ,  Takeo Kubota

IPC分类号： H01L21/46 ,  H01L21/30 ,  H01L21/78 ,  H01L21/301

CPC分类号： H01L21/02038 ,  B24B9/065 ,  B24B21/002 ,  B24B37/042 ,  H01L21/02087 ,  H01L21/304 ,  H01L21/76256

摘要： A method for manufacturing a semiconductor device makes it possible to efficiently polish with a polishing tape a peripheral portion of a silicon substrate under polishing conditions particularly suited for a deposited film and for silicon underlying the deposited film. The method includes pressing a first polishing tape against a peripheral portion of a device substrate having a deposited film on a silicon surface while rotating the device substrate at a first rotational speed, thereby removing the deposited film lying in the peripheral portion of the device substrate and exposing the underlying silicon. A second polishing tape is pressed against the exposed silicon lying in the peripheral portion of the device substrate while rotating the device substrate at a second rotational speed, thereby polishing the silicon to a predetermined depth.

摘要翻译： 一种制造半导体器件的方法使得可以在抛光条件下，在特别适用于沉积膜的抛光条件和沉积膜下面的硅的抛光条件下，用研磨带有效地抛光硅衬底的周边部分。 该方法包括在第一旋转速度旋转器件基板的同时将第一研磨带压靠在具有沉积膜的器件基板的周边部分上，同时以第一转速旋转器件基板，从而去除位于器件基板的周边部分中的沉积膜， 暴露下面的硅。 在第二旋转速度旋转器件基板的同时，将第二研磨带压在位于器件基板的周边部分中的暴露的硅上，从而将硅抛光到预定的深度。

公开(公告)号：US08357029B2

公开(公告)日：2013-01-22

申请号：US12747225

申请日：2009-02-09

申请人： Makoto Fukushima ,  Tetsuji Togawa ,  Hozumi Yasuda ,  Koji Saito ,  Osamu Nabeya ,  Tomoshi Inoue

发明人： Makoto Fukushima ,  Tetsuji Togawa ,  Hozumi Yasuda ,  Koji Saito ,  Osamu Nabeya ,  Tomoshi Inoue

IPC分类号： B24B5/00

CPC分类号： B24B37/30

摘要： A polishing apparatus is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing table (100) having a polishing surface (101a), a top ring body (2) configured to hold and press a substrate against the polishing surface (101a), and a retainer ring (3) provided at an outer peripheral portion of the top ring body (2) and configured to press the polishing surface (101a). A fulcrum for receiving a lateral force applied from the substrate to the retainer ring (3) during polishing of the substrate is located above a central portion of the substrate.

摘要翻译： 抛光装置用于将半导体晶片等基板研磨成平面镜面。 抛光装置包括具有抛光面（101a）的抛光台（100），被配置为将基板保持并压靠在抛光表面（101a）上的顶环体（2），以及设置在抛光表面 所述顶环体（2）的外周部分构造成按压所述抛光表面（101a）。 用于在衬底抛光期间接收从衬底施加到保持环（3）的侧向力的支点位于衬底的中心部分的上方。