Abstract:
An exemplary printed circuit board includes a power plane, and a ground plane. The power plane includes two power modules, and a strip made of insulating medium disposed between the two power modules for insulating the two power modules from each other. The ground plane is insulated from the power plane, a plurality of vias electrically connects the power plane and the ground plane, and is close to the strip. Each via is insulated from the power module by an annular insulating medium. Each power module and the vias forms an equivalent coupling capacitance, and SSN can be conducted to the ground plane via the equivalent coupling capacitance, therefore, the SSN in the PCB is suppressed.
Abstract:
A system for checking a reference plane of a signal trace in a PCB includes: a database, a signal filter, a signal trace selecting unit, a reference plane checking unit and a display unit. The database is configured for storing a plurality of signal files. The signal file in the PCB constitutes one or more signal groups. Each signal group has a same bus. The signal filter is configured for filtering a signal group from a signal file. The signal trace selecting unit is configured for selecting a signal for checking, from the signal group, and for selecting a trace corresponding to the signal. The reference plane checking unit is configured for checking the integrity of a reference plane that is nearest to the selected signal trace through orthographically projecting the selected signal trace to the reference plane and for checking a relationship between the reference plane and the projection. A related method is also disclosed.
Abstract:
An exemplary printed circuit board includes at least a pair of differential vias defined therein, each of the differential vias has an annular ring formed on the PCB, a conductive hole defined in the PCB, and a clearance hole defined in at least one inner layer of the PCB. Each of the clearance holes of the differential vias is oval shaped thus providing a greater area for the clearance holes and needed clearance between vias without creating a superposition zone.
Abstract:
A method for analyzing response values sum of differential signals includes: receiving configurations of simulation parameters; simulating differential signal paths with an analog transmission channel according to a design file; analyzing the analog transmission channel into different channel modes according to received configurations; simulating a plurality of pulse signals into the analog transmission channel according to the received configurations, and recording an impulse response of each of the channel modes; simulating differential signal transmissions of the differential signals according to the received configurations, and analyzing the differential signal transmissions into different signal modes corresponding to the different channel modes; transforming each signal mode and the impulse response of a corresponding channel mode to respectively generate a first value and a second value by utilizing Fast Fourier Transform Algorithm; multiplying the first value by the second value to generate a third value, and transforming the third value to a fourth value by utilizing an Inverse Fast Fourier Transform Algorithm; and summing all the fourth values corresponding to all of the channel modes to be the response values sum of the differential signals. A related system is also disclosed.
Abstract:
A method for calculating a voltage spike value includes: predefining calculating requirements; inputting parameter values; analyzing whether inputted parameter values match with the calculating requirements; establishing a computing formula for calculating the voltage spike value if the inputted parameter values match with the calculating requirements; and calculating the voltage spike value by utilizing the inputted parameter values and the computing formula. A related system is also disclosed.
Abstract:
A signal transmitting circuit includes a driving circuit, and a plurality of receiving circuits receiving signals transmitted from the driving circuit. Each of the receiving circuits is coupled to the driving circuit consecutively via a transmission line. A filter means is coupled with a segment of the transmission line of two neighboring receiving circuits for filtering signal reflections from the receiving circuits.
Abstract:
A device and a method for testing signal-receiving sensitivity of an electronic subassembly are provided. The device includes a control board and a computer. The control board is connected to the electronic subassembly. The computer is connected to the control board and also connected to the electronic subassembly. Wherein signals sent by the computer are compared with signals received by the computer for adjusting predetermined parameters associated with the signal-receiving sensitivity.
Abstract:
In a method for checking layout of a printed circuit board (PCB) using an electronic device, a signal line is selected from a layout diagram of the PCB. The method searches for signal lines which have an acute angle when deviating from a straight line in the layout diagram of the PCB. The method further locates attribute data of the searched signal lines in the layout diagram of the PCB, and displays the attribute data of the searched signal lines on a display device of the electronic device.
Abstract:
A printed circuit board (PCB) includes a top signal layer, a bottom signal layer, a ground layer, a plurality of vias, and at least two ground vias. Both the top signal layer and the bottom signal layer include at least one protection line. The ground layer is located between the top signal layer and the bottom signal layer. The at least two ground vias extend through the PCB and are located adjacent to the vias on the PCB. The at least two ground vias are electrically connected to the ground layer to conduct noise signals, and the at least two ground vias are electrically connected by the protection lines to insulate noise signals.
Abstract:
A circuit board includes a substrate and a copper layer positioned on the substrate. The copper layer includes a BGA area and a non-BGA area, and includes traces. The widths of the traces in the BGA area are smaller than the widths of the traces in the non-BGA area, the dielectric coefficient of the substrate in the BGA area is greater than the dielectric coefficient of the substrate in the non-BGA area for keeping the impedance of the traces consistent in the BGA area and in the non-BGA area.