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    Apparatus using electrochemical discharge machining process and method using the same
    123.
    发明授权
    Apparatus using electrochemical discharge machining process and method using the same 有权

    公开(公告)号：US09981401B2

    公开(公告)日：2018-05-29

    申请号：US14872351

    申请日：2015-10-01

    申请人： Foundation of Soongsil University-Industry Cooperation

    发明人： Bohyun Kim

    IPC分类号： B23H5/02 ,  B23H5/00 ,  B23H7/28 ,  B26F1/28

    CPC分类号： B26F1/28 ,  B23H5/00 ,  B23H5/02 ,  B23H7/28

    摘要： An apparatus for an electrochemical discharge machining process is provided. The apparatus includes a holder housing having, an inlet hole, an outlet hole, a first side, and a second side, and containing an electrolyte, a tool holder disposed at the first side, and a first electrode having a first end and a second end. The holder housing is configured to sealingly accommodate the electrolyte unless at least one of the inlet hole and the outlet hole is open. The first end is coupled to the tool holder and the second end passes through the second side. Since the apparatus is moved to a machining position of the work-piece by a worker, additional power for controlling the position thereof is not necessary. In addition, the apparatus is easy to carry and use because of its simple structure.

    THROUGH-HOLE FORMING METHOD, THROUGH-HOLE FORMING APPARATUS, AND METHOD OF MANUFACTURING GLASS SUBSTRATE PROVIDED WITH THROUGH-HOLE
    124.
    发明申请
    THROUGH-HOLE FORMING METHOD, THROUGH-HOLE FORMING APPARATUS, AND METHOD OF MANUFACTURING GLASS SUBSTRATE PROVIDED WITH THROUGH-HOLE 审中-公开
    通孔形成方法，通孔形成装置以及制造具有孔的玻璃基底的方法

    公开(公告)号：US20160168006A1

    公开(公告)日：2016-06-16

    申请号：US14965111

    申请日：2015-12-10

    申请人： Asahi Glass Company, Limited

    发明人： Motoshi ONO

    IPC分类号： C03B33/10 ,  B23K9/013 ,  C03C23/00

    CPC分类号： B23K9/013 ,  B23K26/382 ,  B23K26/384 ,  B23K2103/50 ,  B23K2103/54 ,  B26F1/28

    摘要： Disclosed is a through-hole forming method including a process of forming, by condensing and irradiating a laser beam onto an insulation substrate through a lens, a through-hole that passes through the insulation substrate in a thickness direction of the insulation substrate. A medium between the lens and the insulation substrate is air. A converging half angle θ that is calculated from a focal length f of the lens and a beam diameter d of the laser beam that enters the lens by using expression (1) satisfies expression (2): (d/2)/f=tan θ . . .   (1), and 0.16≦sin θ≦0.22 . . .   (2).

    摘要翻译： 公开了一种通孔形成方法，其包括通过透镜通过透镜将激光束聚光并照射到绝缘基板上而形成通过绝缘基板沿着绝缘基板的厚度方向的通孔的工序。 透镜和绝缘基板之间的介质是空气。 会聚半角＆thetas; 通过使用式（1）从透镜的焦距f和入射到透镜的激光束的光束直径d算出，满足式（2）：（d / 2）/ f = tan＆amp; 。 。 。 （1），和0.16＆nlE; sin＆thetas;＆nlE; 0.22。 。 。 （2）。

    METHOD OF MANUFACTURING GLASS SUBSTRATE, AND GLASS SUBSTRATE
    126.
    发明申请
    METHOD OF MANUFACTURING GLASS SUBSTRATE, AND GLASS SUBSTRATE 审中-公开
    制造玻璃基板和玻璃基板的方法

    公开(公告)号：US20140363626A1

    公开(公告)日：2014-12-11

    申请号：US14465675

    申请日：2014-08-21

    申请人： ASAHI GLASS COMPANY, LIMITED

    发明人： Shintaro TAKAHASHI ,  Leander Dittmann ,  Adrien Chaize

    IPC分类号： C03B33/08

    CPC分类号： C03B33/08 ,  B26F1/28 ,  B26F1/31 ,  B28D1/221 ,  C03B23/02 ,  Y10T428/24314

    摘要： A method of manufacturing a glass substrate having a through hole, includes preparing a glass substrate having an average coefficient of thermal expansion in a range of 55×0−7/K to 120×10−7/K at 50° C. to 300° C., and a thickness of 0.2 mm or greater and 1 mm or less, and forming the through hole in the glass substrate using a laser-guided discharge technique.

    摘要翻译： 一种具有通孔的玻璃基板的制造方法，其特征在于，将平均热膨胀系数为55×0-7 / K〜120×10-7 / K的玻璃基板在50℃〜300℃ ℃，厚度为0.2mm以上且1mm以下，并且使用激光引导放电技术在玻璃基板中形成通孔。

    Manufacturing and use of microperforated substrates
    127.
    发明授权
    Manufacturing and use of microperforated substrates 有权
    微孔基材的制造和使用

    公开(公告)号：US08759707B2

    公开(公告)日：2014-06-24

    申请号：US10594991

    申请日：2005-03-30

    申请人： Christian Schmidt

    发明人： Christian Schmidt

    IPC分类号： B23H1/02

    CPC分类号： B26D7/10 ,  B26F1/28

    摘要： This invention relates to methods and devices for the production of micro-structured substrates and their application in natural sciences and technology, in particular in analysis and detection systems based on artificial and biological lipid membranes. The structure is preferably a hole or a cavity or channel and is obtained by spark perforation. Energy, preferably heat, is applied to the region to be structured so as to reduce the amplitude of voltage required and/or soften the material. The electrical parameters of the spark perforation are feedback-controlled.

    摘要翻译： 本发明涉及用于生产微结构底物的方法和装置及其在自然科学和技术中的应用，特别是在基于人造和生物脂质膜的分析和检测系统中。 该结构优选是孔或空腔或通道，并且通过火花穿孔获得。 能量，优选热量被施加到待构造的区域，以便减小所需的电压的幅度和/或软化材料。 火花穿孔的电气参数是反馈控制的。

    METHOD FOR PRODUCING PERFORATED WORKPIECES IN A STRESS-RELIEVING MANNER
    128.
    发明申请
    METHOD FOR PRODUCING PERFORATED WORKPIECES IN A STRESS-RELIEVING MANNER 审中-公开
    在应力消除器中生产执行工件的方法

    公开(公告)号：US20130340480A1

    公开(公告)日：2013-12-26

    申请号：US13807411

    申请日：2011-06-04

    申请人： Kurt Nattermann ,  Ulrich Peuchert

    发明人： Kurt Nattermann ,  Ulrich Peuchert

    IPC分类号： C03B21/06

    CPC分类号： C03B21/06 ,  B26F1/28 ,  C03B21/04 ,  C03B25/025

    摘要： A method for producing perforated work pieces from glass, glass ceramics, or semiconductors in a stress-relieving manner is provided. The method includes heating the work piece up to the glass transition temperature and perforating the work piece using a high-voltage electric field of suitable frequency or pulse shape. Then, the perforated work piece is allowed to cool down from the transition temperature range to room temperature at a rate at which the mechanical stresses generated by the perforation process relax.

    摘要翻译： 提供了一种从玻璃，玻璃陶瓷或半导体中产生应力消除方式的多孔工件的制造方法。 该方法包括将工件加热至玻璃化转变温度，并使用合适频率或脉冲形状的高压电场对工件进行穿孔。 然后，将穿孔工件从穿过过程产生的机械应力放松的速度从过渡温度范围冷却至室温。

    Method for manufacturing a wire and a wire
    130.
    发明申请
    Method for manufacturing a wire and a wire 审中-公开
    线和线的制造方法

    公开(公告)号：US20060096961A1

    公开(公告)日：2006-05-11

    申请号：US10513401

    申请日：2003-05-14

    申请人： Martti Kahkonen ,  Timo Sirvio ,  Arja Keikanen ,  Juha Vainikainen

    发明人： Martti Kahkonen ,  Timo Sirvio ,  Arja Keikanen ,  Juha Vainikainen

    IPC分类号： B23K26/38

    CPC分类号： B26F1/26 ,  B21F27/18 ,  B26F1/28 ,  B26F1/31 ,  D21F1/10

    摘要： The invention relates to a method for manufacturing a wire used in standard freeness measuring of paper stock and a wire according to the manufacturing method. In the solution, a means for producing holes (210), which is something else than a solid, is directed on a wire plate (18) at areas intended for desired holes (210). The wire plate (18) is provided with the holes using the means for producing holes (210).

    摘要翻译： 本发明涉及一种根据制造方法制造用于纸料和钢丝的标准游离度测量的丝的方法。 在该解决方案中，用于生产不同于固体的孔（210）的装置在用于所需孔（210）的区域处被引导到线板（18）上。 线板（18）使用用于制造孔（210）的装置设置有孔。