摘要:
An electromagnetic bandgap structure and a printed circuit board that can solve a mixed signal problem between an analog circuit and a digital circuit are disclosed. In accordance with an embodiment of the present invention, an electromagnetic bandgap structure is stacked with a first metal layer, a first dielectric layer, a metal plate, a second dielectric layer and a second metal layer, and an odd number of vias can be serially connected through a metal line between the first metal layer and the metal plate. This electromagnetic bandgap structure can have a small size and a low bandgap frequency.
摘要:
An electromagnetic bandgap structure and a printed circuit board are disclosed. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure includes a mushroom type structure comprising a first metal plate and a via of which one end is connected to the first metal plate; a second metal plate connected to the other end of the via; a first metal layer being connected to the second metal layer through a metal line; a first dielectric layer, layer-built between the first metal layer and the first metal plate; a second dielectric layer, layer-built on the first metal plate and the first dielectric layer; and a second metal layer, layer-built on the second dielectric layer. With the present invention, it is possible to solve the aforementioned mixed signal problem by preventing the EM wave of a certain frequency range from being transferred.
摘要:
A memory test circuit comprises a memory which outputs stored data through n-bit data output pins, and a built-in self test (BIST) unit. The BIST unit writes test data in the memory, and by comparing the test data output from the memory with expected data, determines a failure cell address in the memory. The BIST unit generates k preliminary failure signals having failure information indicating whether the test data correspond with the expected data, and outputs the k preliminary failure signals for m cycles of a clock signal, by outputting k/m preliminary failure signals each cycle as first through k/m failure signals. In the memory test circuit and test system, the BIST unit testing a memory and generating a failure signal is disposed in a memory apparatus and a failure analysis circuit analyzing a failure signal output by the BIST unit is disposed in the test apparatus.
摘要翻译:存储器测试电路包括通过n位数据输出引脚输出存储的数据的存储器和内置的自检(BIST)单元。 BIST单元将测试数据写入存储器,并通过将存储器输出的测试数据与预期数据进行比较,确定存储器中的故障单元地址。 BIST单元生成具有指示测试数据是否与期望数据相对应的故障信息的k个初始故障信号,并且通过每个周期作为第一到第一通过输出k / m个初步故障信号来输出用于时钟信号的m个周期的k个初步故障信号 k / m故障信号。 在存储器测试电路和测试系统中,测试存储器并产生故障信号的BIST单元被布置在存储器装置中,并且分析由BIST单元输出的故障信号的故障分析电路设置在测试装置中。
摘要:
The mutual salt of raloxifene and bisphosphonic acid exhibits unexpectedly synergistic effects of two components to enhance bone mineral density (BMD), control blood-calcium density, and lower the serum cholesterol level.
摘要:
A printed circuit board (PCB) having a three-dimensional spiral inductor, which includes a plurality of insulating layers and conductor layers. The PCB comprises a plurality of coil conductor patterns made of conductive material and shaped into strips, which is provided on the plurality of conductor layers, respectively, such that the plurality of coil conductor patterns are parallel to each other and positioned on the same plane perpendicular to the conductor layers, and in which each of the plurality of coil conductor patterns is longer than an adjacent inner coil conductor pattern.
摘要:
A mobile communication terminal and method of inserting symbols thereof are disclosed, by which a convenient symbol input system is provided and by which a user is facilitated to input a symbol using a fingerprint pattern of the user. The present invention includes a fingerprint recognizer, a control unit searching a symbol matched to the recognized fingerprint pattern if a fingerprint pattern is recognized by the fingerprint recognizer, and an output unit outputting the searched symbol.
摘要:
The present invention relates to a capacitor-embedded PCB and a method of manufacturing the same. The capacitor-embedded PCB includes a dielectric layer, a lower electrode layer formed under the dielectric layer, and an upper electrode layer formed on the dielectric layer and configured to have at least one first blind via hole that is inwardly formed.