Abstract:
A semiconductor device having a core device with a high-k gate dielectric and an I/O device with a silicon dioxide or other non-high-k gate dielectric, and a method of fabricating such a device. A core well and an I/O well are created in a semiconductor substrate and separated by an isolation structure. An I/O device is formed over the I/O well and has a silicon dioxide or a low-k gate dielectric. A resistor may be formed on an isolation structure adjacent to the core well. A core-well device such as a transistor is formed over the core well, and has a high-k gate dielectric. In some embodiments, a p-type I/O well and an n-type I/O well are created. In a preferred embodiment, the I/O device or devices are formed prior to forming the core device and protected with a sacrificial layer until the core device is fabricated.
Abstract:
A photovoltaic device can include a second metal layer adjacent to a first layer, where the first layer is positioned adjacent to a substrate, and where the second metal layer includes a dopant; and a copper-indium-gallium diselenide (CIGS) layer adjacent to the second metal layer.
Abstract:
Embodiments described herein provide a method for polishing a substrate surface. The methods generally include storing processing components in multiple storage units during processing, and combining the processing components to create a slurry while flowing the processing components to a polishing pad. A substrate is polished using the slurry, and the thickness of a material layer disposed on the substrate is determined. The flow rate of one or more processing components is then adjusted to affect the rate of removal of the material layer disposed on the substrate.
Abstract:
A semiconductor device and method for fabricating a semiconductor device protecting a resistive structure in gate replacement processing is disclosed. The method comprises providing a semiconductor substrate; forming at least one gate structure including a dummy gate over the semiconductor substrate; forming at least one resistive structure including a gate over the semiconductor substrate; exposing a portion of the gate of the at least one resistive structure; forming an etch stop layer over the semiconductor substrate, including over the exposed portion of the gate; removing the dummy gate from the at least one gate structure to create an opening; and forming a metal gate in the opening of the at least one gate structure.
Abstract:
An electrical fuse and a method of forming the same are presented. A first-layer conductive line is formed over a base material. A via is formed over the first-layer conductive line. The via preferably comprises a barrier layer and a conductive material. A second-layer conductive line is formed over the via. A first external pad is formed coupling to the first-layer conductive line. A second external pad is formed coupling to the second-layer conductive line. The via, the first conductive line and the second conductive line are adapted to be an electrical fuse. The electrical fuse can be burned out by applying a current. The vertical structure of the preferred embodiment is suitable to be formed in any layer.
Abstract:
Techniques for reconstructing a target hierarchy tree structure from profiling data of a computer system according to a predefined relational model, so as to obtain profiling information of a certain selected node. The predefined relational model is defined in advance according to a hierarchy tree structure of the profiling data, and is stored in an external storage system. The hierarchy tree structures can be constructed dynamically as required, thus the occupied amount of a memory can be seduced and users can view the profiling data freely.
Abstract:
A method and system for correlating out interactions, which occur due to one or a set of specific events, of an application, which is deployed in multiple adjacent tiers in an actual environment is described. First, a simulation environment corresponding to the actual environment is created. Then, specific events are led to the actual environment and the simulation environment. A pattern(s) of interactions, which are related with the specific events, between adjacent tiers in the simulation environment and a large number of interactions between adjacent tiers in the actual environment are obtained. Afterwards, interactions, which are related with the specific events, between adjacent tiers among the obtained interactions between adjacent tiers in the actual environment are correlated using a template of the obtained pattern(s) of interactions, which are related with the specific events, between adjacent tiers in the simulation environment as a template.
Abstract:
A system, method and program enabling users to diagnose applications easily without affecting the operating performance of the application server, optimizing the log mechanism based on the integrated development environment. The method includes running the application in a main running environment and at least one shadow environment, the shadow environment obtained by duplicating the main running environment; and the main running environment interacting with the shadow environment with respect to the fault of the application. The method includes performing the steps of the main running environment: monitoring the exceptions in the system and sending system exception information to the shadow environment in the event of finding exceptions in the system. The shadow environment: receives the system exception information, opens diagnostic log/trace functions to obtain diagnosis log/trace files related to the system exceptions, and analyzes the diagnosis result based on the obtained diagnosis log/trace files.
Abstract:
A semiconductor device with improved source/drain junctions and methods for fabricating the device are disclosed. A preferred embodiment comprises a MOS transistor with a gate structure overlying a substrate, lightly doped source/drain regions formed in the substrate aligned to the gate structure, sidewall spacers formed on the sidewalls of the gate structure and overlying the lightly doped source/drain regions, deeper source/drain diffusions formed into the substrate aligned to the sidewall spacers and additional pocket implants of source/drain dopants formed at the boundary of the deeper source/drain diffusions and the substrate. In a preferred method, the additional pocket implants are formed using an angled ion implant with the angle being between 4 and 45 degrees from vertical. Additional embodiments include recesses formed in the source/drain regions and methods for forming the recesses.
Abstract:
A semiconductor device with a recessed L-shaped spacer and a method for fabricating the same. A recessed L-shaped spacer includes a vertical portion and a horizontal portion. The vertical portion is disposed on lower sidewalls of a conductor pattern, exposing upper sidewalls thereof. A top spacer is on the L-shaped spacer, wherein a width ratio of the vertical portion of the L-shaped spacer to the top spacer is at least about 2:1.