Abstract:
A nonvolatile memory device includes via holes (12) formed at cross sections where first wires (11) cross second wires (14), respectively, and current control elements (13) each including a current control layer (13b), a first electrode layer (13a) and a second electrode layer (13c) such that the current control layer (13b) is sandwiched between the first electrode layer (13a) and the second electrode layer (13c), in which resistance variable elements (15) are provided inside the via holes (12), respectively, the first electrode layer (13a) is disposed so as to cover the via hole (12), the current control layer (13b) is disposed so as to cover the first electrode layer (13a), the second electrode layer (13c) is disposed on the current control layer (13b), a wire layer (14a) of the second wire is disposed on the second electrode layer (13c), and the second wires (14) each includes the current control layer (13b), the second electrode layer (13c) and the wire layer (14a) of the second wire.
Abstract:
A method of programming a variable resistance element to be operated with stability and at a high speed is provided. The method programs a nonvolatile variable resistance element (10) including a variable resistance layer (3), which changes between a high resistance state and a low resistance state depending on a polarity of an applied electric pulse, and a lower electrode (2) and an upper electrode (4). The method includes: writing steps (S11) and (S15) to cause the variable resistance layer (3) to change from the low resistance state to the high resistance state by applying a write voltage pulse; and an erasing step (S13) to cause the variable resistance layer (3) to change from the high resistance state to the low resistance state. In the writing steps, a write voltage pulse is applied between the electrodes so as to satisfy |Vw1|>|Vw| where Vw1 represents a voltage value of the write voltage pulse in the first writing step (S11) after manufacturing the variable resistance element (10) and Vw represents a voltage value of the write voltage pulse in writing steps after the first writing step (S15) after manufacturing the variable resistance element (10).
Abstract:
An analyzing device includes a feeder connected to a container in which a sample is contained for sucking the sample from the container and feeding the sample, and a controller for performing control for feeding from the feeder to a measurer. In measuring the sample, the controller performs control so that results of a plurality of times of measurement are obtained with respect to the single container in which the sample is contained, without changing the container. This arrangement allows quick accuracy check.
Abstract:
Provided are a nonvolatile memory element which is capable of effectively preventing an event that when a failure occurs in a certain nonvolatile memory element, data cannot be written to and read from another nonvolatile memory element belonging to the same column or row as that to which the nonvolatile memory element in a failed state belongs, and a semiconductor memory device including the nonvolatile memory element.A nonvolatile memory element comprises a current controlling element (112) having a non-linear current-voltage characteristic, a resistance variable element (105) which changes reversibly between a low-resistance state and a high-resistance state in which a resistance value of the resistance variable element is higher than a resistance value of the resistance variable element in the low-resistance state, in response to voltage pulses applied, and a fuse (103), the current controlling element (112), the resistance variable element (105) and the fuse (103) being connected in series, and the fuse (103) being configured to be blown when the current controlling element (112) is substantially short-circuited.
Abstract:
Provided is a nonvolatile memory element which has a small variation in operation and allow stable operation. The nonvolatile memory element includes: a first electrode (102); a second electrode (106); a variable resistance layer (105) which is formed between the electrodes (102 and 106) and is connected to the electrodes (102 and 106), and which reversibly changes between a high resistance state and a low resistance state according to a polarity of a voltage applied between the electrodes (102 and 106); and a fixed resistance layer (104) which has a resistance value that is 0.1 and 10 times as large as a resistance value of the variable resistance layer in the high resistance state, the fixed resistance layer (104) being formed between the electrodes (102 and 106) and being electrically connected to at least a part of the variable resistance layer (105).
Abstract:
Applying a writing voltage pulse having a first polarity to a metal oxide layer (3) to change a resistance state of the metal oxide layer (3) from high to low so as to render the resistance state a write state, applying an erasing voltage pulse having a second polarity different from the first polarity to the metal oxide layer (3) to change the resistance state of the metal oxide layer (3) from low to high so as to render the resistance state an erase state, and applying an initial voltage pulse having the second polarity to the metal oxide layer (3) before the applying of a writing voltage pulse is performed for a first time, to change a resistance value of an initial state of the metal oxide layer (3) are included, and R0>RH>RL and |V0|>|Ve|≧|Vw| are satisfied where R0, RL, and RH are the resistance values of the initial, write, and erase states, respectively, of the metal oxide layer (3), and V0, Vw, and Ve are voltage values of the initial, writing, and erasing voltage pulses, respectively.
Abstract:
Provided is a nonvolatile memory element which is capable of performing a stable resistance change operation at a low breakdown voltage.A nonvolatile memory element (100) includes: a first electrode layer (103); a second electrode layer (105); and a variable resistance layer (104) which is placed between the electrodes (103 and 105), and whose resistance state reversibly changes between a high resistance state and a low resistance state based on a polarity of a voltage applied between the electrodes (103 and 105). The variable resistance layer (104) is formed by stacking a first oxide layer (104a) including an oxide of a first transition metal and a second oxide layer (104b) including an oxide of a second transition metal which is different from the first transition metal. At least one of the following conditions is satisfied: (1) a dielectric constant of the second oxide layer (104b) is larger than a dielectric constant of the first oxide layer (104a); and (2) a band gap of the second oxide layer (104b) is smaller than a band gap of the first oxide layer (104a).
Abstract:
A variable resistance nonvolatile storage device which includes (i) a semiconductor substrate (301), (ii) a variable resistance element (309) having: lower and upper electrodes (309a, 309c); and a variable resistance layer (309b) whose resistance value reversibly varies based on voltage signals each of which has a different polarity and is applied between the electrodes (309a, 309c), and (iii) a MOS transistor (317) formed on the substrate (301), wherein the variable resistance layer (309b) includes: oxygen-deficient transition metal oxide layers (309b-1, 309b-2) having compositions MOx and MOy (where x
Abstract:
A nonvolatile memory element comprising: a first electrode 2; a second electrode 6 formed above the first electrode 2; a variable resistance film 4 formed between the first electrode 2 and the second electrode 6, a resistance value of the variable resistance film 4 being increased or decreased by an electric pulse applied between the first and second electrodes 2, 6; and an interlayer dielectric film 3 provided between the first and second electrodes 2, 6, wherein the interlayer dielectric film 3 is provided with an opening extending from a surface thereof to the first electrode 2; the variable resistance film 4 is formed at an inner wall face of the opening; and an interior region of the opening which is defined by the variable resistance film 4 is filled with an embedded insulating film 5.
Abstract:
This invention is a method for a substrate concentration measurement method including measuring a concentration of a substrate in a blood specimen containing hemoglobin. In the method, the substrate concentration is calculated by using a measurement value correlating with a substrate concentration influenced by hemoglobin, and a hemoglobin concentration or a value correlating with the hemoglobin concentration. A substrate concentration is calculated by correcting the measurement value Re correlating with the substrate concentration based on the following Formulae 1 and 2: [Formula 1] Corrected value=100×Re/V (%), wherein V (%) represents a value with respect to plasma (a ratio of a measurement value influenced by hemoglobin with respect to a measurement value obtained by measuring plasma), and Re represents the measurement value correlating with the substrate concentration influenced by hemoglobin; [Formula 2] Value with respect to plasma V (%)=(Vmax×Re)/(Km+Re)+B, wherein Vmax represents a value obtained by subtracting an intercept (B) from the value (V) with respect to plasma which is maintained constant even when the measurement value influenced by hemoglobin increases, Km represents a value of Re at which the value V (%) with respect to plasma becomes Vmax/2, and B represents a value (constant) of V (%) with respect to plasma when Re is 0.