公开(公告)号：US07244367B2

公开(公告)日：2007-07-17

申请号：US10015086

申请日：2001-12-11

Applicant: Jonathan J. Bernstein ,  William P. Taylor

Inventor： Jonathan J. Bernstein ,  William P. Taylor

IPC: H01L21/00 ,  B44C1/22 ,  C23F1/00

CPC classification number: H01H1/0036 ,  B81B3/0078 ,  B81B2201/045 ,  B81B2203/0118 ,  C23C14/165 ,  H01H1/023 ,  H01H2001/0057 ,  Y10T428/12597

Abstract: A micromechanical device is provided, which includes at least one flexible member formed from an alloy, where the alloy is made up of one or more noble metals and one or more alloying elements, wherein each of the alloying elements has an equilibrium solid solubility in the noble metal, and wherein the one or more alloying elements are present in an amount that does not result in precipitates. A method for making a micromechanical device includes depositing an alloy on a substrate to form at least one flexible member, the alloy comprising one or more noble metals and one or more alloying elements, wherein the one or more alloying elements form a solid solution with the one or more noble metals; and removing a portion of the substrate or a sacrificial layer beneath the deposited alloy layer to obtain a flexible member.

Abstract translation: 提供了一种微机械装置，其包括由合金形成的至少一个柔性构件，其中所述合金由一种或多种贵金属和一种或多种合金元素构成，其中每种合金元素在所述合金元素中具有平衡的固体溶解度 贵金属，并且其中所述一种或多种合金元素以不会导致沉淀物的量存在。 一种用于制造微机械装置的方法包括在基底上沉积合金以形成至少一个柔性构件，所述合金包括一种或多种贵金属和一种或多种合金元素，其中所述一种或多种合金元素形成固溶体， 一种或多种贵金属; 以及去除所沉积的合金层下面的衬底或牺牲层的一部分以获得柔性构件。

公开(公告)号：US07214559B2

公开(公告)日：2007-05-08

申请号：US11134521

申请日：2005-05-23

Applicant: Jong-pal Kim ,  Sang-woo Lee ,  Byeung-leul Lee

Inventor： Jong-pal Kim ,  Sang-woo Lee ,  Byeung-leul Lee

IPC: H01L21/00

CPC classification number: B81C1/00626 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/045 ,  B81B2203/0109 ,  B81B2203/0118 ,  B81C2201/014 ,  G01P15/0802 ,  G01P15/125 ,  G02B26/0841

Abstract: A method for fabricating a vertical offset structure that forms a complete vertical offset on a wafer includes a first trench forming step of forming first trenches on a wafer; a first etching step of performing a first patterning for determining etching positions of second and third trenches by depositing a first thin film on the wafer, performing a second patterning for temporarily protecting the etching position of the third trench by depositing a second thin film on the first thin film and the wafer, and then forming the second trenches by etching the wafer; a second etching step of forming a protection layer on side surfaces of the second trenches and then vertically extending the second trenches by etching the wafer; a third etching step of removing the second thin film and then forming the third trench by etching a position from which the second thin film is removed; and a fourth etching step of horizontally extending the second trenches vertically extended at the second etching step and the third trench by etching the wafer.

Abstract translation: 用于制造在晶片上形成完整的垂直偏移的垂直偏移结构的方法包括在晶片上形成第一沟槽的第一沟槽形成步骤; 第一蚀刻步骤，通过在晶片上沉积第一薄膜来执行用于确定第二和第三沟槽的蚀刻位置的第一图案化，执行用于暂时保护第三沟槽的蚀刻位置的第二图案化， 第一薄膜和晶片，然后通过蚀刻晶片形成第二沟槽; 第二蚀刻步骤，在所述第二沟槽的侧表面上形成保护层，然后通过蚀刻所述晶片垂直延伸所述第二沟槽; 第三蚀刻步骤，通过蚀刻除去第二薄膜的位置来去除第二薄膜，然后形成第三沟槽; 以及第四蚀刻步骤，通过蚀刻晶片水平延伸在第二蚀刻步骤和第三沟槽处垂直延伸的第二沟槽。

公开(公告)号：US20060186498A1

公开(公告)日：2006-08-24

申请号：US11407468

申请日：2006-04-19

Applicant: Keiichi Mori ,  Yoshichika Kato ,  Satoshi Yoshida ,  Kenji Kondou ,  Yoshihiko Hamada ,  Osamu Imaki

Inventor： Keiichi Mori ,  Yoshichika Kato ,  Satoshi Yoshida ,  Kenji Kondou ,  Yoshihiko Hamada ,  Osamu Imaki

IPC: H01L21/00 ,  H01L27/14

CPC classification number: B81C1/00825 ,  B81B7/0029 ,  B81B2201/045 ,  B81B2203/033 ,  G02B26/0841 ,  Y10T29/49 ,  Y10T29/49002 ,  Y10T307/865

Abstract: In a microminiature moving device that has disposed, on a single-crystal silicon substrate, movable elements (a movable rod 46, a movable comb electrode 49, etc.) displaceable in parallel to the substrate surface and stationary parts (a stationary part 40a, etc.), the stationary parts are fixedly secured to the single-crystal silicon substrate 61 with an insulating layer 62 sandwiched therebetween, and depressions 64 are formed in those surface regions of the single-crystal silicon substrate 61 where no stationary parts are present, and the movable parts are positioned above the depressions 64. The depressions 64 form gaps 50 large enough to prevent foreign bodies from causing troubles such as malfunction of the movable parts and shoring.

Abstract translation: 在微单元移动装置中，在单晶硅基板上设置可移动的元件（可移动的杆46，可移动梳状电极49等），其可平行于基底表面和静止部分（静止部分40a 等），固定部分被固定地固定在单晶硅衬底61上，绝缘层62夹在它们之间，在单晶硅衬底61的不存在固定部分的那些表面区域形成凹陷64 并且可动部件位于凹部64的上方。 凹陷64形成足够大的间隙50，以防止异物引起诸如可移动部件和支撑件的故障的麻烦。

公开(公告)号：US20060171628A1

公开(公告)日：2006-08-03

申请号：US10544733

申请日：2004-02-06

Applicant: Koji Naniwada

Inventor： Koji Naniwada

IPC: G02B6/26

CPC classification number: B81B3/0072 ,  B81B2201/045 ,  B81B2203/0109 ,  B81B2203/053 ,  G02B26/0808 ,  G02B26/0841

Abstract: The present invention provides a MEMS device in which a warp that is deformation of a beam is reduced and which aims to improve the characteristic thereof, a method for manufacturing the MEMS device and a diffraction-type MEMS device. The MEMS device of the present invention includes a substrate-side electrode and a beam driven by a static electricity generated between the substrate-side and the beam, in which the beam is formed of a plurality of thin films including a driving-side electrode and is provided with deformation prevention means for preventing the deformation of the beam due to the warp of thin films caused by film stress. The diffraction-type MEMS device of the present invention is configured such that in the above-described configuration the substrate-side electrode is made common and a plurality of beams are provided independently to each other so as to be opposed to the substrate electrode.

Abstract translation: 本发明提供了一种MEMS器件，其中，作为光束变形的翘曲减小，其目的在于提高其特性，MEMS器件的制造方法和衍射型MEMS器件。 本发明的MEMS器件包括基板侧电极和由基板侧和光束之间产生的静电驱动的光束，其中光束由多个薄膜形成，薄膜包括驱动侧电极和 设有用于防止由薄膜应力引起的薄膜翘曲引起的光束变形的变形防止装置。 本发明的衍射型MEMS器件被构造成使得在上述配置中，将衬底侧电极制成共同的并且多个光束彼此独立地设置成与衬底电极相对。

公开(公告)号：US20060077147A1

公开(公告)日：2006-04-13

申请号：US11108026

申请日：2005-04-15

Applicant: Lauren Palmateer ,  William Cummings ,  Brian Gally ,  Clarence Chui

Inventor： Lauren Palmateer ,  William Cummings ,  Brian Gally ,  Clarence Chui

IPC: G02B26/00

CPC classification number: B81B7/0058 ,  B81B2201/045 ,  G02B26/001

Abstract: Physical forces sufficient to deform an electronic device and/or packaging for the electronic device can damage the device. Some mechanical components in a device, for example, in a microelectromechanical device and/or in an interferometric modulator are particularly susceptible to damage. Accordingly, provided herein is a packaging system and packaged electronic device that resists physical damage, a method for manufacturing the same, and a method for protecting an electronic device from physical damage. The packaging system for the electronic device includes one or more spacers that prevent or reduce damage to the electronic device arising from contact with the packaging. In some embodiments, the packaged electronic device comprising spacers is thinner than a comparable device manufactured without spacers.

公开(公告)号：US20060076637A1

公开(公告)日：2006-04-13

申请号：US11150496

申请日：2005-06-10

Applicant: Brian Gally ,  William Cummings ,  Lauren Palmateer ,  Philip Floyd ,  Clarence Chui

Inventor： Brian Gally ,  William Cummings ,  Lauren Palmateer ,  Philip Floyd ,  Clarence Chui

IPC: H01L23/20 ,  H01L21/00

CPC classification number: B81B7/0067 ,  B81B2201/045 ,  B81C2203/0109 ,  B81C2203/0145 ,  B81C2203/019 ,  G02B26/001

Abstract: A package structure and method of packaging for an interferometric modulator. A transparent substrate having an interferometric modulator formed thereon is provided. A backplane is joined to the transparent substrate with a seal where the interferometric modulator is exposed to the surrounding environment through an opening in either the backplane or the seal. The opening is sealed after the transparent substrate and backplane are joined and after any desired desiccant, release material, and/or self-aligning monolayer is introduced into the package structure.

Abstract translation: 用于干涉式调制器的封装结构和封装方法。 提供了其上形成有干涉式调制器的透明基板。 背板通过密封件连接到透明基板上，其中干涉式调制器通过背板或密封件中的开口暴露于周围环境。 在透明基板和背板接合之后，并且在任何期望的干燥剂，剥离材料和/或自对准单层被引入到包装结构中之后，将开口密封。

公开(公告)号：US07015620B2

公开(公告)日：2006-03-21

申请号：US11052256

申请日：2005-02-07

Applicant: Dennis S. Greywall

Inventor： Dennis S. Greywall

IPC: H02N1/00

CPC classification number: B81B3/0051 ,  B81B2201/038 ,  B81B2201/045 ,  B81B2203/0118 ,  B81B2203/058 ,  B81C1/00214 ,  G02B26/0841 ,  H02N1/006

Abstract: Two or more independent voltages are applied between stationary and movable parts of a MEMS device via a multipart spring having at least two cooperating parts that are not in direct electrical contact with each other. In one embodiment, the at least two cooperating parts include a first cooperating part and one or more other cooperating parts that are physically separated from the first cooperating part, wherein first and second independent voltages are applied via the first cooperating part and the one or more other cooperating parts, respectively.

Abstract translation: 通过具有至少两个彼此不直接电接触的配合部分的多部分弹簧，在MEMS器件的固定部件和可移动部件之间施加两个或多个独立电压。 在一个实施例中，所述至少两个协作部分包括第一协作部分和与第一协作部分物理分离的一个或多个其它协作部分，其中第一和第二独立电压经由第一协作部分和一个或多个 其他合作部分。

公开(公告)号：US07005775B2

公开(公告)日：2006-02-28

申请号：US10142821

申请日：2002-05-09

Applicant: Chang Feng Wan

Inventor： Chang Feng Wan

IPC: H02N1/00 ,  G02B26/08

CPC classification number: G02B26/0841 ,  B81B3/0035 ,  B81B2201/033 ,  B81B2201/045 ,  B81B2203/058

Abstract: The present invention is related to a novel micro-electro-mechanical systems (MEMS) torsional drive that is capable of tilting suspended structure such as a micro-mirror for steering light beams in three-dimensional analog fashion, which is suitable for high port count optical switches. The torsional drive has the advantages of allowing large tilt angle, having low drive voltage, and capable of providing a feedback signal for closed-loop control.

Abstract translation: 本发明涉及一种新颖的微电机械系统（MEMS）扭转驱动器，其能够倾斜诸如用于以三维模拟方式转向光束的微镜等悬置结构，适用于高端口数 光开关。 扭转驱动器具有允许具有低驱动电压的大倾斜角度并且能够提供用于闭环控制的反馈信号的优点。

公开(公告)号：US20050206986A1

公开(公告)日：2005-09-22

申请号：US11131089

申请日：2005-05-16

Applicant: Keiichi Akagawa ,  Junji Suzuki ,  Tohru Ishizuya ,  Yoshihiko Suzuki

Inventor： Keiichi Akagawa ,  Junji Suzuki ,  Tohru Ishizuya ,  Yoshihiko Suzuki

IPC: G02B26/08 ,  B81B3/00 ,  B81B7/02 ,  G02B6/12 ,  G02B6/35 ,  H04Q11/00 ,  B41J2/04

CPC classification number: G02B6/358 ,  B81B3/0037 ,  B81B2201/045 ,  B81B2203/0109 ,  B81B2203/053 ,  G02B6/3514 ,  G02B6/3546 ,  G02B6/357 ,  G02B6/3572 ,  G02B6/3584 ,  G02B2006/12104

Abstract: The movable part 21 is fastened to the substrate 11 via flexure parts 27a and 27b, and can move upward and downward with respect to the substrate 11. The substrate 11 also serves as a fixed electrode. The movable part 21 has second electrode parts 23a and 23b which can generate an electrostatic force between these electrode parts and the substrate 11 by means of a voltage that is applied across these electrode parts and the substrate 11, and a current path 25 which is disposed in a magnetic field, and which generates a Lorentz force when a current is passed through this current path. A mirror 12 which advances into and withdraws from the light path is disposed on the movable part 21. As a result, the mobility range of the movable part can be broadened, and the power consumption can be reduced, without applying a high voltage or sacrificing small size.

Abstract translation: 可动部21经由弯曲部件27a，27b被固定在基板11上，能够相对于基板11上下移动。基板11也用作固定电极。 可动部21具有可以通过施加在这些电极部和基板11上的电压而在这些电极部和基板11之间产生静电力的第二电极部23a和23b，以及电流路径25 设置在磁场中，并且当电流通过该电流路径时产生洛伦兹力。 在可移动部分21上设置有进入和退出光路的反射镜12.结果，可以扩大可移动部分的移动范围，并且可以在不施加高电压或牺牲的情况下降低功耗 小尺寸。

公开(公告)号：US20050156482A1

公开(公告)日：2005-07-21

申请号：US11052256

申请日：2005-02-07

Applicant: Dennis Greywall

Inventor： Dennis Greywall

IPC: B81B3/00 ,  B81C99/00 ,  G02B26/08 ,  H02N1/00 ,  B26B17/00

CPC classification number: B81B3/0051 ,  B81B2201/038 ,  B81B2201/045 ,  B81B2203/0118 ,  B81B2203/058 ,  B81C1/00214 ,  G02B26/0841 ,  H02N1/006

Abstract: Two or more independent voltages are applied between stationary and movable parts of a MEMS device via a multipart spring having at least two cooperating parts that are not in direct electrical contact with each other. In one embodiment, the at least two cooperating parts include a first cooperating part and one or more other cooperating parts that are physically separated from the first cooperating part, wherein first and second independent voltages are applied via the first cooperating part and the one or more other cooperating parts, respectively.

Abstract translation: 通过具有至少两个彼此不直接电接触的配合部分的多部分弹簧，在MEMS器件的固定部件和可移动部件之间施加两个或多个独立电压。 在一个实施例中，所述至少两个协作部分包括第一协作部分和与第一协作部分物理分离的一个或多个其它协作部分，其中第一和第二独立电压经由第一协作部分和一个或多个 其他合作部分。