Abstract:
Apparatus and methods for current sensing in switching regulators are provided. In certain implementations, a switching regulator includes a switch transistor, a replica transistor, a current source, a sense resistor, and a current sensing circuit. The drain and gate of the switch transistor can be electrically connected to the drain and gate of the replica transistor, respectively. Additionally, the current sensing circuit can control the voltage of the source of the replica transistor based on the polarity of a current through the switch transistor to generate an output current that changes in response to the switch transistor's current. The sense resistor can receive an offset current from the first current source and the output current from the current sensing circuit such that the voltage across the sense resistor changes in relation to the current through the switch transistor.
Abstract:
A method of forming an insulating structure, comprising forming an insulating region comprising at least one electrical or electronic component or part thereof embedded within the insulating region, and forming a surface structure in a surface of the insulating region.
Abstract:
An integrated circuit may include a substrate and a dielectric layer formed over the substrate. A plurality of p-type thermoelectric elements and a plurality of n-type thermoelectric elements may be disposed within the dielectric layer. The p-type thermoelectric elements and the n-type thermoelectric elements may be connected in series while alternating between the p-type and the n-type thermoelectric elements.
Abstract:
A continuous time input stage including a first digital-to-analog converter (DAC) including a first DAC code input, a second DAC including a second DAC code input, a first set of switches coupled to the output of the first DAC, a second set of switches coupled to the output of the second DAC, and an amplifier configured to receive the output of either the first DAC or the second DAC.
Abstract:
Vertical mount package assemblies and methods for making the same are disclosed. A method for manufacturing a vertical mount package assembly includes providing a base substrate having electrical connections for affixing to external circuitry, and providing a package having a mounting region configured to receive a device therein. Flexible electrical leads are formed between the base substrate and the package. The flexible leads can include a plurality of aligned grooves to guide bending. After forming the flexible electrical leads, the package is rotated relative to the base substrate. The aligned grooves can constrain the relative positions of the substrates during rotation, and the beveled edges of the base substrate and package can maintain a desired angular relationship (e.g., perpendicular) between the base substrate and the package after rotation.
Abstract:
Embodiments of the present invention may provide a multi-string DAC with leakage current cancellation. A leakage cancellation circuit may be coupled to output node(s) of the—multi-string DAC. The leakage cancellation circuit may replicate leakage current present at the coupled output node(s) and generate a corresponding complementary signal, a leakage cancellation signal. The leakage cancellation signal may be injected into the coupled output node(s) to cancel (or reduce) the net impact of the leakage current.
Abstract:
Objects are detected in real-time at full VGA 30 frame per second resolution. A preprocessor performs run-length encoding (RLE) and generates a summed area table (SAT) of an image. The RLE and SAT are used to identify candidate objects and to iteratively refine their boundaries. A histogram of gradients (HoG) and support vector machine (SVM) then reliably classify the object. The method may be part of an advanced driver assistance system (ADAS).
Abstract:
An example method to reduce data handling on lithium ion battery monitors is provided and includes receiving a request from a micro-controller for data associated with one or more cells, receiving signals corresponding to monitored properties from the cells, calculating derivative properties from the monitored properties, dividing a default data into a plurality of portions, and sending the derivative properties and one of the portions to the micro-controller according to at least a first compute logic option or a second compute logic option. The default data can include cell voltages, auxiliary inputs, stack voltage, reference output voltage, analog voltage output, analog voltage input, temperature, and reference buffer voltage. The default data is provided sequentially to the micro-controller in as many consecutive read backs as the number of portions, where each portion corresponds to the default data measured at a distinct time instant.
Abstract:
An analog to digital converter comprising at least one sampling capacitor connected to a sample node, and a pre-charge circuit arranged to cause the voltage on the sample node to substantially match the input voltage prior to the analog to digital converter entering an acquire mode in which the sample node is connected to the input node by a sample switch.