摘要:
An apparatus for depositing a thin film includes a reaction chamber, a reaction gas provider to supply a reaction gas and/or inert gas to the reaction chamber, an oxidant provider to supply a first oxidant and a second oxidant to the reaction chamber, and an air drain to exhaust gas from the apparatus. The oxidant provider is operable to supply the second oxidant to the reaction chamber using the first oxidant as a transfer gas.
摘要:
A method for manufacturing a capacitor of a semiconductor device is provided. The method includes the steps of: forming a first electrode on a semiconductor substrate; forming a dielectric layer on the first electrode; forming a second electrode on the dielectric layer; first annealing the capacitor having the first electrode, the dielectric layer, and the second electrode under oxygen atmosphere; and second annealing the capacitor having the first electrode, the dielectric layer, and the second electrode under vacuum.
摘要:
A gate line extending in a horizontal direction is formed on an insulating substrate, and a data line is formed perpendicular to the gate line defining a pixel of a matrix array. Pixel electrodes receiving image signals through the data line are formed in a pixel, and a thin film transistor having a gate electrode connected to the gate line, a source electrode connected to the data line, and a drain electrode connected to the pixel electrode is formed on the portion where the gate lines and the data lines intersect. A storage wire including a storage electrode line in the horizontal direction, a storage electrode connected to the storage electrode line, and at least one of the storage electrode connection portions connecting storage electrodes of neighboring pixels is formed in the same direction as the gate line. A redundant repair line overlaps and is insulated from the storage wire at one end and overlaps the storage wire or the gate wire of a neighboring pixel at the other end is formed in the same layer as the data wire. Also, a storage wire connection portion connecting the storage wires of a neighboring pixel is formed in the same layer as the pixel electrode. In this structure, if portions of the gate wire or the data wire are disconnected, the portions overlapping the disconnected wire, the storage wire, and the redundant repair line are shorted to repair an open wire defect.
摘要:
A semiconductor device fabrication system for carrying out a UV-bake on a photoresist pattern in the semiconductor device pattern formation, includes a photoresist coating unit coating a wafer with a specific photoresist; a developing unit forming a photoresist pattern on the wafer coated with the photoresist; and a cross-linking and flow baking unit for cross-linking the photoresist pattern and subsequently flow baking the cross-linked photoresist pattern, wherein the cross-linking and flow baking unit thermally stabilizes the photoresist pattern prior to flow baking.
摘要:
A method for forming an electrode structure includes the steps of forming a conductive electrode on the microelectronic substrate, forming HSG-silicon seeds on the surface of the conductive electrode, and etching the conductive electrode using the HSG-silicon seeds as a mask so that pits are formed between the HSG-silicon seeds. In addition, the HSG-silicon seeds on the conductive electrode can be grown to form enlarged HSG-silicon bumps on the conductive electrode further increasing the surface area thereof. Related structures are also discussed.
摘要:
A method of forming a capacitor structure includes the steps of forming a conductive layer on a microelectronic substrate, and forming a first hemispherical grained silicon layer on the conductive layer opposite the substrate. A protective layer is formed on the hemispherical grained silicon layer. The protective layer, the first hemispherical grained silicon layer, and the conductive layer are then patterned so that portions of the microelectronic substrate are exposed adjacent the patterned conductive layer. A second hemispherical grained silicon layer is formed on the surface of the protective layer opposite the first hemispherical grained silicon layer, on sidewalls of the patterned conductive layer, and on the exposed portions of the microelectronic substrate. Portions of the second hemispherical grained silicon layer are removed from the exposed portions of the microelectronic substrate, and the patterned protective layer is then removed.
摘要:
Provided are a content reproduction method and apparatus. The content reproduction method includes receiving a select signal for selecting one or more pieces of content; and reproducing the selected pieces of content and one or more pieces of content which were generated or reproduced together with the selected pieces of content in a temporal space within a range.
摘要:
A content reproducing method and a content reproducing apparatus capable of continuously reproducing content by searching for an apparatus having optimal capabilities for reproducing the content, when a plurality of content reproducing apparatuses with similar functions are located within a short range of each other.
摘要:
Methods and apparatus are provided for completing schedule information. A device displays keyword information corresponding to at least one piece of character information, and at least one piece of recommended schedule information selected from a plurality of domains and having a correlation with the keyword information, in response to inputting the at least one piece of character information. Schedule information is automatically completed according to at least a selection of a piece of recommended schedule information from the displayed at least one piece of recommended schedule information.
摘要:
Provided is an apparatus and method for setting a sensor node to be automatically connected. An apparatus for setting a connection of a sensor node may include: a data receiver to receive, from the sensor node, sensor data that is measured by the sensor node; a node type determining unit to determine a type of the sensor node based on the received sensor data; and a sensor node setting unit to set the sensor node to be automatically connected based on the determined type of the sensor node.