Memory device and semiconductor device including the memory device

    公开(公告)号:US12063770B2

    公开(公告)日:2024-08-13

    申请号:US17414614

    申请日:2019-11-15

    CPC classification number: H10B12/30 H01L29/7869

    Abstract: A novel memory device is provided. The memory device includes a transistor and a capacitor device. The transistor includes a first oxide semiconductor; a first conductor and a second conductor provided over a top surface of the first oxide semiconductor; a second oxide semiconductor that is formed over the first oxide semiconductor and is provided between the first conductor and the second conductor; a first insulator provided in contact with the second oxide semiconductor; and a third conductor provided in contact with the first insulator. The capacitor device includes the second conductor; a second insulator over the second conductor; and a fourth conductor over the second insulator. The first oxide semiconductor has a groove deeper than a thickness of each of the first conductor and the second conductor.

    Memory device
    164.
    发明授权

    公开(公告)号:US11961916B2

    公开(公告)日:2024-04-16

    申请号:US17261665

    申请日:2019-07-29

    Abstract: A novel memory device is provided. The memory device includes a plurality of first wirings extending in a first direction, a plurality of memory element groups, and an oxide layer extending along a side surface of the first wiring. Each of the memory element groups includes a plurality of memory elements. Each of the memory elements includes a first transistor and a capacitor. A gate electrode of the first transistor is electrically connected to the first wiring. The oxide layer includes a region in contact with a semiconductor layer of the first transistor. A second transistor is provided between the adjacent memory element groups. A high power supply potential is supplied to one or both of a source electrode and a drain electrode of the second transistor.

    Semiconductor device
    166.
    发明授权

    公开(公告)号:US11742014B2

    公开(公告)日:2023-08-29

    申请号:US17829579

    申请日:2022-06-01

    CPC classification number: G11C11/405 G06F12/0893 H01L27/1225 H10B12/00

    Abstract: A semiconductor device in which a memory region at each level of a memory device can be changed is provided. The semiconductor device includes a memory device including a first and a second memory circuit and a control circuit. The first memory circuit includes a first capacitor and a first transistor which has a function of holding charges held in the first capacitor. The second memory circuit includes a second transistor, a second capacitor which is electrically connected to a gate of the second transistor, and a third transistor which has a function of holding charges held in the second capacitor. The first and the third transistors each have a semiconductor layer including an oxide semiconductor, a gate, and a back gate. The voltage applied to the back gate of the first or the third transistor is adjusted, whereby the memory region of each of the first and the second memory circuit is changed.

    Comparison circuit, semiconductor device, electronic component, and electronic device

    公开(公告)号:US11457167B2

    公开(公告)日:2022-09-27

    申请号:US16616181

    申请日:2018-05-22

    Abstract: Provided is a comparison circuit to which a negative voltage to be compared can be input directly. The comparison circuit includes a first input terminal, a second input terminal, a first output terminal, and a differential pair. The comparison circuit compares a negative voltage and a negative reference voltage and outputs a first output voltage from the first output terminal in response to the comparison result. The negative voltage is input to the first input terminal. A positive reference voltage is input to the second input terminal. The positive reference voltage is determined so that comparison is performed. The differential pair includes a first n-channel transistor and a second n-channel transistor each having a gate and a backgate. The first input terminal is electrically connected to the backgate of the first n-channel transistor. The second input terminal is electrically connected to the gate of the second n-channel transistor.

    Storage device, semiconductor device, and electronic device

    公开(公告)号:US11410716B2

    公开(公告)日:2022-08-09

    申请号:US16962309

    申请日:2019-01-14

    Abstract: A novel storage device and a novel semiconductor device are provided.
    In the storage device, a cell array including a plurality of memory cells is stacked above a control circuit, and the cell array operates separately in a plurality of blocks. Furthermore, a plurality of electrodes are included between the control circuit and the cell array. The electrode is provided for a corresponding block to overlap with the block, and a potential of the electrode can be changed for each block. The electrode has a function of aback gate of a transistor included in the memory cell, and a potential of the electrode is changed for each block, whereby the electrical characteristics of the transistor included in the memory cell can be changed. Moreover, the electrode can reduce noise caused in the control circuit.

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