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公开(公告)号：US20190154801A1
公开(公告)日：2019-05-23
申请号：US15818465
申请日：2017-11-20
Applicant: STMICROELECTRONICS PTE LTD
Inventor： David GANI
CPC classification number: G01S7/4808 , G01J1/4204 , G01S7/4813 , G01S7/4814 , G01S7/4816 , G01S7/4876 , G01S7/493 , G01S7/497 , G01S17/026 , G01S17/08
Abstract: A semiconductor package that is a proximity sensor includes a light transmitting die, a light receiving die, an ambient light sensor, a cap, and a substrate. The light receiving die and the light transmitting die are coupled to the substrate. The cap is coupled to the substrate forming a first chamber around the light transmitting die and a second chamber around the light receiving die. The cap further includes a recess with contact pads. The ambient light sensor is mounted within the recess of the cap and coupled to the contact pads. The cap includes electrical traces that are coupled to the contact pads within the recess coupling the ambient light sensor to the substrate. By utilizing a cap with a recess containing contact pads, a proximity sensor can be formed in a single semiconductor package all while maintaining a compact size and reducing the manufacturing costs of proximity sensors.
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公开(公告)号：US20190004207A1
公开(公告)日：2019-01-03
申请号：US16107911
申请日：2018-08-21
Inventor： Wing Shenq Wong , Andy Price , Eric Christison
IPC: G01V8/12 , H01L25/16 , H01L31/167
CPC classification number: G01V8/12 , H01L25/167 , H01L31/167 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014
Abstract: A method for forming a molded proximity sensor with an optical resin lens and the structure formed thereby. A light sensor chip is placed on a substrate, such as a printed circuit board, and a diode, such as a laser diode, is positioned on top of the light sensor chip and electrically connected to a bonding pad on the light sensor chip. Transparent, optical resin in liquid form is applied as a drop over the light sensor array on the light sensor chip as well as over the light-emitting diode. After the optical resin is cured, a molding compound is applied to an entire assembly, after which the assembly is polished to expose the lenses and have a top surface flush with the top surface of the molding compound.
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公开(公告)号：US10128207B2
公开(公告)日：2018-11-13
申请号：US14674891
申请日：2015-03-31
Applicant: STMicroelectronics Pte Ltd
Inventor： Yun Liu , Jerome Teysseyre , Yonggang Jin
Abstract: One or more embodiments are directed to semiconductor packages that include a pillar and bump structures. The semiconductor packages include a die that has recess at a perimeter of the semiconductor die. The semiconductor package includes an encapsulation layer that is located over the semiconductor die filling the recess and surrounding side surfaces of the pillars. The package may be formed on a wafer with a plurality of die and may be singulated into a plurality of packages.
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公开(公告)号：US10115842B2
公开(公告)日：2018-10-30
申请号：US15802271
申请日：2017-11-02
Inventor： Yonggang Jin , David Lawson , Colin Campbell , Anandan Ramasamy
IPC: H01L31/0216 , H01L31/0232 , H01L31/0203 , H01L31/02 , H01L31/101
Abstract: Embodiments of the present disclosure are directed to optical packages having a package body that includes a light protection coating on at least one surface of a transparent material. The light protection coating includes one or more openings to allow light to be transmitted to the optical device within the package body. In one embodiment, the light protection coating and the openings allow substantially perpendicular radiation to be directed to the optical device within the package body. In one exemplary embodiment the light protection coating is located on an outer surface of the transparent material. In another embodiment, the light protection coating is located on an inner surface of the transparent material inside of the package body.
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公开(公告)号：US20180248068A1
公开(公告)日：2018-08-30
申请号：US15969908
申请日：2018-05-03
Applicant: STMicroelectronics Pte Ltd
Inventor： Yonggang Jin , Wee Chin Judy Lim
IPC: H01L31/16 , H01L31/18 , H01L31/0232 , H01L25/16
CPC classification number: H01L31/16 , G01S7/4813 , G01S17/026 , G01V8/12 , H01L21/568 , H01L25/167 , H01L31/0232 , H01L31/02327 , H01L31/167 , H01L31/18 , H01L31/186 , H01L2224/04105 , H01L2224/18 , H01L2224/19 , H01L2924/3511 , H03K17/941 , H03K17/9631 , H03K17/9638 , H03K2217/96023 , Y10T156/1052 , Y10T156/1064
Abstract: An optical detection sensor functions as a proximity detection sensor that includes an optical system and a selectively transmissive structure. Electromagnetic radiation such as laser light can be emitted through a transmissive portion of the selectively transmissive structure. A reflected beam can be detected to determine the presence of an object. The sensor is formed by encapsulating the transmissive structure in a first encapsulant body and encapsulating the optical system in a second encapsulant body. The first and second encapsulant bodies are then joined together. In a wafer scale assembling the structure resulting from the joined encapsulant bodies is diced to form optical detection sensors.
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Patent Agency Ranking
公开(公告)号：US09991409B2
公开(公告)日：2018-06-05
申请号：US14968359
申请日：2015-12-14
Applicant: STMicroelectronics Pte Ltd
Inventor： Yonggang Jin , Wee Chin Judy Lim
IPC: H01L31/16 , H01L31/0232 , H01L31/18 , H03K17/94 , H03K17/96 , H01L31/167 , G01S17/02 , G01S7/481 , H01L25/16 , G01V8/12
CPC classification number: H01L31/16 , G01S7/4813 , G01S17/026 , G01V8/12 , H01L21/568 , H01L25/167 , H01L31/0232 , H01L31/02327 , H01L31/167 , H01L31/18 , H01L31/186 , H01L2224/04105 , H01L2224/18 , H01L2224/19 , H01L2924/3511 , H03K17/941 , H03K17/9631 , H03K17/9638 , H03K2217/96023 , Y10T156/1052 , Y10T156/1064
Abstract: An optical detection sensor functions as a proximity detection sensor that includes an optical system and a selectively transmissive structure. Electromagnetic radiation such as laser light can be emitted through a transmissive portion of the selectively transmissive structure. A reflected beam can be detected to determine the presence of an object. The sensor is formed by encapsulating the transmissive structure in a first encapsulant body and encapsulating the optical system in a second encapsulant body. The first and second encapsulant bodies are then joined together. In a wafer scale assembling the structure resulting from the joined encapsulant bodies is diced to form optical detection sensors.
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公开(公告)号：US09911890B2
公开(公告)日：2018-03-06
申请号：US15199390
申请日：2016-06-30
Applicant: STMICROELECTRONICS PTE LTD
Inventor： Loic Pierre Louis Renard , Cheng-Lay Ang
IPC: H01L31/0232 , H01L21/00 , H01L31/173 , H01S5/183 , H01S5/022 , H01L31/12 , H01L31/042 , H01L31/047 , H01L31/0475 , H01G9/20 , H01L31/046
CPC classification number: H01L31/173 , G01S7/4813 , G01S17/08 , H01G9/20 , H01L31/0203 , H01L31/02366 , H01L31/042 , H01L31/046 , H01L31/047 , H01L31/0475 , H01L31/125 , H01S5/02252 , H01S5/183
Abstract: One or more embodiments are directed to system in package (SiP) for optical devices, including proximity sensor packaging. One embodiment is directed to optical sensor that includes a substrate, an image sensor die and a light-emitting device. A first surface of the image sensor die is coupled to the substrate, and a recess is formed extending into the image sensor die from the first surface toward a second surface of the image sensor die. A light transmissive layer is formed in the image sensor die between the recess and the first surface. The optical sensor further includes a light-emitting device that is coupled to the substrate and positioned within the recess formed in the image sensor die.
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公开(公告)号：US09851328B2
公开(公告)日：2017-12-26
申请号：US14462432
申请日：2014-08-18
Applicant: STMicroelectronics Pte Ltd
Inventor： Jerome Teysseyre , Yonggang Jin , Suman Cherian
IPC: G01N27/28 , G01N27/403 , G01N27/413 , G01N27/406 , G01N27/407 , H05K1/18
CPC classification number: G01N27/4065 , G01N27/4062 , G01N27/4071 , G01N27/4077 , H05K1/185 , H05K2201/09118 , H05K2201/10151
Abstract: A compact microelectronic gas sensor module includes electrical contacts formed in such a way that they do not consume real estate on an integrated circuit chip. Using such a design, the package can be miniaturized further. The gas sensor is packaged together with a custom-designed Application Specific Integrated Circuit (ASIC) that provides circuitry for processing sensor signals to identify gas species within a sample under test. In one example, the output signal strength of the sensor is enhanced by providing an additional metal surface area in the form of pillars exposed to an electrolytic gas sensing compound, while reducing the overall package size. In some examples, bottom side contacts are formed on the underside of the substrate on which the gas sensor is formed. Sensor electrodes may be electrically coupled to the ASIC directly, or indirectly by vias.
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公开(公告)号：US09818937B2
公开(公告)日：2017-11-14
申请号：US14982600
申请日：2015-12-29
Applicant: STMicroelectronics Pte Ltd
Inventor： Olivier Le Neel , Ravi Shankar
CPC classification number: H01L43/14 , G01N27/74 , H01L21/8234 , H01L43/04 , H01L43/065 , H01L43/10 , Y10T29/4913
Abstract: A miniature oxygen sensor makes use of paramagnetic properties of oxygen gas to provide a fast response time, low power consumption, improved accuracy and sensitivity, and superior durability. The miniature oxygen sensor disclosed maintains a sample of ambient air within a micro-channel formed in a semiconductor substrate. O2 molecules segregate in response to an applied magnetic field, thereby establishing a measurable Hall voltage. Oxygen present in the sample of ambient air can be deduced from a change in Hall voltage with variation in the applied magnetic field. The magnetic field can be applied either by an external magnet or by a thin film magnet integrated into a gas sensing cavity within the micro-channel. A differential sensor further includes a reference element containing an unmagnetized control sample. The miniature oxygen sensor is suitable for use as a real-time air quality monitor in consumer products such as smart phones.
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公开(公告)号：US09793427B1
公开(公告)日：2017-10-17
申请号：US15218966
申请日：2016-07-25
Applicant: STMICROELECTRONICS PTE LTD
Inventor： David Gani
IPC: H01L27/15 , H01L31/024 , H01L31/173 , G01V8/10
CPC classification number: H01L31/024 , G01V8/10 , G01V8/12 , H01L31/173 , H01L2224/48091 , H01L2224/48471 , H01L2224/73265 , H01L2924/00014
Abstract: One or more embodiments are directed to system in package (SiP) for optical devices, including proximity sensor packaging. One embodiment is directed to an optical sensor that includes a substrate and a sensor die. A through-hole extends through the substrate, and a trench is formed in a first surface of the substrate and is in fluid communication with the through-hole. The sensor die is attached to the first surface of the substrate and covers the first through-hole and a first portion of the trench. A second portion of the trench is left uncovered by the sensor die.
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