Abstract:
A semiconductor device has a substrate, a gate dielectric layer, and a metal gate electrode on the gate dielectric layer. The gate dielectric layer includes an oxide layer having a dielectric constant (k) greater than 4, and silicon concentrated at interfaces of the oxide layer with the substrate and with the metal gate electrode. A method of fabricating a semiconductor device includes forming a removable gate over a substrate with a gate dielectric layer between the removable gate and the substrate, forming a dielectric layer over the substrate and exposing an upper surface of the removable gate, removing the removable gate leaving an opening in the dielectric layer, forming a protective layer on the gate dielectric layer and lining the opening, and forming a metal gate electrode in the opening. The protective layer has a graded composition between the gate dielectric layer and the metal gate electrode.
Abstract:
A field effect transistor (FET) includes body regions of a first conductivity type over a semiconductor region of a second conductivity type. The body regions form p-n junctions with the semiconductor region. Source regions of the second conductivity type extend over the body regions. The source regions form p-n junctions with the body regions. Gate electrodes extend adjacent to but are insulated from the body regions by a gate dielectric. A carbon-containing region extends in the semiconductor region below the body regions.
Abstract:
A field effect transistor (FET) includes body regions of a first conductivity type over a semiconductor region of a second conductivity type. Source regions of the second conductivity type extend over the body regions. Gate electrodes extend adjacent to but are insulated from the body regions by a gate dielectric layer. Contact openings extend into the body regions between adjacent gate electrodes. A seed layer extends along the bottom of each contact opening. The seed layer serves as a nucleation site for promoting growth of conductive fill material. A conductive fill material fills a lower portion of each contact opening. An interconnect layer fills an upper portion of each contact opening and is in direct contact with the conductive fill material. The interconnect layer is also in direct contact with corresponding source regions along upper sidewalls of the contact openings.
Abstract:
A trench-gate field effect transistor includes trenches extending into a silicon region of a first conductivity type, and a gate electrodes in each trench. Body regions of second conductivity type extend over the silicon region between adjacent trenches. Each body region forms a PN junction with the silicon region. A gate dielectric layer lines at least upper sidewalls of each trench, and insulates the gate electrode from the body region. Source regions of the first conductivity flank the trenches. A silicon-germanium region vertically extends through each source region and through a corresponding body region, and terminates within the corresponding body region before reaching the PN junction.
Abstract:
A semiconductor structure which includes a trench gate FET is formed as follows. A plurality of trenches is formed in a semiconductor region using a mask. The mask includes (i) a first insulating layer over a surface of the semiconductor region, (ii) a first oxidation barrier layer over the first insulating layer, and (iii) a second insulating layer over the first oxidation barrier layer. A thick bottom dielectric (TBD) is formed along the bottom of each trench. The first oxidation barrier layer prevents formation of a dielectric layer along the surface of the semiconductor region during formation of the TBD.
Abstract:
This disclosure describes a new semiconductor non-volatile memory that can be potentially faster than DRAM and FLASH, and the manufacturing cost can be lower than SRAM, which is volatile. It is possible to fabricate an ULSI microprocessor and this type of new memory array in the same chip—realizing the “embedded” process. There are a CMOS transistor and latched-up Bipolar transistors (A thyristor) in the device. The fast read, write and erase operations are done by charging the MOS gate capacitor interface and sensing the latch-up voltage of the thyristor. The latch-up voltage of the thyristor is reduced for the additional MOSFET current during the write process, causing early avalanche breakdown and the latch-up of the bipolar transistors. The semiconductor memory can be fabricated as a planar device or a vertical device.
Abstract:
The present invention is directed to novel polypeptides having sequence identity with IL-17, IL-17 receptors and to nucleic acid molecules encoding those polypeptides. Also provided herein are vectors and host cells comprising those nucleic acid sequences, chimeric polypeptide molecules comprising the polypeptides of the present invention fused to heterologous polypeptide sequences, antibodies which bind to the polypeptides of the present invention and to methods for producing the polypeptides of the present invention. Further provided herein are methods for treating degenerative cartilaginous disorders and other inflammatory diseases.
Abstract:
The present invention is directed to novel polypeptides and to nucleic acid molecules encoding those polypeptides. Also provided herein are vectors and host cells comprising those nucleic acid sequences, chimeric polypeptide molecules comprising the polypeptides of the present invention fused to heterologous polypeptide sequences, antibodies which bind to the polypeptides of the present invention and to methods for producing the polypeptides of the present invention.
Abstract:
A field effect transistor (FET) includes body regions of a first conductivity type over a semiconductor region of a second conductivity type. The body regions form p-n junctions with the semiconductor region. Source regions of the second conductivity type extend over the body regions. The source regions form p-n junctions with the body regions. Gate electrodes extend adjacent to but are insulated from the body regions by a gate dielectric. A carbon-containing region extends in the semiconductor region below the body regions.
Abstract:
Methods are provided for fabricating a stress enhanced MOS transistor. One such method comprises the steps of depositing and patterning a layer of sacrificial material to form a dummy gate electrode and replacing the dummy gate electrode with a stressed gate electrode. After the stressed gate electrode has been formed by a replacement process, a stress liner is deposited overlying the stressed gate electrode.