公开(公告)号：US08829077B2

公开(公告)日：2014-09-09

申请号：US13516106

申请日：2011-01-19

申请人： Takashi Nakatani

发明人： Takashi Nakatani

IPC分类号： C08K3/22 ,  C08K3/40 ,  C08K5/01 ,  C04B35/632 ,  C08L93/04 ,  C04B35/10 ,  C09J193/04 ,  C04B35/46 ,  C04B35/457 ,  C04B35/01 ,  C04B35/634 ,  C04B35/638 ,  C04B35/14 ,  C04B35/468 ,  C04B35/505

CPC分类号： C04B35/63492 ,  C04B35/01 ,  C04B35/10 ,  C04B35/14 ,  C04B35/457 ,  C04B35/46 ,  C04B35/4682 ,  C04B35/505 ,  C04B35/632 ,  C04B35/638 ,  C04B2235/3286 ,  C04B2235/3293 ,  C08L93/04 ,  C09J193/04

摘要： A thermally decomposable binder resin containing, as an active ingredient, a rosin derivative (A) that is obtained by subjecting a rosin (a) to distillation and a disproportionation treatment and/or hydrogenation treatment, wherein the rosin derivative (A) has a 99 wt % weight loss temperature of 500° C. or lower in thermogravimetric measurement, under an air atmosphere at a heating rate of 5° C./min, a binder resin composition containing the resin, and a use of the binder resin composition.

摘要翻译： 1.一种热分解性粘合剂树脂，其含有松香（a）蒸馏和歧化处理和/或氢化处理得到的松香衍生物（A）作为活性成分，其中所述松香衍生物（A）具有99 在5℃/分钟的加热速度的空气气氛下，含有该树脂的粘合剂树脂组合物和粘合剂树脂组合物的用途，在重量测定中的重量％重量减少温度为500℃以下。

公开(公告)号：US20140014521A1

公开(公告)日：2014-01-16

申请号：US14029637

申请日：2013-09-17

申请人： ARAKAWA CHEMICAL INDUSTRIES, LTD.

发明人： Akihisa HAMAZAWA ,  Koji Nishimura ,  Hideki Goda

IPC分类号： H05K1/02

CPC分类号： H05K1/0277 ,  H05K1/0346 ,  H05K1/0373 ,  H05K1/0393 ,  H05K3/108 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K2201/0344 ,  H05K2201/068 ,  Y10T29/49124

摘要： An object of the present invention is to provide a flexible circuit board that maintains high insulation reliability, exhibits high wiring adhesion, has low thermal expansion, and allows the formation of a fine circuit thereon. Specifically, the present invention provides a flexible circuit board, wherein at least a nickel plating layer is laminated on a polyimide film to form a polyimide film provided with a nickel plating layer and a wiring pattern is applied to the nickel plating layer thereof. The polyimide film has a thermal expansion coefficient of 0 to 8 ppm/° C. in the temperature range from 100 to 200° C., and the nickel plating layer has a thickness of 0.03 to 0.3 μm.

摘要翻译： 本发明的目的是提供一种保持高绝缘可靠性，显示出高布线附着力，低热膨胀性并且允许在其上形成微细电路的柔性电路板。 具体地说，本发明提供一种挠性电路基板，其中，在聚酰亚胺膜上层叠有至少一层镍镀层，形成具有镀镍层的聚酰亚胺膜，并且对其镀镍层施加布线图案。 聚酰亚胺膜在100〜200℃的温度范围内的热膨胀系数为0〜8ppm /℃，镍镀层的厚度为0.03〜0.3μm。

公开(公告)号：US20120291921A1

公开(公告)日：2012-11-22

申请号：US13513880

申请日：2010-12-06

申请人： Eiji Iwamura ,  Kazushi Gotoh ,  Shinsuke Nagasaka ,  Takayasu Yoshioka ,  Masayoshi Utsuno ,  Atsuo Nakamura ,  Teruo Okochi ,  Masaki Sanji ,  Takuji Sukekawa ,  Kenshi Ikedo ,  Yoshiyuki Andoh ,  Takeshi Shirai ,  Kimiaki Mori ,  Rie Wada ,  Kensuke Nakanishi ,  Masami Aihara ,  Seishi Kumamoto

发明人： Eiji Iwamura ,  Kazushi Gotoh ,  Shinsuke Nagasaka ,  Takayasu Yoshioka ,  Masayoshi Utsuno ,  Atsuo Nakamura ,  Teruo Okochi ,  Masaki Sanji ,  Takuji Sukekawa ,  Kenshi Ikedo ,  Yoshiyuki Andoh ,  Takeshi Shirai ,  Kimiaki Mori ,  Rie Wada ,  Kensuke Nakanishi ,  Masami Aihara ,  Seishi Kumamoto

IPC分类号： B23K35/363

CPC分类号： B23K35/362 ,  B23K35/0222 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/3613 ,  C22C13/00 ,  H05K3/3489

摘要： A flux for a solder paste according to an aspect of the invention includes an acrylic resin obtained by radically copolymerizing a (meth)acrylate having a C6-C15 alkyl group and a (meth)acrylate other than the above-mentioned (meth)acrylate; and rosins. The weight ratio of the acrylic resin is 0.5 or greater and 1.2 or less when the weight of the rosins is taken as 1, and the flux for a solder paste is fluidized by application of a shear force of 10 Pa or greater and 150 Pa or less.

摘要翻译： 根据本发明的一个方面的用于焊膏的焊剂包括通过使具有C6-C15烷基的（甲基）丙烯酸酯和除上述（甲基）丙烯酸酯之外的（甲基）丙烯酸酯）自由基共聚得到的丙烯酸类树脂; 和松香。 当松香的重量为1时，丙烯酸树脂的重量比为0.5以上且1.2以下，通过施加10Pa以上且150Pa以下的剪切力使焊膏的焊剂流动，或 减。

公开(公告)号：US07018964B2

公开(公告)日：2006-03-28

申请号：US10240608

申请日：2001-12-28

申请人： Junichi Maeno ,  Shugo Kawakami ,  Kazutaka Zenfuku

发明人： Junichi Maeno ,  Shugo Kawakami ,  Kazutaka Zenfuku

IPC分类号： C11D1/72 ,  C11D3/26 ,  C11D3/36 ,  C11D3/43

CPC分类号： C11D11/0047 ,  C11D1/345 ,  C11D1/44 ,  C11D1/72 ,  C11D1/86 ,  C11D3/2034 ,  C11D3/28 ,  C23G5/036

摘要： The cleaning composition of this invention comprises, as effective components, a compound (A) represented by the formula (1) and a nonionic surfactant (B): wherein R1 represents a hydrogen atom or a straight-chain or branched-chain alkyl group having 1 to 5 carbon atoms and R2 represents a hydrogen atom or a straight-chain or branched-chain alkyl group having 1 to 5 carbon atoms. The cleaning composition of the invention is excellent in detergency and is satisfactory in respect of environmental protection properties, odor and flammability. An article to be cleaned can be cleaned by coming into contact with this cleaning composition.

摘要翻译： 本发明的清洗组合物包含作为有效成分的由式（1）表示的化合物（A）和非离子表面活性剂（B）：其中R 1表示氢原子或直链 - 具有1至5个碳原子的直链或支链烷基，R 2 2表示氢原子或具有1至5个碳原子的直链或支链烷基。 本发明的清洗组合物在洗涤性方面优异，在环保性，气味和可燃性方面是令人满意的。 可以通过与该清洁组合物接触来清洁待清洁的物品。

公开(公告)号：US5798201A

公开(公告)日：1998-08-25

申请号：US887466

申请日：1997-07-02

申请人： Katsumi Inomata ,  Nasahiro Akiyama ,  Toshiyuki Ota ,  Akira Tsuji

发明人： Katsumi Inomata ,  Nasahiro Akiyama ,  Toshiyuki Ota ,  Akira Tsuji

IPC分类号： G03F7/022 ,  G03F7/023

CPC分类号： G03F7/022 ,  Y10S428/901 ,  Y10S428/913

摘要： A radiation sensitive resin composition containing an alkali soluble resin and a 1,2-quinonediazide compound of a polyphenol or a radiation sensitive resin composition containing an alkali soluble resin and a 1,2-quinonediazide compound and a polyphenol compound.

公开(公告)号：US12107271B2

公开(公告)日：2024-10-01

申请号：US17214939

申请日：2021-03-29

申请人： ARAKAWA CHEMICAL INDUSTRIES, LTD.

发明人： Shinji Ozaki ,  Naoki Sasagawa ,  Hideki Goda

IPC分类号： H01M4/62 ,  H01M10/0525 ,  H01M4/02

CPC分类号： H01M4/622 ,  H01M2004/027 ,  H01M10/0525

摘要： Provided are a binder aqueous solution for a lithium ion battery, a negative electrode slurry for a lithium ion battery, a negative electrode for a lithium ion battery, and a lithium ion battery. The binder aqueous solution for a lithium ion battery has a pH of 5 or higher and contains: a water-soluble polymer (A) that is a polymer of a monomer group containing, with respect to 100 mol % of the monomer group, 15 mol % to 99.9 mol % of an unsaturated carboxylic acid or an inorganic salt thereof, and that has a glass transition temperature of 110° C. or lower; and a hydrolyzed partial condensate (B) of an amino group-containing trialkoxysilane.

公开(公告)号：US11658302B2

公开(公告)日：2023-05-23

申请号：US17095750

申请日：2020-11-12

申请人： ARAKAWA CHEMICAL INDUSTRIES, LTD.

发明人： Shinji Ozaki ,  Katsuhiko Ikeyatsu ,  Katsuya Okubo ,  Satoru Aoyama ,  Naoki Sasagawa ,  Hideki Goda

IPC分类号： H01M4/62 ,  C08L1/28 ,  C08L9/06 ,  C08L33/08 ,  C08L77/06 ,  H01M4/13 ,  H01M10/0525

CPC分类号： H01M4/625 ,  C08L1/286 ,  C08L9/06 ,  C08L33/08 ,  C08L77/06 ,  H01M4/13 ,  H01M10/0525 ,  C08L2205/025 ,  C08L2205/03

摘要： To provide a conductive carbon material dispersing agent for a lithium ion battery, a slurry for a lithium ion battery electrode, an electrode for a lithium ion battery, and a lithium ion battery
The disclosure provides a conductive carbon material dispersing agent for a lithium ion battery including a water-soluble poly(meth)acrylamide (A-1) which contains 2 to 60 mol % of structural units derived from a (meth)acrylamide group-containing compound (a) and 10 to 70 mol % of structural units derived from an unsaturated sulfonic acid or salts thereof (b), and which has a weight average molecular weight of 10,000 to 300,000.

公开(公告)号：US20230110098A1

公开(公告)日：2023-04-13

申请号：US17947177

申请日：2022-09-19

申请人： ARAKAWA CHEMICAL INDUSTRIES, LTD.

发明人： Naoki SASAGAWA ,  Shinji OZAKI ,  Satoru AOYAMA ,  Katsuya OKUBO

IPC分类号： H01M4/62 ,  H01M4/04 ,  H01M50/46 ,  H01M50/423

摘要： A binder aqueous solution for power storage device, a slurry for power storage device, an electrode for power storage device, a separator for power storage device, a separator/electrode laminate for power storage device and a power storage device are provided.
The present disclosure provides a binder aqueous solution for power storage device, in which the binder aqueous solution for power storage device contains a water-soluble polymer, the water-soluble polymer contains more than 99 mass% and less than 99.9 mass% of a structural unit derived from a (meth)acrylamide group-containing compound and more than 0.1 mass% and less than 1 mass% of a structural unit derived from an unsaturated hydrocarbon sulfonic acid and/or a salt thereof, and a weight average molecular weight of the water-soluble polymer is less than 300,000.

公开(公告)号：US20230101181A1

公开(公告)日：2023-03-30

申请号：US17954333

申请日：2022-09-28

申请人： ARAKAWA CHEMICAL INDUSTRIES, LTD.

发明人： Takashi Yamaguchi ,  Taiyou Nakamura ,  Atsushi Shiotani ,  Keisuke Sugimoto ,  Madoka Yamashita ,  Takashi Tasaki

IPC分类号： G03F7/037 ,  C08L79/08 ,  C08G73/10

摘要： A curable photosensitive resin composition which can be cured at a relatively low temperature, has excellent developability and adhesion to a support, and a cured product that realizes low dielectric constant properties. A curable photosensitive resin composition containing a polyimide resin (A) which is a reaction product of monomer groups containing an aromatic tetracarboxylic anhydride (a1) and a diamine (a2) containing a dimer diamine, maleimides (B), and a polyfunctional polymerizable compound (C) having two or more ethylenic double bonds other than the component (A) and the component (B), a cured product, a photosensitive element, a resist pattern, a method of producing a resist pattern, a semiconductor device and an electronic device.

公开(公告)号：US11338545B2

公开(公告)日：2022-05-24

申请号：US16606574

申请日：2018-04-17

申请人： National Institute of Advanced Industrial Science and Technology ,  Arakawa Chemical Industries, Ltd.

发明人： Hiroaki Noda ,  Jun Akedo ,  Hideki Goda ,  Takeshi Fukuda ,  Haruhisa Togashi

IPC分类号： B32B5/16 ,  B32B27/08 ,  B32B27/28 ,  B82Y30/00 ,  B82Y40/00

摘要： A laminate comprising a plastic substrate (A); a hardened organic polymer layer (B) provided on a surface of the plastic substrate (A) and having a storage elastic modulus of from 0.01 to 5 GPa and tan δ of from 0.1 to 2.0 at 25° C. which are measured at a temperature elevating rate of 2° C./min by a dynamic viscoelasticity test stipulated in JIS K 7244; an organic/inorganic composite layer (C) provided on a surface of the hardened organic polymer layer (B) and containing covalently bound organic polymer and metal oxide nanoparticles; and an inorganic layer (D) provided on a surface of the organic/inorganic composite layer (C) and comprising secondary particles of ceramic or metal.