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公开(公告)号：US11721522B2
公开(公告)日：2023-08-08
申请号：US17835521
申请日：2022-06-08
IPC分类号： H01J37/32 , H01L21/67 , H01L21/311
CPC分类号： H01J37/32091 , H01J37/32422 , H01J37/32449 , H01L21/31116 , H01L21/31138 , H01L21/31144 , H01L21/67069 , H01J2237/334
摘要： A capacitively coupled plasma processing apparatus includes a chamber; a gas supply that supplies an inert gas into the chamber; a substrate support including a lower electrode; an upper electrode provided above the substrate support and including silicon; a first radio-frequency power supply electrically connected to the upper electrode; a second radio-frequency power supply electrically connected to the lower electrode; a bias power supply that applies a negative bias voltage to the upper electrode; and a controller that controls an overall operation of the capacitively coupled plasma processing apparatus such that the silicon-containing material is deposited on sidewalls of a mask of the substrate to narrow an opening formed on the mask by an amount greater in a second direction than in a first direction.
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公开(公告)号：US11715643B2
公开(公告)日：2023-08-01
申请号：US16890141
申请日：2020-06-02
发明人： Subhadeep Kal , Daisuke Ito , Matthew Flaugh , Yusuke Muraki , Aelan Mosden
IPC分类号： H01L21/3213 , C23F1/12 , C23F1/02 , H01L21/66 , H01L21/306 , H01L21/02
CPC分类号： H01L21/32135 , C23F1/02 , C23F1/12 , H01L21/30621 , H01L21/32136 , H01L21/32138 , H01L22/12 , H01L21/0228
摘要： A method for the dry removal of a material on a microelectronic workpiece is described. The method includes receiving a substrate having a working surface exposing a metal layer and having at least one other material exposed or underneath the metal layer; and differentially etching the metal layer relative to the other material by exposing the substrate to a controlled gas-phase environment containing an anhydrous halogen compound.
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公开(公告)号：US11694881B2
公开(公告)日：2023-07-04
申请号：US17127607
申请日：2020-12-18
发明人： Hiroki Endo , Katsuyuki Koizumi , Naohiko Okunishi
IPC分类号： H01L21/683 , H01L21/67 , H01J37/32
CPC分类号： H01J37/32724 , H01J37/32697 , H01L21/67103 , H01L21/67248 , H01L21/6831 , H01L21/6833 , H01J2237/2001
摘要： A stage according to an exemplary embodiment has an electrostatic chuck. The electrostatic chuck has a base and a chuck main body. The chuck main body is provided on the base and configured to hold a substrate with electrostatic attractive force. The chuck main body has a plurality of first heaters and a plurality of second heaters. The number of second heaters is larger than the number of first heaters. The first heater controller drives the plurality of first heaters by an alternating current output or a direct current output from a first power source. The second heater controller drives the plurality of second heaters by an alternating current output or a direct current output from a second power source which has electric power lower than electric power of the output from the first power source.
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公开(公告)号：US11623776B2
公开(公告)日：2023-04-11
申请号：US16997002
申请日：2020-08-19
申请人： MAX CO., LTD.
发明人： Satoshi Taguchi
摘要： A binding machine that binds objects with a tape, the binding machine includes a staple magazine unit configured to accommodate a plurality of staples, a main handle, a clincher arm configured to approach a leading staple of the plurality of staples and a clincher configured to bend the leading staple. The clincher has, on a surface thereof, a first groove that extends in an acute angle direction with respect to an axial direction of a rotation shaft of the clincher arm and has a first groove length and a first groove width, and a second groove that extends in an acute angle direction with respect to the axial direction of the rotation shaft of the clincher arm and has a second groove length and a second groove width. The second groove is disposed offset with respect to the first groove in a width direction of the first groove.
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公开(公告)号：US11613391B2
公开(公告)日：2023-03-28
申请号：US16997017
申请日：2020-08-19
申请人： MAX CO., LTD.
发明人： Satoshi Taguchi , Kenji Kobayashi
摘要： A binding machine includes: a main handle configured to accommodate a staple; a staple driver supported by the main handle and configured to drive the staple; and a clincher arm rotatably attached to the main handle and including a clincher, the clincher being configured to clinch the staple driven by the staple driver. The staple driver includes: a driving portion that extends in a direction away from the main handle and is configured to drive the staple toward the clincher, and an attachment portion with which the driving portion is attached to the main handle, and the attachment portion extends in a longitudinal direction of the main handle from a side edge of the driving portion.
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公开(公告)号：US11597548B2
公开(公告)日：2023-03-07
申请号：US16997008
申请日：2020-08-19
申请人： MAX CO., LTD.
发明人： Satoshi Taguchi , Hiroki Uchiyama
摘要： A binding machine, includes a staple guide portion adjacent to a staple in a staple accommodating portion. A staple driver moves from below to above and pushes the staple located at the front end portion upward while pushing the crown portion of the staple. A clincher abuts against the pair of leg portions of the staple pushed out in a process of the staple driver moving upward from below so as to fold the pair of leg portions. The staple guide supports the crown portion of the staple from a side near a base end portion of the crown portion in a process of the staple being pushed out.
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公开(公告)号：US11594422B2
公开(公告)日：2023-02-28
申请号：US17409645
申请日：2021-08-23
IPC分类号： H01L21/311 , H01J37/32
摘要： An etching method includes a step of selectively forming deposit on a top surface of a mask disposed on a film of a substrate, a step of etching the film after the step of forming the deposit, a step of forming a layer of chemical species included in plasma of a processing gas, on the substrate, and a step of supplying ions from plasma of an inert gas to the substrate so that the chemical species react with the film.
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公开(公告)号：US11574798B2
公开(公告)日：2023-02-07
申请号：US16872432
申请日：2020-05-12
发明人： Chishio Koshimizu , Shin Hirotsu
摘要： A plasma processing apparatus includes a container; a stage disposed in the container and including an electrode; a plasma source that generates plasma in the container; a bias power supply that periodically supplies a pulsed negative DC voltage to the electrode; an edge ring disposed to surround a substrate placed on the stage; and a DC power supply that supplies a DC voltage to the edge ring. The DC power supply supplies a first DC voltage in a first time period when the pulsed negative DC voltage is not supplied to the electrode, and supplies a second DC voltage in a second time period when the pulsed negative DC voltage is supplied to the electrode.
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公开(公告)号：US11562889B2
公开(公告)日：2023-01-24
申请号：US17105938
申请日：2020-11-27
发明人： Mayo Uda , Manabu Tsuruta , Keigo Toyoda
摘要： A plasma processing apparatus includes a chamber having a sidewall and a plasma processing space surrounded by the sidewall, and a first side gas inlet line and a second side gas inlet line configured to introduce at least one gas from the sidewall into the plasma processing space. The first side gas inlet line includes a plurality of first side gas injectors symmetrically arranged along a circumferential direction on the sidewall and configured to introduce the gas in a first direction into the plasma processing space. Further, the second side gas inlet line includes a plurality of second side gas injectors symmetrically arranged along the circumferential direction on the sidewall and configured to introduce the gas in a second direction different from the first direction into the plasma processing space.
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公开(公告)号：US11559877B2
公开(公告)日：2023-01-24
申请号：US17387398
申请日：2021-07-28
申请人： MAX CO., LTD.
IPC分类号： B25C11/00
摘要： A staple removing device includes a device body, a removing part provided in the device body and configured to execute a staple removing operation of removing a staple from a sheet bundle, an accommodation unit detachably mounted to the device body and configured to accommodate the staple removed by the removing part, a count unit configured to count a number of operation times of the staple removing operation, a detection unit configured to detect whether the accommodation unit is attached or detached with respect to the device body, a measurement unit configured to measure an elapsed time after the detection unit detects that the accommodation unit is removed from the device body, and an operation-times reset unit that resets the number of operation times when the elapsed time becomes a predetermined time or longer.
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