公开(公告)号：US5188280A

公开(公告)日：1993-02-23

申请号：US812024

申请日：1991-12-23

申请人： Takashi Nakao ,  Yoshiaki Emoto ,  Koichiro Sekiguchi ,  Masayuki Iketani ,  Kunizo Sahara ,  Ikuo Yoshida ,  Akiomi Kohno ,  Masaya Horino ,  Hideaki Kamohara ,  Shouichi Irie ,  Hiroshi Akasaki ,  Kanji Otsuka

发明人： Takashi Nakao ,  Yoshiaki Emoto ,  Koichiro Sekiguchi ,  Masayuki Iketani ,  Kunizo Sahara ,  Ikuo Yoshida ,  Akiomi Kohno ,  Masaya Horino ,  Hideaki Kamohara ,  Shouichi Irie ,  Hiroshi Akasaki ,  Kanji Otsuka

IPC分类号： H01L21/48 ,  H01L21/60 ,  H01L23/055 ,  H01L23/498 ,  H05K3/34

CPC分类号： H01L24/81 ,  H01L21/4853 ,  H01L23/055 ,  H01L23/49816 ,  H05K3/3478 ,  H01L2224/11003 ,  H01L2224/13111 ,  H01L2224/136 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/166 ,  H05K2203/0113 ,  H05K2203/016 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K3/3489

摘要： A technique for producing a chip mount type package or a TAB package with high reliability, without use of a flux which would cause environmental pollution or would hinder an enhancement of reliability, more particularly pertains to a method of irradiating bonding surfaces, for which a solder is used, and solder bump electrodes of a package with an atomic or ion energy beam, and bonding the bonding surfaces to each other under normal pressure (about 1 atm) in a continuous apparatus.

摘要翻译： 具有高可靠性的芯片安装型封装或TAB封装的生产技术，不使用会导致环境污染或阻碍可靠性提高的焊剂，更具体地涉及一种照射焊接面的方法，焊接面 以及具有原子或离子能量束的封装的焊料凸块电极，并且在连续设备中在常压（约1atm）下将结合表面彼此粘合。

公开(公告)号：US5163209A

公开(公告)日：1992-11-17

申请号：US510875

申请日：1990-04-18

申请人： Takeshi Harada ,  Masatoshi Kanamaru ,  Akiomi Kohno ,  Shigeru Jomura

发明人： Takeshi Harada ,  Masatoshi Kanamaru ,  Akiomi Kohno ,  Shigeru Jomura

IPC分类号： H01L41/047 ,  H01L41/083 ,  H01L41/297

CPC分类号： H01L41/297 ,  H01L41/0477 ,  H01L41/083 ,  Y10T29/42

摘要： In an overall stacked piezoelectric element, the material for the electrode was selected from aluminum, nickel and copper each alone or alloys based on aluminum, nickel or copper, and further the parts of the electrode which contact with molding resin on the side face of the stacked body and the parts which have to be insulated from the lead-out terminals were subjected to an oxidation or nitriding treatment. As the result, an improved element was obtained which is of a high reliability, suited to low voltage operation and suffers no short-circuit of the electrode even when water permeates to the side face of the stacked body during operation in humid atmosphere.

公开(公告)号：US5090609A

公开(公告)日：1992-02-25

申请号：US514943

申请日：1990-04-26

申请人： Takashi Nakao ,  Yoshiaki Emoto ,  Koichiro Sekiguchi ,  Masayuki Iketani ,  Kunizo Sahara ,  Ikuo Yoshida ,  Akiomi Kohno ,  Masaya Horino ,  Hideaki Kamohara ,  Shouichi Irie ,  Hiroshi Akasaki ,  Kanji Otsuka

发明人： Takashi Nakao ,  Yoshiaki Emoto ,  Koichiro Sekiguchi ,  Masayuki Iketani ,  Kunizo Sahara ,  Ikuo Yoshida ,  Akiomi Kohno ,  Masaya Horino ,  Hideaki Kamohara ,  Shouichi Irie ,  Hiroshi Akasaki ,  Kanji Otsuka

IPC分类号： H01L21/48 ,  H01L21/60 ,  H01L23/055 ,  H01L23/498 ,  H05K3/34

CPC分类号： H01L24/81 ,  H01L21/4853 ,  H01L23/055 ,  H01L23/49816 ,  H05K3/3478 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13111 ,  H01L2224/136 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/166 ,  H05K2203/0113 ,  H05K2203/016 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K3/3489

摘要： An invention relating to a technique for producing a chip mount type package or a TAB package with high reliability, without use of a flux which would cause environmental pollution or would hinder an enhancement of reliability, and more particularly pertaining to a method of irradiating bonding surfaces, for which a solder is used, and solder bump electrodes of a package with an atomic or ion energy beam and bonding the bonding surfaces to each other under normal pressure (about 1 atm) in a continuous apparatus.

摘要翻译： 本发明涉及一种具有高可靠性的芯片安装型封装或TAB封装的生产技术，而不使用会引起环境污染或阻碍可靠性提高的焊剂，更具体地涉及一种照射焊接表面的方法 ，以及具有原子或离子能量束的封装的焊料凸块电极，并且在连续设备中在常压（约1atm）下将结合表面彼此粘合。

公开(公告)号：US5964398A

公开(公告)日：1999-10-12

申请号：US929089

申请日：1997-09-15

申请人： Akiomi Kohno ,  Kazuaki Yokoi ,  Keiji Taguchi ,  Hiroshi Misumi ,  Yoshiharu Ueyama ,  Kazuyuki Koide ,  Koji Hayashi

发明人： Akiomi Kohno ,  Kazuaki Yokoi ,  Keiji Taguchi ,  Hiroshi Misumi ,  Yoshiharu Ueyama ,  Kazuyuki Koide ,  Koji Hayashi

IPC分类号： B23K20/00 ,  B23K20/02 ,  B23K20/16 ,  C21D1/00 ,  C21D9/00 ,  F04D29/02 ,  F04D29/22 ,  F04D29/28 ,  F04D29/54 ,  B23K31/00 ,  B23P15/04

CPC分类号： B23K20/023 ,  B23K20/16 ,  F04D29/023 ,  F04D29/026 ,  F04D29/2222 ,  F04D29/284 ,  F05D2230/236 ,  F05D2300/10 ,  F05D2300/11 ,  F05D2300/171 ,  Y10T29/49325 ,  Y10T29/49336

摘要： A vane member comprises a first member and a second member, the first member and the second member are joined by that an insert member whose melting temperature is lower than melting temperatures of the first and second members contacts the first and second members, the insert member is heated to a welding temperature which is lower than the melting temperatures of the first and second members and is higher than the melting temperature of the insert member so that a mutual diffusion between at least an original base component of the insert member and at least an original base component of the first member different from the original base component of the insert member and a mutual diffusion between at least the original base component of the insert member and at least an original base component of the second member different from the original base component of the insert member are caused by the heating, and the mutual diffusions by the heating are continued at least until the original base component of the insert member is replaced by at least one of the original base components of the first member and the second member and the at least one of the original base components of the first member and the second member becomes a substitute base component of the insert member.

摘要翻译： 叶片构件包括第一构件和第二构件，第一构件和第二构件通过熔化温度低于第一和第二构件的熔化温度的插入构件接合第一和第二构件而接合，插入构件 被加热到低于第一和第二构件的熔化温度的焊接温度并且高于插入构件的熔化温度，使得至少插入构件的原始基底部件和至少一个 第一构件的原始基座部件与插入构件的原始基座部件不同，并且至少在插入构件的原始基座部件和至少与第二构件的原始基座部件之间的相互扩散不同于原始基座部件 插入构件由加热引起，并且通过加热的相互扩散继续至少直到原始 插入构件的基部构件被第一构件和第二构件的原始基座构件中的至少一个代替，并且第一构件和第二构件的原始基础构件中的至少一个成为第二构件的替代基础构件 插入成员。

公开(公告)号：US5276573A

公开(公告)日：1994-01-04

申请号：US801352

申请日：1991-12-02

申请人： Takeshi Harada ,  Masatoshi Kanamaru ,  Atsushi Hosogane ,  Akiomi Kohno ,  Kenji Mori

发明人： Takeshi Harada ,  Masatoshi Kanamaru ,  Atsushi Hosogane ,  Akiomi Kohno ,  Kenji Mori

IPC分类号： G11B5/60 ,  G11B21/21

CPC分类号： G11B5/6005 ,  G11B21/21 ,  G11B5/483

摘要： A slider unit having a reading or reproducing head, with the head being adapted to float over a surface of an information recording disc. The slider unit includes a slider body having a flying height sensor with float surfaces on an underside thereof to generate a lifting force. A piezoelectrically or electrostatically controlled valve layer may be positioned over a vent communicating between an upper surface of the slider, with the vent opening to a recess for generating a negative lift component at an underside of the slider unit. The slider body is made from a ceramic base portion and includes a semiconductive insert portion of, for example, silicon or a photosensitive glass with an adjustment device being formed by utilization of microfabrication techniques such as deposition and etching.

摘要翻译： 具有读取或再现头的滑块单元，其头部适于在信息记录盘的表面上浮动。 滑块单元包括具有飞行高度传感器的滑块体，浮体表面在其下侧以产生提升力。 压电或静电控制的阀层可以位于在滑块的上表面之间连通的通风口上，通气口通向凹槽，用于在滑块单元的下侧产生负提升部件。 滑块体由陶瓷基部制成，并且包括例如硅或感光玻璃的半导体插入部分，其中调整装置通过利用诸如沉积和蚀刻的微细加工技术形成。

公开(公告)号：US4854495A

公开(公告)日：1989-08-08

申请号：US63419

申请日：1987-06-18

申请人： Akihiko Yamamoto ,  Akiomi Kohno ,  Toshihiri Yamada ,  Motohiro Satou ,  Keiji Taguchi ,  Kazuaki Yokoi

发明人： Akihiko Yamamoto ,  Akiomi Kohno ,  Toshihiri Yamada ,  Motohiro Satou ,  Keiji Taguchi ,  Kazuaki Yokoi

IPC分类号： B23K1/18 ,  B23K1/19 ,  B23K35/00 ,  C04B37/00 ,  C04B37/02 ,  H01L21/50

CPC分类号： C04B35/645 ,  B23K1/18 ,  B23K1/19 ,  B23K35/001 ,  C04B37/006 ,  C04B37/026 ,  H01L21/50 ,  C04B2235/6581 ,  C04B2237/12 ,  C04B2237/121 ,  C04B2237/123 ,  C04B2237/124 ,  C04B2237/34 ,  C04B2237/341 ,  C04B2237/343 ,  C04B2237/365 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/401 ,  C04B2237/403 ,  C04B2237/406 ,  C04B2237/407 ,  C04B2237/592 ,  C04B2237/708 ,  C04B2237/72 ,  C04B2237/84

摘要： This invention discloses a method of soldering together at least two members selected form metals and ceramics, which comprises successively jointing a high-melting jointing material, a medium-melting jointing material, and a low-melting jointing material, and a sealing structure prepared by this method.The method according to present invention enables the preparation of a sealing structure having a soldered area which is excellent in tightness.

摘要翻译： 本发明公开了一种将选自金属和陶瓷的至少两种构件焊接在一起的方法，其中包括连续地接合高熔点接头材料，中熔接头材料和低熔点接合材料，以及由 这种方法。 根据本发明的方法能够制备具有优良密封性的焊接区域的密封结构。

公开(公告)号：US4624403A

公开(公告)日：1986-11-25

申请号：US681253

申请日：1984-12-13

申请人： Akiomi Kohno ,  Susumu Hioki ,  Toshihiro Yamada ,  Kazuaki Yokoi ,  Akihiko Yamamoto

发明人： Akiomi Kohno ,  Susumu Hioki ,  Toshihiro Yamada ,  Kazuaki Yokoi ,  Akihiko Yamamoto

IPC分类号： B23K20/00 ,  C04B37/02 ,  B23K20/22

CPC分类号： C04B35/645 ,  C04B37/026 ,  C04B2235/6581 ,  C04B2237/123 ,  C04B2237/126 ,  C04B2237/365 ,  C04B2237/368 ,  C04B2237/401 ,  C04B2237/406 ,  C04B2237/60 ,  C04B2237/706 ,  C04B2237/708 ,  C04B2237/78

摘要： The present invention relates to a method for bonding a non-oxide ceramic to a metal through an intermediate material comprising at least one member selected from metals of the Groups VIa and VIII of the Periodic Table. This method is suitably used for bonding of a structural part of a machine, an electronic part and the like.

摘要翻译： 本发明涉及通过中间体材料将非氧化物陶瓷与金属结合的方法，所述中间材料包含选自元素周期表第VIa和VIII族金属中的至少一种。 该方法适用于机器的结构部件，电子部件等的接合。