Abstract:
A socket connector includes a housing having a base and a plurality of sidewalls extending upwardly from the base. The base and the sidewalls define a receiving cavity for receiving an electronic package. A plurality of carbon nanotube contacts for signal transmission and a plurality of metallic contacts for power transmission are mounted within the housing respectively.
Abstract:
An electrical connection system for an optoelectronic socket comprises an optoelectronic socket (1), an OE package (2) assembled to the optoelectronic socket (1), and a circuit board (4). The optoelectronic socket (1) comprises a plurality of passageways (104) embedded with an optical member (12) respectively, and a number of electrical contacts. The OE package (2) comprises a plurality of lenses (20) located at bottom portion thereof and a plurality of electrical pads (22) located at peripheral of the bottom portion. Bottom end of the lens (20) of the OE package (2) are received in the passageway (104) and the electrical pads (22) contact with the electrical contacts (14). The optical member (12) is received in recess on upper face of the circuit board (4) and connects with a waveguide (40) positioned in the recess. The electrical contact is soldered to the circuit board.
Abstract:
Disclosed herewith a socket connector configured with an insulative housing defining a mating interface surrounded with peripheral walls and a mounting surface. A plurality of passageways is defined between the mating interface and the mounting surface and having an opening at the mounting surface. The insulative housing includes an encampment associated with each of the passageway at the mounting surface, and includes an extension crossing over an inner wall of the passageway to substantially narrow the opening of the opening. The socket connector furthers includes a plurality of contact terminals each received in the passageway and further includes a curvilinear solder portion extending beyond the mounting surface. And the socket connector further is incorporated with a plurality of solder balls each disposed between the encampment and the curvilinear solder portion.
Abstract:
The invention provides a naturally occurring strain of Lactobacillus crispatus with advantageous characteristics. The strain colonizes mucosal surfaces, particularly vaginal surfaces. The strain is also capable of rapid growth in a number of conditions and is highly viable after desiccation. Moreover, the strain is capable of preventing and reducing pathogenic infection of vaginal mucosa.
Abstract:
Task-oriented management is provided for managing server configuration settings. The server configuration settings are logically grouped into a set of tasks. User interface elements are mapped to each task in the set of tasks. The task represented by a user interface element is also mapped to one or more of the server configuration settings. The task list is displayed that includes each of the mapped tasks. When a task is selected, a user interface page module is displayed. Using the user interface page module, the server configuration settings that correspond to the task are modified as the task is completed when the user selects corresponding actions as the user is guided through the task.
Abstract:
An integrated circuit for locating failure process layers. The circuit has a substrate with a scan chain disposed therein, having scan cells connected to form a series chain. Each connection is formed according to a layout constraint of a minimum dimension provided by design rules for an assigned routing layer. Since the connection in the assigned routing layer is constrained to a minimum, the scan chain is vulnerable to variations in processes relevant to the assigned routing layer. The scan chain makes it easier to locate processes causing low yield rate of the scan chain.
Abstract:
The present invention concerns a process for the fabrication of electrical and electronic devices. A polymer film is patterned on a substrate. A thick film paste is deposited over the patterned polymer. The thick film paste is dried under conditions which allow diffusion of the polymer into the thick film paste. This renders the diffused area insoluble in alkaline development solution.
Abstract:
An enhanced memory module assembly comprises a memory module including a substrate with a plurality of conductive traces arranged in an edge thereof. A connector includes a first housing having a memory module receiving slot extending along a longitudinal direction thereof. The housing further defines a plurality of terminal cells with a plurality of first terminals assembled therein. Each terminal includes a first end extending into the elongate slot for electrically contacting with the conductive traces. A ZIF device is arranged between the memory module and includes a pair of actuator receiving slots located in the housing and in communicating with the terminal cells, and an actuator attached to the memory module. The actuator includes a pair of actuating plates extending into the actuator receiving slots thereby pushing the terminals in electrical contact with the conductive traces when the memory module is completely inserted therein.
Abstract:
An electrical system comprises a panel defining at least an opening and a retaining hole therein. A first connector is adapted to be attached to the panel. A panel-mount attachment is engageable with the retaining hole for attaching the electrical connector to the panel. The panel-mount attachment includes a base plate in which a housing of the connector is integrally formed therewith, and a supporting post extending from the base plate. At least a deflectable vane sector extends outward and downward from an top portion of the post toward the base plate and a gap defined between a free end of the vane sector and the base plate for receiving the panel therebetween. The attachment further includes a guiding device formed in the supporting post.