Abstract:
Apparatuses, methods, and systems directed to facilitate the management and/or security of network login and authentication systems. Some embodiments of the invention allow users to maintain a plurality of user accounts with a given domain, and switch among multiple login sessions. In other particular embodiments, the systems disclosed below can be used to identify and prevent phishing attacks. In some embodiments, the present invention involves using a personal identification number or string as an additional security measure. In some other embodiments, the present invention involves using an application identifier while establishing a login session with the network server.
Abstract:
An apparatus for fixing a storage device includes a metal bracket, and a fixing frame slidably received in the bracket. The bracket includes two side plates, and one of the side plates forms a resilient tab. The fixing frame includes two opposite fixing arms each defining a latching hole, two resilient members, and two metal fasteners. Each resilient member includes a pad clinging to an inner surface of a corresponding one of the fixing arms, and a projection engaging in the latching hole of the corresponding fixing arm. Each fastener includes a head, and a pin. The heads are received in the corresponding latching holes and abut against outer sides of the corresponding projections. The pins extend through the corresponding through holes for engaging with the storage device. A protrusion extends outwards from one of the heads to contact the resilient tab and connect the storage device to ground.
Abstract:
Disclosed is an ink composition used in an electrowetting display device and an electrowetting display device employing the same. The ink composition used in the electrowetting display device includes a non-polar solvent and a modified hydrophobic pigment, wherein the modified hydrophobic pigment has a structure represented by Formula (I), of P-Gn wherein P is a pigment moiety, n is 1-4 and G is wherein R1 is a straight chain or a branched C4-20 alkyl group, or C5-20 cycloalkyl group.
Abstract:
The invention described here is the methods of using a hardware-based functional verification system to mimic a design under test (DUT), under intended application environment and software, to record or derive the transition activities of all circuits of the DUT, then calculate the total or partial power consumption during the period of interest. The period of interest is defined by the user in terms of “events” which are the arbitrary states of the DUT. Furthermore, the user can specify the number of sub-divisions required between events thus vary the apparent resolution of the power consumption profile.
Abstract:
For a removable device such as a USB pen drive, two components are relatively moveable with each other by sliding, rotating, or rolling over. When a second component moves with respect to a first component, the clearance between the two components ensures durability of the removable device. As the second component moves to and is configured at an extended position, a first biasing element on the first component abuts and pushed a second biasing element on the second component so that ground nodes of the second component contact with a conductive section of the first component. The ground path way is then established for ESD protection. As the second component moves out of the extend position, the connection between the ground nodes and the conductive section no longer exists and the clearance between the two components exists again.
Abstract:
A method for forming a T-shaped gate is provided. The method includes providing a substrate. Then, a photoresist structure is formed over the substrate. The photoresist structure includes two development rates. Next, a mask with an opening is formed over the photoresist structure to pattern the photoresist structure. An angle exposure is applied to the photoresist structure, and the exposed photoresist structure is developed to form a T-shaped notch. A width of the T-shaped notch is gradually reduced from a top portion thereof to a bottom portion to expose a surface of the substrate. Then, a gate metal is deposited in the T-shaped notch. Thereafter, the patterned photoresist structure is removed to form the T-shaped gate.
Abstract:
A photoelectric device includes a ceramic substrate defining a cavity in a top thereof and having two electrode layers beside the cavity. A photoelectric die is received in the cavity. A first packing layer is received in the cavity and encapsulates the photoelectric die. The photoelectric die is electrically connected with the electrode layers via two wires. A reflective cup is mounted on the ceramic substrate and defines a receiving space above the top of the ceramic substrate and the first packing layer. A second packing layer is received in the receiving space and covers the first packing layer.
Abstract:
A control system for a machine is disclosed. The control system may have a power source, an operator input device configured to generate a first signal indicative of a desired mode of power source operation, and a work implement driven by the power source. The control system may also have a controller in communication with the power source and the operator input device. The controller may be configured to classify a currently performed work implement task and select an output map based on the classification of the currently performed work implement task and the first signal. The controller may further be configured to control the power source operation using the output map.
Abstract:
A semiconductor package includes at least four lead frames each having an extending portion and a connecting portion, a heat dissipation plate having a top surface and a bottom surface, at least one semiconductor chip positioned on the top surface of the heat dissipation plate. At least one conductive wire electrically connects the chip to the lead frames. An encapsulation covers the lead frames, the heat dissipation plate, the semiconductor chip, and the conductive wires, while the bottom surface of the heat dissipation plate and the extending portions of the lead frames are exposed.