摘要:
Disclosed herein is a method for forming a dual gate of a semiconductor device. The method comprises the steps of forming a first polysilicon layer doped with p-type impurity ions and a second polysilicon layer doped with n-type impurity ions on a first region and a second region of a semiconductor substrate, respectively, and sequentially subjecting the surfaces of the first and second polysilicon layers to first wet cleaning, second wet cleaning and dry cleaning.
摘要:
A multiplying digital to analog converter comprising a digital to analog converter having a plurality of capacitors coupled in parallel, applying first signals to the capacitors during a sampling period, and applying second signals to the capacitors during an amplifying period, and an amplifier including a first amplifier electrically coupled to the digital to analog converter; a second amplifier electrically coupled to the first amplifier; and a first switch electrically coupled between an input end and an output end of the second amplifier, being turned off during a sampling period, and being turned off during an amplifying period.
摘要:
A method for fabricating a semiconductor device includes forming a multilayer, forming a plurality of patterns by etching the multilayer and a portion of the substrate, forming a supporter to support the plurality of patterns, and removing residues formed during the etching.
摘要:
A method for forming a capacitor of a semiconductor device includes the steps of forming first and second sacrificial insulation layers over a semiconductor substrate divided into first and second regions. The second and first sacrificial insulation layers in the first region are etched to define in the first region of the semiconductor substrate. Storage nodes on surfaces of the holes are formed. A partial thickness of the second sacrificial insulation layer is etched to partially expose upper portions of the storage nodes. A mask pattern is formed to cover the first region while exposing the second sacrificial insulation layer remaining in the second region. The exposed second sacrificial insulation layer in the second region is removed to expose the first sacrificial insulation layer in the second region. The exposed first sacrificial insulation layer in the second region and the first sacrificial insulation layer in the first region is removed. The mask pattern is removed. The second sacrificial insulation layer remaining in the first region is removed.
摘要:
Provided is a pixel driving circuit including a threshold voltage compensation circuit. The pixel driving circuit includes a diode-connected type first transistor through which input current data flows; a second transistor copying the current data flowing through the first transistor; a third transistor connected in series to the second transistor; a fourth transistor diode-connected between a power supply voltage terminal and the third transistor; and a driving transistor connected to the power supply voltage terminal, copying the current data flowing through the third transistor, and providing the data to a light emitting diode. Since the pixel driving circuit compensates for variation in the threshold voltage of the driving transistor driving each pixel, brightness uniformity of pixels according to applied current data can be maintained.
摘要:
A digital-to-analog converter (DAC) for a sigma-delta modulator is provided. The DAC has a switched capacitor structure using an operational amplifier (OP amp) and performs a function exceeding 3-level using a switching method employing only one capacitor in single ended form. Thus, DAC non-linearity caused by capacitor mismatching does not occur, and the number of output levels of the DAC is increased. Also, the DAC capacitor may be applied to a general DAC to increase the ratio of DAC output levels to capacitors.
摘要:
A metal line in a semiconductor device includes an insulation layer having trenches formed therein, a barrier metal layer formed over the insulation layer and the trenches, a metal layer formed over the barrier metal layer, wherein the metal layer fills the trenches, and an anti-galvanic corrosion layer formed on an interface between the metal layer and the barrier metal layer.
摘要:
A method for fabricating a semiconductor device includes forming a multilayer, forming a plurality of patterns by etching the multilayer and a portion of the substrate, forming a supporter to support the plurality of patterns, and removing residues formed during the etching.
摘要:
A metal line in a semiconductor device includes an insulation layer having trenches formed therein, a barrier metal layer formed over the insulation layer and the trenches, a metal layer formed over the barrier metal layer, wherein the metal layer fills the trenches, and an anti-galvanic corrosion layer formed on an interface between the metal layer and the barrier metal layer.
摘要:
A cylinder type storage node is made by, inter alia: forming a sacrificial oxide layer containing organic material over a semiconductor substrate; defining holes for storage nodes by etching the sacrificial oxide layer; forming storage nodes on surfaces of the holes; and removing the sacrificial oxide layer through wet etching and removing the organic material contained in the sacrificial oxide layer using ozone gas.