公开(公告)号：US20130193565A1

公开(公告)日：2013-08-01

申请号：US13362818

申请日：2012-01-31

Applicant: Chih-Chiang Tu ,  Chun-Lang Chen ,  Boming Hsu ,  Tran-Hui Shen

Inventor： Chih-Chiang Tu ,  Chun-Lang Chen ,  Boming Hsu ,  Tran-Hui Shen

IPC: H01L23/58 ,  H01L21/302 ,  H01L21/31

CPC classification number: H01L21/0332 ,  G03F1/26 ,  G03F1/46 ,  H01L21/0337 ,  H01L21/31 ,  H01L21/31116 ,  H01L22/26

Abstract: Provided is a method for creating a mask blank that include a stop layer. The stop layer is optically compatible and process compatible with other layers included as part of the mask blanks. Such blanks may include EUV, phase-shifting, or OMOG masks. The stop layer includes molybdenum, silicon, and nitride in a proportion that allows for compatibility and aids in detection by a residual gas analyzer. Provided is also a method for the patterning of mask blanks with a stop layer, particularly the method for removing semi-transparent residue defects that may occur due to problems in prior mask creation steps. The method involves the detect of included materials with a residual gas analyzer. Provided is also a mask blank structure which incorporates the compatible stop layer.

Abstract translation: 提供了一种用于创建包括停止层的掩模坯料的方法。 停止层是光学兼容的，并且与作为掩模坯料的一部分包括的其它层的工艺兼容。 这样的空白可以包括EUV，相移或OMOG掩模。 停止层包括钼，硅和氮化物，其比例允许相容性，并有助于残留气体分析仪的检测。 还提供了具有停止层的掩模坯料图案化的方法，特别是用于去除由于先前的掩模制造步骤中的问题而可能发生的半透明残留缺陷的方法。 该方法包括用残留气体分析仪检测包含的材料。 还提供了一种掩模空白结构，其结合了相容的停止层。

公开(公告)号：US08445953B2

公开(公告)日：2013-05-21

申请号：US12765658

申请日：2010-04-22

Applicant: Ming-Hui Shen ,  Shih-Chang Liu ,  Chi-Hsin Lo ,  Chia-Shiung Tsai ,  Tsun Kai Tsao

Inventor： Ming-Hui Shen ,  Shih-Chang Liu ,  Chi-Hsin Lo ,  Chia-Shiung Tsai ,  Tsun Kai Tsao

IPC: H01L29/788

CPC classification number: H01L29/788 ,  H01L21/28273 ,  H01L21/823468 ,  H01L27/11521

Abstract: A flash memory cell structure is provided. A semiconductor structure includes a semiconductor substrate, a floating gate overlying the semiconductor substrate, a word-line adjacent to the floating gate, an erase gate adjacent to a side of the floating gate opposite the word-line, a first sidewall disposed between the floating gate and the word-line, and a second sidewall disposed between the floating gate and the erase gate. The first sidewall has a first characteristic and the second sidewall has a second characteristic. The first characteristic is different from the second characteristic.

Abstract translation: 提供闪存单元结构。 半导体结构包括半导体衬底，覆盖半导体衬底的浮动栅极，与浮动栅极相邻的字线，与浮动栅极相对的与字线相对的擦除栅极，设置在浮置栅极之间的第一侧壁 栅极和字线，以及设置在浮置栅极和擦除栅极之间的第二侧壁。 第一侧壁具有第一特征，第二侧壁具有第二特征。 第一个特征与第二个特征不同。

公开(公告)号：US08431473B2

公开(公告)日：2013-04-30

申请号：US13177573

申请日：2011-07-07

Applicant: Shu-Hui Hu ,  Shih-Feng Su ,  Hui-Shen Shih ,  Chih-Chien Liu ,  Po-Chun Chen ,  Ya-Jyuan Hung ,  Bin-Siang Tsai ,  Chin-Fu Lin

Inventor： Shu-Hui Hu ,  Shih-Feng Su ,  Hui-Shen Shih ,  Chih-Chien Liu ,  Po-Chun Chen ,  Ya-Jyuan Hung ,  Bin-Siang Tsai ,  Chin-Fu Lin

IPC: H00L21/28

CPC classification number: H01L21/76801

Abstract: A method for fabricating a semiconductor device is disclosed. The method includes the steps of: providing a substrate; forming a dielectric layer on the substrate, wherein the dielectric layer comprises metal interconnects therein; forming a top metal layer on the dielectric layer; and forming a passivation layer on the top metal layer through high-density plasma chemical vapor deposition (HDPCVD) process.

Abstract translation: 公开了一种制造半导体器件的方法。 该方法包括以下步骤：提供衬底; 在所述衬底上形成电介质层，其中所述电介质层包括金属互连; 在所述电介质层上形成顶部金属层; 并通过高密度等离子体化学气相沉积（HDPCVD）工艺在顶层金属层上形成钝化层。

公开(公告)号：US20130099254A1

公开(公告)日：2013-04-25

申请号：US13563737

申请日：2012-08-01

Applicant: TZU-CHIEN HUNG ,  CHIA-HUI SHEN ,  CHIEN-CHUNG PENG

Inventor： TZU-CHIEN HUNG ,  CHIA-HUI SHEN ,  CHIEN-CHUNG PENG

IPC: H01L33/20

CPC classification number: H01L33/20 ,  H01L33/22 ,  H01L33/42

Abstract: A light emitting diode includes a substrate and a light emitting structure. The light emitting structure includes a light outputting surface away from the substrate and a plurality of sidewalls adjoining the light outputting surface. A top peripheral edge interconnecting the light outputting surface and the sidewalls of the light emitting structure is a rounded top peripheral edge or a beveled top peripheral edge. A top surface of the substrate surrounding the light emitting structure is exposed to air and formed with micro-structures.

Abstract translation: 发光二极管包括基板和发光结构。 发光结构包括远离基板的光输出表面和邻近光输出表面的多个侧壁。 将光输出表面和发光结构的侧壁互连的顶部周边边缘是圆形顶部周边边缘或斜面顶部周边边缘。 围绕发光结构的基板的顶表面暴露于空气中并形成微结构。

公开(公告)号：US08327135B2

公开(公告)日：2012-12-04

申请号：US11656772

申请日：2007-01-23

Applicant: Abhishek Abhishek ,  Arun Ayyagari ,  Hui Shen ,  Krishna Ganugapati ,  Jiandong Ruan

Inventor： Abhishek Abhishek ,  Arun Ayyagari ,  Hui Shen ,  Krishna Ganugapati ,  Jiandong Ruan

IPC: H04L9/00

CPC classification number: H04W84/12 ,  H04L63/08 ,  H04L63/162 ,  H04W12/06 ,  H04W28/06 ,  H04W88/08

Abstract: A software based wireless infrastructure system is provided. The system has a driver that communicates with the network stack and a network interface card (NIC), a station server in communication with the station driver and an 802.1X supplicant or an 802.1X authenticator. Each NIC provides station and/or access point functionality support. The driver drops packets that have been received if the packet has not been authenticated and associated. Packets that have been fragmented or encrypted are unfragmented and decrypted. An association manager is used in conjunction with a configuration table manager to associate stations and access points via management packets. A manager receives 802.1X data packets from the packet processor and sends them up to a station server that communicates with user mode applications and an 802.1X supplicant or an 802.1X authenticator that are used to authenticate and deauthenticate stations and access points. APIs are provided to enable communication between the components.

Abstract translation: 提供了基于软件的无线基础设施系统。 该系统具有与网络堆栈通信的驱动程序，网络接口卡（NIC），与站驱动程序通信的站服务器以及802.1X请求者或802.1X验证器。 每个NIC提供站点和/或接入点功能支持。 如果数据包未经过身份验证并关联，则驱动程序丢弃已收到的数据包。 已分片或加密的数据包未分片和解密。 关联管理器与配置表管理器结合使用，以经由管理分组来关联站点和接入点。 管理员从分组处理器接收802.1X数据包，并将其发送到与用户模式应用程序通信的站服务器以及用于对站点和接入点进行身份验证和解密的802.1X请求者或802.1X验证器。 提供API以实现组件之间的通信。

公开(公告)号：US20120250780A1

公开(公告)日：2012-10-04

申请号：US13525641

申请日：2012-06-18

Applicant: Hui SHEN ,  Bin Li ,  Yi Luo

Inventor： Hui SHEN ,  Bin Li ,  Yi Luo

IPC: H04L25/49 ,  H04B15/00

CPC classification number: H04B7/0413 ,  H04B7/0465 ,  H04L25/03343

Abstract: The present invention relates to the field of wireless communications technologies, and discloses a method and device for pre-coding and a method and device for decoding. The present invention implements an interference alignment method with excellent performance, can effectively increase the capacity of a multi-user interference system and reduce the mutual interference among users, The method for pre-coding includes: calculating a pre-coding matrix for each transmitting end according to a sum of mean square errors of data vectors to be transmitted by each transmitting ends; and using the pre-coding matrix to pre-code the data to be transmitted by each transmitting end. The present invention has broad application prospects, for example, can be used in LTE and LTE-Advanced CoMP technology.

Abstract translation: 本发明涉及无线通信技术领域，并且公开了一种用于预编码的方法和装置以及用于解码的方法和装置。 本发明实现了具有优异性能的干扰对准方法，可以有效提高多用户干扰系统的容量，减少用户间的相互干扰。预编码方法包括：为每个发送端计算预编码矩阵 根据每个发送端发送的数据向量的均方误差之和; 并且使用预编码矩阵对由每个发送端发送的数据进行预编码。 本发明具有广泛的应用前景，例如可用于LTE和LTE-Advanced CoMP技术。

公开(公告)号：US20120223324A1

公开(公告)日：2012-09-06

申请号：US13233194

申请日：2011-09-15

Applicant: TZU-CHIEN HUNG ,  CHIA-HUI SHEN

Inventor： TZU-CHIEN HUNG ,  CHIA-HUI SHEN

IPC: H01L33/02 ,  H01L33/22

CPC classification number: H01L33/325 ,  H01L33/0095 ,  H01L33/22

Abstract: An LED includes a substrate, a first n-type GaN layer, a connecting layer, a second n-type GaN layer, a light emitting layer, and a p-type GaN layer. The first n-type GaN layer, the connecting layer, and the second n-type GaN layer are formed on the substrate in sequence. The connecting layer is etchable by alkaline solution, and a bottom surface of the second n-type GaN layer facing towards the connecting layer has a roughed exposed portion. The GaN on the bottom surface of the second n-type GaN layer is N-face GaN. A top surface of the second n-type GaN layer facing away from the connecting layer includes a first area and a second area. The light emitting layer and the p-type GaN layer are formed on the first area of the top surface of the second n-type GaN layer in sequence.

Abstract translation: LED包括基板，第一n型GaN层，连接层，第二n型GaN层，发光层和p型GaN层。 第一n型GaN层，连接层和第二n型GaN层依次形成在基板上。 连接层可用碱性溶液蚀刻，并且第二n型GaN层的面向连接层的底表面具有粗糙的暴露部分。 第二n型GaN层的底面上的GaN为N面GaN。 第二n型GaN层的背离连接层的顶表面包括第一区域和第二区域。 依次在第二n型GaN层的顶表面的第一区域上形成发光层和p型GaN层。

公开(公告)号：US08228124B2

公开(公告)日：2012-07-24

申请号：US12983412

申请日：2011-01-03

Applicant: Jinghua Ye ,  Hui Shen ,  Danny Li

Inventor： Jinghua Ye ,  Hui Shen ,  Danny Li

IPC: H03F3/04

CPC classification number: H03F1/025 ,  H03F3/21 ,  H03F3/3081 ,  H03F2200/03 ,  H03F2200/507 ,  H03F2200/511 ,  H03F2200/516 ,  H03F2203/21196 ,  H03F2203/30072

Abstract: A class G headphone amplifier circuit with improved power efficiency and low EMI. It may use an automatic signal level detector to detect the signal level of incoming signals and determine positive and negative power supplies for headphone amplifiers accordingly. A voltage generator may generate pairs of differential output voltages at a plurality of amplitude steps, and supply to headphone amplifiers the pair with the amplitude determined by the automatic signal level detector. As a result, headphone amplifiers are biased according to the input signal level, and the multiple voltage rails may improve power efficiency and avoid clipping.

Abstract translation: A类G耳机放大器电路，具有改善的功率效率和低EMI。 它可以使用自动信号电平检测器来检测输入信号的信号电平，并相应地确定耳机放大器的正负电源。 电压发生器可以以多个幅度步长产生成对的差分输出电压，并以由自动信号电平检测器确定的振幅向耳机放大器提供该对。 结果，耳机放大器根据输入信号电平被偏置，并且多个电压轨可以提高功率效率并避免削波。

公开(公告)号：US08222662B2

公开(公告)日：2012-07-17

申请号：US12975232

申请日：2010-12-21

Applicant: Chia-Hui Shen ,  Tzu-Chien Hung ,  Jian-Shihn Tsang

Inventor： Chia-Hui Shen ,  Tzu-Chien Hung ,  Jian-Shihn Tsang

IPC: H01L33/00

CPC classification number: H01L33/507 ,  H01L33/46 ,  H01L33/486 ,  H01L33/504 ,  H01L2224/16

Abstract: An LED package structure includes a transparent substrate having a supporting face and a light-emergent face opposite to the supporting face, a housing disposed on the supporting face, two electrodes disposed on the housing, an LED chip disposed on the supporting face and electrically connected to the two electrodes, a reflecting layer covering the LED chip to reflect light emitted by the LED chip toward the transparent substrate, and a phosphor layer formed on the light-emergent face of the substrate. The phosphor layer includes a plurality of layers each having a specific light wavelength conversion range to generate a light with a predetermined color.

Abstract translation: LED封装结构包括具有支撑面和与支撑面相对的出光面的透明基板，设置在支撑面上的壳体，设置在壳体上的两个电极，设置在支撑面上并电连接的LED芯片 向两个电极施加覆盖LED芯片以将由LED芯片发射的光反射到透明基板的反射层，以及形成在基板的发光面上的荧光体层。 荧光体层包括多个具有特定光波长转换范围的层，以产生具有预定颜色的光。

公开(公告)号：US20120102691A1

公开(公告)日：2012-05-03

申请号：US12962596

申请日：2010-12-07

Applicant: PING HAN ,  ZHI-HUI SHEN

Inventor： PING HAN ,  ZHI-HUI SHEN

IPC: A44B11/16

CPC classification number: A44B11/008 ,  Y10T24/2166 ,  Y10T24/4782

Abstract: The electronic device includes a body, a strap, and a strap connecting member. The strap connecting member further includes a pin, a torsion spring one end of which is connected to the pin, a receiving chamber accommodating the pin and defining an opening notch passing through the sidewall thereof, and a cover connected with the torsion spring and engaging with the receiving chamber. The strap is double-layered. The double-layered strap forms a folded end and an open end, the folded end is connected with the pin and is wrapped around the pin, and the open end is separated into two portions which pass at the opening notch and are respectively connected to the body. When the torsion spring is elastically deformed and generates a torsion force, the pin is rotated and the strap automatically shrinks in the receiving chamber under the torsion force.

Abstract translation: 电子设备包括主体，皮带和皮带连接部件。 所述带连接构件还包括销，其一端连接到所述销的扭力弹簧，容纳所述销并限定穿过其侧壁的开口凹口的接收室和与所述扭簧连接的盖， 接收室。 表带是双层的。 双层带形成折叠端和开口端，折叠端与销连接并缠绕销，并且开口端分成两部分，其在开口处通过，分别连接到 身体。 当扭簧弹性变形并产生扭转力时，销旋转，并且带在扭转力作用下在接收室中自动收缩。