公开(公告)号：US07092237B2

公开(公告)日：2006-08-15

申请号：US11117315

申请日：2005-04-29

申请人： Seok-Kyu Lee ,  Jang-Kyu Kang ,  Hyun-Ju Jin ,  Byoung-Youl Min

发明人： Seok-Kyu Lee ,  Jang-Kyu Kang ,  Hyun-Ju Jin ,  Byoung-Youl Min

IPC分类号： H01G4/06 ,  H01G4/005

CPC分类号： H05K1/162 ,  H05K3/0023 ,  H05K3/429 ,  H05K3/4652 ,  H05K3/4661 ,  H05K2201/0187 ,  H05K2201/0209 ,  H05K2203/0568 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49155

摘要： Disclosed herein are a printed circuit board with embedded capacitors therein and a process for manufacturing the printed circuit board. The embedded capacitors are formed by applying a photosensitive insulating resin to a printed circuit board inner layer, and applying a high dielectric polymer capacitor paste thereto. The process for manufacturing a printed circuit board with embedded capacitors therein comprises the steps of: i) laminating photo resist dry films to a copper clad FR-4, exposing to light and developing the dry films, and etching copper foils of the copper clad FR-4 to form bottom electrodes for forming capacitors; ii) applying a photosensitive insulating resin to the surfaces of the bottom electrodes, and exposing to light and developing to etch the photosensitive insulating resin; iii) applying a capacitor paste to the etched regions and curing the capacitor paste; iv) plating the upper regions of the cured capacitor paste and the photosensitive insulating resin using an electroless copper plating process to form copper foil layers for top electrodes; v) laminating photosensitive dry films to the copper foil layers for top electrodes, and exposing to light and developing the photosensitive dry films to etch regions of the dry films except for the copper foil layers where the top electrodes are to be formed; and vi) etching the regions of the dry films except for the copper foil layers where the top electrodes are to be formed, and the dry films formed on the top electrodes are removed so that the capacitor paste is discretely positioned between the top electrodes and the bottom electrodes to form discrete capacitors.

摘要翻译： 这里公开了一种其中具有嵌入式电容器的印刷电路板和用于制造印刷电路板的工艺。 嵌入式电容器通过将印刷电路板内层施加感光绝缘树脂，并向其施加高介电聚合物电容器膏而形成。 制造具有嵌入式电容器的印刷电路板的方法包括以下步骤：i）将光致抗蚀剂干膜层压到铜包覆FR-4上，曝光并显影干膜，并蚀刻铜包覆FR的铜箔 -4形成用于形成电容器的底部电极; ii）将感光绝缘树脂施加到底部电极的表面，并暴露于光和显影以蚀刻感光绝缘树脂; iii）将电容器膏施加到蚀刻区域并固化电容器糊; iv）使用化学镀铜工艺电镀固化的电容器浆料和感光绝缘树脂的上部区域，以形成用于顶部电极的铜箔层; v）将感光性干膜层压到用于顶部电极的铜箔层上，暴露于光并显影感光干膜以蚀刻除了要形成顶部电极的铜箔层之外的干膜的区域; 以及vi）蚀刻除了要形成顶部电极的铜箔层之外的干膜的区域，并且除去形成在顶部电极上的干膜，使得电容器糊料离散地位于顶部电极和 底部电极形成分立电容。

公开(公告)号：US07927517B2

公开(公告)日：2011-04-19

申请号：US12437657

申请日：2009-05-08

申请人： Jun Hee Bae ,  Seung Hyun Kim ,  Yul Kyo Chung ,  Won Hoon Song ,  Sung Taek Lim ,  Hyun Ju Jin

发明人： Jun Hee Bae ,  Seung Hyun Kim ,  Yul Kyo Chung ,  Won Hoon Song ,  Sung Taek Lim ,  Hyun Ju Jin

IPC分类号： C09D5/24 ,  H01B1/08

CPC分类号： H01L21/02282 ,  H01G4/1218 ,  H01G4/33 ,  H01L21/02186 ,  H01L21/316 ,  H05K1/162 ,  H05K2201/0175 ,  H05K2201/0179

摘要： Disclosed herein are a coating solution for the formation of a dielectric thin film and a method for the formation of a dielectric thin film using the coating solution. The coating solution comprises a titanium alkoxide, a β-diketone or its derivative, and a benzoic acid derivative having an electron donating group. The method comprises spin coating the coating solution on a substrate to form a thin film and drying the thin film at a low temperature to crystallize the thin film. The titanium-containing coating solution is highly stable. In addition, the coating solution enables formation of a thin film, regardless of the kind of substrates, and can be used to form dielectric thin films in an in-line mode in the production processes of PCBs.

摘要翻译： 本文公开了用于形成电介质薄膜的涂布溶液和使用该涂布溶液形成电介质薄膜的方法。 涂层溶液包含烷氧基钛，二 - 二酮或其衍生物，以及具有给电子基团的苯甲酸衍生物。 该方法包括将涂布溶液旋涂在基材上以形成薄膜，并在低温下干燥薄膜以使薄膜结晶。 含钛涂层溶液高度稳定。 此外，涂布溶液能够形成薄膜，而不管基板的种类如何，并且可以用于在PCB的生产过程中以在线模式形成电介质薄膜。

公开(公告)号：US07326858B2

公开(公告)日：2008-02-05

申请号：US10731246

申请日：2003-12-10

申请人： Seok-Kyu Lee ,  Byoung-Youl Min ,  Hyun-Ju Jin ,  Jang-Kyu Kang

发明人： Seok-Kyu Lee ,  Byoung-Youl Min ,  Hyun-Ju Jin ,  Jang-Kyu Kang

IPC分类号： H05K1/16

CPC分类号： H05K1/162 ,  H05K3/382 ,  H05K3/429 ,  H05K3/4652 ,  H05K2201/0209 ,  H05K2201/0355 ,  H05K2201/093 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2201/09663 ,  H05K2201/09718

摘要： Disclosed is a printed circuit board which is advantageous in terms of high capacitance by embedding capacitors comprising polymer capacitor pastes with high-dielectric constant coated on an inner layer of the printed circuit board and then semi-dried to a state of B-stage.

摘要翻译： 公开了一种印刷电路板，其通过将包含高介电常数的聚合物电容器浆料的电容器包埋在印刷电路板的内层上，然后半干燥至B级的状态而在高容量方面是有利的。

公开(公告)号：US06910266B2

公开(公告)日：2005-06-28

申请号：US10609618

申请日：2003-07-01

申请人： Seok-Kyu Lee ,  Jang-Kyu Kang ,  Hyun-Ju Jin ,  Byoung-Youl Min

发明人： Seok-Kyu Lee ,  Jang-Kyu Kang ,  Hyun-Ju Jin ,  Byoung-Youl Min

IPC分类号： H05K3/46 ,  H05K1/16 ,  H05K3/00 ,  H05K3/42 ,  H05K3/30

CPC分类号： H05K1/162 ,  H05K3/0023 ,  H05K3/429 ,  H05K3/4652 ,  H05K3/4661 ,  H05K2201/0187 ,  H05K2201/0209 ,  H05K2203/0568 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49155

摘要： Disclosed herein are a printed circuit board with embedded capacitors therein and a process for manufacturing the printed circuit board. The embedded capacitors are formed by applying a photosensitive insulating resin to a printed circuit board inner layer, and applying a high dielectric polymer capacitor paste thereto. The process for manufacturing a printed circuit board with embedded capacitors therein comprises the steps of: i) laminating photoresist dry films to a copper clad FR-4, exposing to light and developing the dry films, and etching copper foils of the copper clad FR-4 to form bottom electrodes for forming capacitors; ii) applying a photosensitive insulating resin to the surfaces of the bottom electrodes, and exposing to light and developing to etch the photosensitive insulating resin; iii) applying a capacitor paste to the etched regions and curing the capacitor paste; iv) plating the upper regions of the cured capacitor paste and the photosensitive insulating resin using an electroless copper plating process to form copper foil layers for top electrodes; v) laminating photosensitive dry films to the copper foil layers for top electrodes, and exposing to light and developing the photosensitive dry films to etch regions of the dry films except for the copper foil layers where the top electrodes are to be formed; and vi) etching the regions of the dry films except for the copper foil layers where the top electrodes are to be formed, and the dry films formed on the top electrodes are removed so that the capacitor paste is discretely positioned between the top electrodes and the bottom electrodes to form discrete capacitors.

摘要翻译： 这里公开了一种其中具有嵌入式电容器的印刷电路板和用于制造印刷电路板的工艺。 嵌入式电容器通过将印刷电路板内层施加感光绝缘树脂，并向其施加高介电聚合物电容器膏而形成。 制造具有嵌入式电容器的印刷电路板的方法包括以下步骤：i）将光致抗蚀剂干膜层压到铜包覆FR-4上，曝光并显影干膜，并蚀刻铜包覆FR- 4以形成用于形成电容器的底部电极; ii）将感光绝缘树脂施加到底部电极的表面，并暴露于光和显影以蚀刻感光绝缘树脂; iii）将电容器膏施加到蚀刻区域并固化电容器糊; iv）使用化学镀铜工艺电镀固化的电容器浆料和感光绝缘树脂的上部区域，以形成用于顶部电极的铜箔层; v）将感光性干膜层压到用于顶部电极的铜箔层上，暴露于光并显影感光干膜以蚀刻除了要形成顶部电极的铜箔层之外的干膜的区域; 以及vi）蚀刻除了要形成顶部电极的铜箔层之外的干膜的区域，并且除去形成在顶部电极上的干膜，使得电容器糊料离散地位于顶部电极和 底部电极形成分立电容。

公开(公告)号：US07895188B2

公开(公告)日：2011-02-22

申请号：US11741923

申请日：2007-04-30

申请人： Jin Won Lee ,  Young Ki Lee ,  Seung Woo Kang ,  Sang Jeong Lee ,  Hyun Ju Jin ,  Byung Jip Kim ,  June Hwa Song

发明人： Jin Won Lee ,  Young Ki Lee ,  Seung Woo Kang ,  Sang Jeong Lee ,  Hyun Ju Jin ,  Byung Jip Kim ,  June Hwa Song

IPC分类号： G06F7/00 ,  G06F17/30

CPC分类号： G06F17/30675

摘要： The present invention relates to a processing method of data stream using Border Monitoring Query, and more particularly a monitoring method and a system for data streams which are a large volume of data and continuously generated such as financial ticker, GPS data or a ubiquitous sensor network (USN).The objectives of the present invention are to process a large number of BMQs over data streams in high-performance and scalable manner. For this purpose, the invention presents BMQ-Index, a scalable and high performance data stream monitoring framework. The main idea of BMQ-Index is shared and incremental processing. For shared processing, BMQ-Index adopts a query indexing approach, thereby achieving a high level of scalability. Once BMQ-Index is built on registered queries, only relevant queries are quickly searched for upon an incoming data. For incremental processing, BMQ-Index employs an incremental access method, i.e., an index structure to store delta query information and an incremental search algorithm. Thus, successive BMQ evaluations are greatly accelerated.

摘要翻译： 本发明涉及使用边界监视查询的数据流的处理方法，更具体地说，涉及一种数据流的监视方法和系统，该数据流是大量的数据并连续生成的，例如金融报价单，GPS数据或普遍存在的传感器网络 （USN）。 本发明的目标是以高性能和可扩展的方式处理数据流上的大量BMQ。 为此，本发明提出了可扩展和高性能的数据流监测框架BMQ-Index。 BMQ-Index的主要思想是共享和增量处理。 对于共享处理，BMQ-Index采用查询索引方式，从而实现了高度的可扩展性。 一旦BMQ-Index建立在注册查询上，只有在输入数据时快速搜索相关查询。 对于增量处理，BMQ-Index使用增量访问方法，即用于存储增量查询信息和增量搜索算法的索引结构。 因此，连续的BMQ评估大大加快。

公开(公告)号：US20070234539A1

公开(公告)日：2007-10-11

申请号：US11730979

申请日：2007-04-05

申请人： Seung Eun Lee ,  Yul Kyo Chung ,  Hyung Dong Kang ,  Hyun Ju Jin

发明人： Seung Eun Lee ,  Yul Kyo Chung ,  Hyung Dong Kang ,  Hyun Ju Jin

IPC分类号： H04R17/00 ,  H01L21/8242

CPC分类号： H04R19/00 ,  H05K1/162 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/0355 ,  H05K2201/09309 ,  H05K2203/0346 ,  H05K2203/0353 ,  Y10T29/417 ,  Y10T29/42 ,  Y10T29/43 ,  Y10T29/435

摘要： A method for manufacturing a capacitor embedded in a PCB includes: preparing a copper clad lamination (CCL) substrate having a reinforcement member and copper foils formed on both surfaces of the reinforcement member; planarizing surfaces of the copper foils of the CCL substrate; forming a dielectric layer on the planarized surface of the copper foils; and forming a top electrode on the dielectric layer.

摘要翻译： 一种嵌入在PCB中的电容器的制造方法，其特征在于，包括：具有加强部件的铜包覆层叠（CCL）基板和形成在所述加强部件的两面的铜箔; 平坦化CCL基板的铜箔表面; 在铜箔的平坦化表面上形成电介质层; 并在电介质层上形成顶部电极。