公开(公告)号：US07736397B2

公开(公告)日：2010-06-15

申请号：US11730979

申请日：2007-04-05

申请人： Seung Eun Lee ,  Yul Kyo Chung ,  Hyung Dong Kang ,  Hyun Ju Jin

发明人： Seung Eun Lee ,  Yul Kyo Chung ,  Hyung Dong Kang ,  Hyun Ju Jin

IPC分类号： H01L21/8242 ,  H01G9/00

CPC分类号： H04R19/00 ,  H05K1/162 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/0355 ,  H05K2201/09309 ,  H05K2203/0346 ,  H05K2203/0353 ,  Y10T29/417 ,  Y10T29/42 ,  Y10T29/43 ,  Y10T29/435

摘要： A method for manufacturing a capacitor embedded in a PCB includes: preparing a copper clad lamination (CCL) substrate having a reinforcement member and copper foils formed on both surfaces of the reinforcement member; planarizing surfaces of the copper foils of the CCL substrate; forming a dielectric layer on the planarized surface of the copper foils; and forming a top electrode on the dielectric layer.

摘要翻译： 一种嵌入在PCB中的电容器的制造方法，其特征在于，包括：具有加强部件的铜包层压（CCL）基板和形成在所述加强部件的两面上的铜箔; 平坦化CCL基板的铜箔表面; 在铜箔的平坦化表面上形成电介质层; 并在电介质层上形成顶部电极。

公开(公告)号：US20070234539A1

公开(公告)日：2007-10-11

申请号：US11730979

申请日：2007-04-05

申请人： Seung Eun Lee ,  Yul Kyo Chung ,  Hyung Dong Kang ,  Hyun Ju Jin

发明人： Seung Eun Lee ,  Yul Kyo Chung ,  Hyung Dong Kang ,  Hyun Ju Jin

IPC分类号： H04R17/00 ,  H01L21/8242

CPC分类号： H04R19/00 ,  H05K1/162 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/0355 ,  H05K2201/09309 ,  H05K2203/0346 ,  H05K2203/0353 ,  Y10T29/417 ,  Y10T29/42 ,  Y10T29/43 ,  Y10T29/435

摘要： A method for manufacturing a capacitor embedded in a PCB includes: preparing a copper clad lamination (CCL) substrate having a reinforcement member and copper foils formed on both surfaces of the reinforcement member; planarizing surfaces of the copper foils of the CCL substrate; forming a dielectric layer on the planarized surface of the copper foils; and forming a top electrode on the dielectric layer.

摘要翻译： 一种嵌入在PCB中的电容器的制造方法，其特征在于，包括：具有加强部件的铜包覆层叠（CCL）基板和形成在所述加强部件的两面的铜箔; 平坦化CCL基板的铜箔表面; 在铜箔的平坦化表面上形成电介质层; 并在电介质层上形成顶部电极。

公开(公告)号：US07485411B2

公开(公告)日：2009-02-03

申请号：US11700864

申请日：2007-02-01

申请人： Hyung Mi Jung ,  Yul Kyo Chung ,  Hyung Dong Kang

发明人： Hyung Mi Jung ,  Yul Kyo Chung ,  Hyung Dong Kang

IPC分类号： G03C5/00

CPC分类号： H05K1/162 ,  H05K3/16 ,  H05K3/4602 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/09763

摘要： In a method for manufacturing a printed circuit board with a thin film capacitor embedded therein, a conductive metal is sputtered via a first mask to form a lower electrode. A dielectric material is sputtered via a second mask to form a dielectric layer. The conductive metal is sputtered via a third mask to form an upper electrode. An insulating layer is stacked on a stack body with the upper electrode formed therein and via holes are perforated from a top surface of the insulating layer to a top surface of the lower electrode and from the top surface of the insulating layer to a top surface of the upper electrode formed on the substrate. Also, the stack body with the via holes formed therein is electrolytically and electrolessly plated.

摘要翻译： 在其中嵌入有薄膜电容器的印刷电路板的制造方法中，通过第一掩模溅射导电金属以形成下电极。 通过第二掩模溅射介电材料以形成电介质层。 通过第三掩模溅射导电金属以形成上电极。 绝缘层堆积在堆叠体上，上电极形成在其中，并且通孔从绝缘层的顶表面穿孔到下电极的顶表面，并从绝缘层的顶表面到 上电极形成在基板上。 此外，其中形成有通孔的堆叠体是电解和无电镀的。

公开(公告)号：US20070178412A1

公开(公告)日：2007-08-02

申请号：US11700864

申请日：2007-02-01

申请人： Hyung Mi Jung ,  Yul Kyo Chung ,  Hyung Dong Kang

发明人： Hyung Mi Jung ,  Yul Kyo Chung ,  Hyung Dong Kang

IPC分类号： G03C5/00

CPC分类号： H05K1/162 ,  H05K3/16 ,  H05K3/4602 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/09763

摘要： In a method for manufacturing a printed circuit board with a thin film capacitor embedded therein, a conductive metal is sputtered via a first mask to form a lower electrode. A dielectric material is sputtered via a second mask to form a dielectric layer. The conductive metal is sputtered via a third mask to form an upper electrode. An insulating layer is stacked on a stack body with the upper electrode formed therein and via holes are perforated from a top surface of the insulating layer to a top surface of the lower electrode and from the top surface of the insulating layer to a top surface of the upper electrode formed on the substrate. Also, the stack body with the via holes formed therein is electrolytically and electrolessly plated.

摘要翻译： 在其中嵌入有薄膜电容器的印刷电路板的制造方法中，通过第一掩模溅射导电金属以形成下电极。 通过第二掩模溅射介电材料以形成电介质层。 通过第三掩模溅射导电金属以形成上电极。 绝缘层堆积在堆叠体上，上电极形成在其中，并且通孔从绝缘层的顶表面穿孔到下电极的顶表面，并从绝缘层的顶表面到 上电极形成在基板上。 此外，其中形成有通孔的堆叠体是电解和无电镀的。

公开(公告)号：US07887879B2

公开(公告)日：2011-02-15

申请号：US12437672

申请日：2009-05-08

申请人： Jun Hee Bae ,  Seung Hyun Kim ,  Yul Kyo Chung ,  Won Hoon Song ,  Sung Taek Lim ,  Hyun Ju Jin

发明人： Jun Hee Bae ,  Seung Hyun Kim ,  Yul Kyo Chung ,  Won Hoon Song ,  Sung Taek Lim ,  Hyun Ju Jin

IPC分类号： B05D3/12 ,  B05D1/40 ,  B05D5/12

CPC分类号： H01L21/02282 ,  H01G4/1218 ,  H01G4/33 ,  H01L21/02186 ,  H01L21/316 ,  H05K1/162 ,  H05K2201/0175 ,  H05K2201/0179

摘要： Disclosed herein are a coating solution for the formation of a dielectric thin film and a method for the formation of a dielectric thin film using the coating solution. The coating solution comprises a titanium alkoxide, a β-diketone or its derivative, and a benzoic acid derivative having an electron donating group. The method comprises spin coating the coating solution on a substrate to form a thin film and drying the thin film at a low temperature to crystallize the thin film. The titanium-containing coating solution is highly stable. In addition, the coating solution enables formation of a thin film, regardless of the kind of substrates, and can be used to form dielectric thin films in an in-line mode in the production processes of PCBs.

公开(公告)号：US07540913B2

公开(公告)日：2009-06-02

申请号：US11541673

申请日：2006-10-03

申请人： Jun Hee Bae ,  Seung Hyun Kim ,  Yul Kyo Chung ,  Won Hoon Song ,  Sung Taek Lim ,  Hyun Ju Jin

发明人： Jun Hee Bae ,  Seung Hyun Kim ,  Yul Kyo Chung ,  Won Hoon Song ,  Sung Taek Lim ,  Hyun Ju Jin

IPC分类号： C09D185/00

CPC分类号： H01L21/02282 ,  H01G4/1218 ,  H01G4/33 ,  H01L21/02186 ,  H01L21/316 ,  H05K1/162 ,  H05K2201/0175 ,  H05K2201/0179

摘要： Disclosed herein are a coating solution for the formation of a dielectric thin film and a method for the formation of a dielectric thin film using the coating solution. The coating solution comprises a titanium alkoxide, a β-diketone or its derivative, and a benzoic acid derivative having an electron donating group. The method comprises spin coating the coating solution on a substrate to form a thin film and drying the thin film at a low temperature to crystallize the thin film. The titanium-containing coating solution is highly stable. In addition, the coating solution enables formation of a thin film, regardless of the kind of substrates, and can be used to form dielectric thin films in an in-line mode in the production processes of PCBs.

摘要翻译： 本文公开了用于形成电介质薄膜的涂布溶液和使用该涂布溶液形成电介质薄膜的方法。 涂布溶液包含钛醇盐，β-二酮或其衍生物，以及具有给电子基团的苯甲酸衍生物。 该方法包括将涂布溶液旋涂在基材上以形成薄膜，并在低温下干燥薄膜以使薄膜结晶。 含钛涂层溶液高度稳定。 此外，涂布溶液能够形成薄膜，而不管基板的种类如何，并且可以用于在PCB的生产过程中以在线模式形成电介质薄膜。

公开(公告)号：US07927517B2

公开(公告)日：2011-04-19

申请号：US12437657

申请日：2009-05-08

申请人： Jun Hee Bae ,  Seung Hyun Kim ,  Yul Kyo Chung ,  Won Hoon Song ,  Sung Taek Lim ,  Hyun Ju Jin

发明人： Jun Hee Bae ,  Seung Hyun Kim ,  Yul Kyo Chung ,  Won Hoon Song ,  Sung Taek Lim ,  Hyun Ju Jin

IPC分类号： C09D5/24 ,  H01B1/08

CPC分类号： H01L21/02282 ,  H01G4/1218 ,  H01G4/33 ,  H01L21/02186 ,  H01L21/316 ,  H05K1/162 ,  H05K2201/0175 ,  H05K2201/0179

摘要： Disclosed herein are a coating solution for the formation of a dielectric thin film and a method for the formation of a dielectric thin film using the coating solution. The coating solution comprises a titanium alkoxide, a β-diketone or its derivative, and a benzoic acid derivative having an electron donating group. The method comprises spin coating the coating solution on a substrate to form a thin film and drying the thin film at a low temperature to crystallize the thin film. The titanium-containing coating solution is highly stable. In addition, the coating solution enables formation of a thin film, regardless of the kind of substrates, and can be used to form dielectric thin films in an in-line mode in the production processes of PCBs.

摘要翻译： 本文公开了用于形成电介质薄膜的涂布溶液和使用该涂布溶液形成电介质薄膜的方法。 涂层溶液包含烷氧基钛，二 - 二酮或其衍生物，以及具有给电子基团的苯甲酸衍生物。 该方法包括将涂布溶液旋涂在基材上以形成薄膜，并在低温下干燥薄膜以使薄膜结晶。 含钛涂层溶液高度稳定。 此外，涂布溶液能够形成薄膜，而不管基板的种类如何，并且可以用于在PCB的生产过程中以在线模式形成电介质薄膜。

公开(公告)号：US20090219671A1

公开(公告)日：2009-09-03

申请号：US12437657

申请日：2009-05-08

申请人： Jun Hee BAE ,  Seung Hyun Kim ,  Yul Kyo Chung ,  Won Hoon Song ,  Sung Taek Lim ,  Hyun Ju Jin

发明人： Jun Hee BAE ,  Seung Hyun Kim ,  Yul Kyo Chung ,  Won Hoon Song ,  Sung Taek Lim ,  Hyun Ju Jin

IPC分类号： H01G4/10 ,  B05D5/12 ,  H01L29/12

CPC分类号： H01L21/02282 ,  H01G4/1218 ,  H01G4/33 ,  H01L21/02186 ,  H01L21/316 ,  H05K1/162 ,  H05K2201/0175 ,  H05K2201/0179

摘要： Disclosed herein are a coating solution for the formation of a dielectric thin film and a method for the formation of a dielectric thin film using the coating solution. The coating solution comprises a titanium alkoxide, a β-diketone or its derivative, and a benzoic acid derivative having an electron donating group. The method comprises spin coating the coating solution on a substrate to form a thin film and drying the thin film at a low temperature to crystallize the thin film. The titanium-containing coating solution is highly stable. In addition, the coating solution enables formation of a thin film, regardless of the kind of substrates, and can be used to form dielectric thin films in an in-line mode in the production processes of PCBs.

摘要翻译： 本文公开了用于形成电介质薄膜的涂布溶液和使用该涂布溶液形成电介质薄膜的方法。 涂布溶液包含钛醇盐，β-二酮或其衍生物，以及具有给电子基团的苯甲酸衍生物。 该方法包括将涂布溶液旋涂在基材上以形成薄膜，并在低温下干燥薄膜以使薄膜结晶。 含钛涂层溶液高度稳定。 此外，涂布溶液能够形成薄膜，而不管基板的种类如何，并且可以用于在PCB的生产过程中以在线模式形成电介质薄膜。

公开(公告)号：US07293356B2

公开(公告)日：2007-11-13

申请号：US11325557

申请日：2006-01-03

申请人： Seung Hyun Sohn ,  Yul Kyo Chung ,  Hyun Ju Jin ,  Eun Tae Park

发明人： Seung Hyun Sohn ,  Yul Kyo Chung ,  Hyun Ju Jin ,  Eun Tae Park

IPC分类号： H01K3/10

CPC分类号： H05K1/162 ,  H05K3/025 ,  H05K3/381 ,  H05K3/429 ,  H05K3/4626 ,  H05K3/4652 ,  H05K3/4655 ,  H05K3/4661 ,  H05K2201/0209 ,  H05K2201/0358 ,  H05K2201/09309 ,  H05K2203/1152 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165

摘要： The present invention relates to a method of fabricating a printed circuit board having embedded multi-layer passive devices, and particularly, to a method of fabricating a printed circuit board having an embedded multi-layer capacitor, in which a capacitor is formed to have multiple layers in the PCB to increase capacitance.

摘要翻译： 本发明涉及一种制造具有嵌入式多层无源器件的印刷电路板的方法，特别涉及一种制造具有嵌入式多层电容器的印刷电路板的方法，其中形成电容器以具有多个 PCB中的层增加电容。

公开(公告)号：US07845073B2

公开(公告)日：2010-12-07

申请号：US12000125

申请日：2007-12-10

申请人： In Hyung Lee ,  Yul Kyo Chung ,  Bae Kyun Kim ,  Seung Eun Lee ,  Jung Won Lee

发明人： In Hyung Lee ,  Yul Kyo Chung ,  Bae Kyun Kim ,  Seung Eun Lee ,  Jung Won Lee

IPC分类号： H05K3/02 ,  H05K3/10

CPC分类号： H05K1/162 ,  H01G4/005 ,  H01G4/33 ,  H05K3/046 ,  H05K2201/0108 ,  H05K2201/0175 ,  H05K2203/016 ,  H05K2203/0528 ,  H05K2203/0537 ,  H05K2203/107 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155

摘要： A method of manufacturing a circuit board embedding a thin film capacitor, the method including: forming a sacrificial layer on a first substrate; forming a dielectric layer on the sacrificial layer; forming a first electrode layer on the dielectric layer; disposing the first substrate on the second substrate in such a way that the first electrode layer is bonded to a top of a second substrate; decomposing the sacrificial layer by irradiating a laser beam onto the sacrificial layer through the first substrate; separating the first substrate from the second substrate; and forming a second electrode layer on the dielectric layer.

摘要翻译： 一种制造嵌入薄膜电容器的电路板的方法，所述方法包括：在第一基板上形成牺牲层; 在所述牺牲层上形成介电层; 在所述电介质层上形成第一电极层; 将第一基板设置在第二基板上，使得第一电极层接合到第二基板的顶部; 通过经由所述第一基板将激光束照射到所述牺牲层上来分解所述牺牲层; 将第一基板与第二基板分离; 以及在所述电介质层上形成第二电极层。