Transistors, Methods Of Manufacturing The Same, And Electronic Devices Including Transistors
    11.
    发明申请
    Transistors, Methods Of Manufacturing The Same, And Electronic Devices Including Transistors 有权
    晶体管及其制造方法及包括晶体管的电子器件

    公开(公告)号:US20120085999A1

    公开(公告)日:2012-04-12

    申请号:US13099806

    申请日:2011-05-03

    CPC classification number: H01L27/14681 H01L27/14692

    Abstract: Example embodiments disclose transistors, methods of manufacturing the same, and electronic devices including transistors. An active layer of a transistor may include a plurality of material layers (oxide layers) with different energy band gaps. The active layer may include a channel layer and a photo sensing layer. The photo sensing layer may have a single-layered or multi-layered structure. When the photo sensing layer has a multi-layered structure, the photo sensing layer may include a first material layer and a second material layer that are sequentially stacked on a surface of the channel layer. The first layer and the second layer may be alternately stacked one or more times.

    Abstract translation: 示例性实施例公开了晶体管,其制造方法以及包括晶体管的电子器件。 晶体管的有源层可以包括具有不同能带隙的多个材料层(氧化物层)。 有源层可以包括沟道层和感光层。 感光层可以具有单层或多层结构。 当感光层具有多层结构时,感光层可以包括依次层叠在沟道层的表面上的第一材料层和第二材料层。 第一层和第二层可以交替堆叠一次或多次。

    Thin film transistor having a graded metal oxide layer
    12.
    发明授权
    Thin film transistor having a graded metal oxide layer 有权
    具有渐变金属氧化物层的薄膜晶体管

    公开(公告)号:US08063421B2

    公开(公告)日:2011-11-22

    申请号:US12007038

    申请日:2008-01-04

    CPC classification number: H01L29/7869

    Abstract: Provided are a thin film transistor and a method of manufacturing the same. The thin film transistor may include a gate; a channel layer; a source and a drain, the source and the drain being formed of metal; and a metal oxide layer, the metal oxide layer being formed between the channel layer and the source and the drain. The metal oxide layer may have a gradually changing metal content between the channel layer and the source and the drain.

    Abstract translation: 提供一种薄膜晶体管及其制造方法。 薄膜晶体管可以包括栅极; 一个通道层; 源极和漏极,源极和漏极由金属形成; 和金属氧化物层,金属氧化物层形成在沟道层与源极和漏极之间。 金属氧化物层可以在沟道层和源极和漏极之间具有逐渐变化的金属含量。

    Inverter, method of manufacturing the same, and logic circuit including the inverter
    14.
    发明授权
    Inverter, method of manufacturing the same, and logic circuit including the inverter 有权
    逆变器及其制造方法以及包括逆变器的逻辑电路

    公开(公告)号:US07977978B2

    公开(公告)日:2011-07-12

    申请号:US12591654

    申请日:2009-11-25

    CPC classification number: H01L21/823807 H01L27/0922 H01L27/1225 H01L27/1251

    Abstract: Provided are an inverter, a method of manufacturing the inverter, and a logic circuit including the inverter. The inverter may include a first transistor and a second transistor having different channel layer structures. A channel layer of the first transistor may include a lower layer and an upper layer, and a channel layer of the second transistor may be the same as one of the lower layer and the upper layer. At least one of the lower layer and the upper layer may be an oxide layer. The inverter may be an enhancement/depletion (E/D) mode inverter or a complementary inverter.

    Abstract translation: 提供逆变器,逆变器的制造方法以及包括逆变器的逻辑电路。 反相器可以包括具有不同沟道层结构的第一晶体管和第二晶体管。 第一晶体管的沟道层可以包括下层和上层,并且第二晶体管的沟道层可以与下层和上层之一相同。 下层和上层中的至少一层可以是氧化物层。 逆变器可以是增强/耗尽型(E / D)型逆变器或互补型逆变器。

    Ferroelectric capacitor having three-dimensional structure, nonvolatile memory device having the same and method of fabricating the same
    16.
    发明授权
    Ferroelectric capacitor having three-dimensional structure, nonvolatile memory device having the same and method of fabricating the same 失效
    具有三维结构的铁电电容器,具有相同的非易失性存储器件及其制造方法

    公开(公告)号:US07910967B2

    公开(公告)日:2011-03-22

    申请号:US11515024

    申请日:2006-09-05

    CPC classification number: H01L27/11502 H01L27/11507

    Abstract: A ferroelectric capacitor having a three-dimensional structure, a nonvolatile memory device having the same, and a method of fabricating the same are provided. The ferroelectric capacitor may include a trench-type lower electrode, at least one layer formed around the lower electrode, a ferroelectric layer (PZT layer) formed on the lower electrode and the at least one layer and an upper electrode formed on the ferroelectric layer. The at least one layer may be at least one insulating interlayer and the at least one layer may also be at least one diffusion barrier layer. The at least one layer may be formed of an insulating material excluding SiO2 or may have a perovskite crystal structure excluding Pb.

    Abstract translation: 提供具有三维结构的铁电电容器,具有其的非易失性存储器件及其制造方法。 铁电电容器可以包括沟槽型下电极,形成在下电极周围的至少一层,形成在下电极和至少一层上的铁电层(PZT层)和形成在铁电层上的上电极。 所述至少一个层可以是至少一个绝缘夹层,并且所述至少一个层也可以是至少一个扩散阻挡层。 所述至少一层可以由除了SiO2之外的绝缘材料形成,或者可以具有不包括Pb的钙钛矿晶体结构。

    Thin film transistor and method of manufacturing the same
    19.
    发明申请
    Thin film transistor and method of manufacturing the same 审中-公开
    薄膜晶体管及其制造方法

    公开(公告)号:US20080277663A1

    公开(公告)日:2008-11-13

    申请号:US11984072

    申请日:2007-11-13

    CPC classification number: H01L29/7869 H01L29/78606

    Abstract: Provided is a thin film transistor that includes a substrate on which an insulating layer is formed, a gate formed on a region of the insulating layer, a gate insulating layer formed on the insulating layer and the gate, a channel region formed on the gate insulating layer on a region corresponding to the location of the gate, a source and a drain respectively formed by contacting either side of the channel region; and a passivation layer formed of a compound made of a group II element and a halogen element on the channel region.

    Abstract translation: 提供一种薄膜晶体管,其包括其上形成有绝缘层的基板,形成在绝缘层的区域上的栅极,形成在绝缘层上的栅极绝缘层和栅极,形成在栅极绝缘上的沟道区域 在对应于栅极的位置的区域上分别形成一个源极和漏极,该漏极和漏极分别通过与沟道区域的任一侧接触; 以及由沟道区域上由II族元素和卤素元素制成的化合物形成的钝化层。

Patent Agency Ranking