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    ABRASIVE PRODUCTS AND METHODS FOR FINE POLISHING OF OPHTHALMIC LENSES
    11.
    发明申请
    ABRASIVE PRODUCTS AND METHODS FOR FINE POLISHING OF OPHTHALMIC LENSES 有权
    用于精细抛光眼镜的研磨产品和方法

    公开(公告)号：US20130283702A1

    公开(公告)日：2013-10-31

    申请号：US13853877

    申请日：2013-03-29

    Applicant: James J. Manning ,  Mark E. Sternberg ,  Jianna Wang

    Inventor： James J. Manning ,  Mark E. Sternberg ,  Jianna Wang

    IPC: B24D3/28

    CPC classification number: B24D3/28 ,  B24B13/01 ,  B24D11/001 ,  C09G1/02 ,  C09K3/1409 ,  C09K3/1436

    Abstract: A coated abrasive product including green, unfired abrasive aggregates having a generally spheroidal or toroidal shape, the aggregates formed from a composition comprising abrasive grit particles and a nanoparticle binder, wherein the abrasive aggregates are dispersed within a polymer resin coating, and wherein the coated abrasive product is capable of polishing an optical component, including ophthalmic lenses without the need to apply an abrasive slurry.

    Abstract translation: 一种涂覆的磨料产品，包括具有通常为球形或环形形状的绿色未烧成的磨料聚集体，由包含磨粒砂粒和纳米颗粒粘合剂的组合物形成的聚集体，其中磨料聚集体分散在聚合物树脂涂层内，并且其中涂覆磨料 产品能够抛光包括眼镜片的光学部件，而不需要施加磨料浆料。

    COATED ABRASIVE AGGREGATES AND PRODUCTS CONTAING SAME
    12.
    发明申请
    COATED ABRASIVE AGGREGATES AND PRODUCTS CONTAING SAME 有权
    包覆磨料聚合物和含有相同的产品

    公开(公告)号：US20130014445A1

    公开(公告)日：2013-01-17

    申请号：US13537927

    申请日：2012-06-29

    Applicant: Jianna Wang ,  Charles G. Herbert

    Inventor： Jianna Wang ,  Charles G. Herbert

    IPC: B24D3/28 ,  C09K3/14

    CPC classification number: B24D3/20 ,  B24D3/344 ,  C09K3/1436

    Abstract: Abrasive aggregates and fixed abrasive articles comprising formaldehyde-free polymer binder and a plurality of abrasive grains are provided that are particularly suitable for machining operations, in which abrasion is carried out to remove material and improve surface quality. Certain embodiments combine an abrasive grain, which can be in the form of microparticles, and a formaldehyde-free polymer binder, which can be in the form of a polymer resin and cross-linking agent. Optionally, the abrasive aggregate can contain a secondary cross-linking agent, or a functional filler, such as a grinding aid.

    Abstract translation: 提供了包含不含甲醛的聚合物粘合剂和多个磨粒的磨料聚集体和固定磨料制品，其特别适合于进行磨损以去除材料并改善表面质量的机械加工操作。 某些实施方案将可以是微粒形式的磨料颗粒和可以是聚合物树脂和交联剂形式的不含甲醛的聚合物粘合剂混合。 任选地，磨料聚集体可以含有二次交联剂或功能性填料，例如研磨助剂。

    Backplanes for electro-optic displays
    13.
    发明授权
    Backplanes for electro-optic displays 有权
    电光显示器背板

    公开(公告)号：US07365733B2

    公开(公告)日：2008-04-29

    申请号：US10707466

    申请日：2003-12-16

    Applicant: Gregg M. Duthaler ,  Robert W. Zehner ,  Charles H. Honeyman ,  Kevin L. Denis ,  Matthew A. King ,  Jianna Wang

    Inventor： Gregg M. Duthaler ,  Robert W. Zehner ,  Charles H. Honeyman ,  Kevin L. Denis ,  Matthew A. King ,  Jianna Wang

    IPC: G09G3/34 ,  G09G5/00

    CPC classification number: H01H59/0009 ,  G02F1/1362 ,  G02F1/136213 ,  G02F1/167

    Abstract: A backplane for an electro-optic display comprises a pixel electrode (104), a voltage supply line (C) arranged to supply a voltage to the pixel electrode (104), and a micromechanical switch (106, 112) disposed between the voltage supply line (C) and the pixel electrode (104), the micromechanical switch (106, 112) having an open state, in which the voltage supply line (C) is not electrically connected to the pixel electrode (104), and a closed state, in which the voltage supply line (C) is electrically connected to the pixel electrode (104).

    Abstract translation: 用于电光显示器的背板包括像素电极（104），被布置为向像素电极（104）提供电压的电压供应线（C）以及设置在电压源之间的微机械开关（106,112） 线路（C）和像素电极（104），其中电压供给线（C）未电连接到像素电极（104）的开放状态的微机械开关（106,112）和闭合状态 ，其中电压供给线（C）电连接到像素电极（104）。

    Method of fabricating a semiconducting thin film of polymer with improved chain ordering by drying in solvent rich atmosphere
    15.
    发明授权
    Method of fabricating a semiconducting thin film of polymer with improved chain ordering by drying in solvent rich atmosphere 有权
    通过在富含溶剂的气氛中干燥制备具有改进的链序列的聚合物半导体薄膜的方法

    公开(公告)号：US06339012B1

    公开(公告)日：2002-01-15

    申请号：US09450991

    申请日：1999-11-29

    Applicant: Thomas Jackson ,  Jianna Wang

    Inventor： Thomas Jackson ,  Jianna Wang

    IPC: H01L2120

    CPC classification number: B05D1/18 ,  B05D3/0486 ,  H01L51/0012

    Abstract: In a method for fabricating a thin film of polymer, particularly a semiconducting thin film of polymer with an improved structural order, wherein the thin film is formed by deposition of a polymer material onto a solid substrate material from a polymer solution formed by means of a solvent, the polymer solution is provided in a closed container such that a free volume is left in the container above the polymer solution and the substrate material immersed in the solution, whereupon the substrate material with a thin film deposited thereon is withdrawn from the polymer solution with a withdrawal speed being selected dependent on the concentration of the polymer solution, until the substrate material is located in the free volume a certain distance above the polymer solution. The substrate material is kept in vertical position in the free volume while the solvent evaporates, whereupon the substrate material with the thin film is removed from the container for further drying in a vacuum oven.—Use in fabrication of organic thin-film transistors.

    Abstract translation: 在制造聚合物薄膜，特别是具有改进的结构顺序的聚合物的半导体薄膜的方法中，其中所述薄膜是通过将聚合物材料沉积在固体基质材料上而形成的，所述聚合物材料由通过 溶剂中，将聚合物溶液设置在密闭容器中，使得容器在聚合物溶液上方留下自由体积，浸渍在溶液中的基材，随后将沉积有薄膜的基底材料从聚合物溶液中取出 其中取决于聚合物溶液的浓度的取出速度，直到基材材料位于聚合物溶液上方一定距离的自由体积中。 将基底材料保持在自由体积的垂直位置，同时溶剂蒸发，随后将具有薄膜的基底材料从容器中取出，以便在真空烘箱中进一步干燥。 - 用于制造有机薄膜晶体管。

    ABRASIVE PARTICLE AND METHOD OF FORMING SAME
    17.
    发明申请
    ABRASIVE PARTICLE AND METHOD OF FORMING SAME 有权
    磨料颗粒及其形成方法

    公开(公告)号：US20120167477A1

    公开(公告)日：2012-07-05

    申请号：US13340234

    申请日：2011-12-29

    Applicant: Jianna Wang ,  Guan Wang ,  Charles G. Herbert

    Inventor： Jianna Wang ,  Guan Wang ,  Charles G. Herbert

    IPC: B24D3/28 ,  B24D3/22 ,  C09K3/14

    CPC classification number: C09K3/1409 ,  B24D3/00

    Abstract: An abrasive article comprising an abrasive particle including a core comprising a compressible material, an intermediate layer comprising a binder material overlying an exterior surface of the core, and an outer layer comprising abrasive grains overlying the intermediate layer.

    Abstract translation: 一种磨料制品，其包含磨料颗粒，所述研磨剂颗粒包括包含可压缩材料的芯，包含覆盖在所述芯的外表面上的粘合剂材料的中间层，以及包含覆盖所述中间层的磨粒的外层。

    Means for electrical contacting or isolation of organic or inorganic semiconductors and a method for its fabrication
    19.
    发明申请
    Means for electrical contacting or isolation of organic or inorganic semiconductors and a method for its fabrication 审中-公开
    用于电接触或分离有机或无机半导体的方法及其制造方法

    公开(公告)号：US20060088875A1

    公开(公告)日：2006-04-27

    申请号：US11261494

    申请日：2005-10-31

    Applicant: Thomas Jackson ,  Jianna Wang

    Inventor： Thomas Jackson ,  Jianna Wang

    IPC: C12Q1/68 ,  C12M1/34 ,  B05D3/00

    CPC classification number: H01L51/42 ,  B82Y10/00 ,  B82Y30/00 ,  H01L27/28 ,  H01L51/0072 ,  H01L51/0075 ,  H01L51/0093 ,  H01L51/0545 ,  H01L51/0595 ,  H01L51/105 ,  H01L51/441 ,  Y02E10/549

    Abstract: In a means for electrical contacting or isolation of organic or inorganic semiconductors in electronic and optoelectronic devices, particularly thin-film devices, the means comprises a substrate (1) in the form of a contact material (1a) or an isolating material (4). A charge transfer material (2) is provided patterned or unpatterned on or at the surface of the substrate and includes charge transfer components in the form of donors and/or acceptors. The charge transfer material forms a self-assembling layer (3) on one or more atomic and/or molecular layers. The charge transfer material (2) has a direct or indirect bond to the surface of the substrate (1) and further forms a charge transfer complex with a thereabove adjacently provided organic or inorganic semiconductor (6). The charge transfer material (2) then forms a donor or acceptor material in the charge transfer complex depending upon respectively whether the semiconductor (6) itself is an acceptor or donor material.

    Abstract translation: 在用于在电子和光电子器件，特别是薄膜器件中电接触或分离有机或无机半导体的装置中，所述装置包括接触材料（1a）或隔离材料（4）形式的衬底（1） ）。 电荷转移材料（2）在衬底上或表面上被图案化或未图案化，并且包括供体和/或受体形式的电荷转移组分。 电荷转移材料在一个或多个原子和/或分子层上形成自组装层（3）。 电荷转移材料（2）与衬底（1）的表面直接或间接结合，并且进一步与其上邻近提供的有机或无机半导体（6）形成电荷转移络合物。 电荷转移材料（2）然后在电荷转移络合物中形成供体或受体材料，这取决于半导体（6）本身是否为受体或供体材料。

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