公开(公告)号：US07276998B2

公开(公告)日：2007-10-02

申请号：US10985154

申请日：2004-11-10

申请人： Ashraf W. Lotfi ,  Mathew Wilkowski ,  John D. Weld

发明人： Ashraf W. Lotfi ,  Mathew Wilkowski ,  John D. Weld

IPC分类号： H01F27/02

CPC分类号： H01F27/027 ,  H01F27/022 ,  H01F27/365

摘要： An encapsulatable package for a magnetic device that includes a magnetic core. In one embodiment, the encapsulatable package for the magnetic device also includes a shielding structure located about the magnetic core configured to create a chamber thereabout. The shielding structure is configured to limit an encapsulant entering the chamber.

摘要翻译： 一种用于包括磁芯的磁性装置的可封装封装。 在一个实施例中，用于磁性装置的可封装封装还包括围绕磁芯定位的屏蔽结构，该屏蔽结构构造成在其周围产生室。 屏蔽结构被配置为限制进入腔室的密封剂。

公开(公告)号：US07180395B2

公开(公告)日：2007-02-20

申请号：US10985151

申请日：2004-11-10

申请人： Ashraf W. Lotfi ,  Mathew Wilkowski ,  John D. Weld

发明人： Ashraf W. Lotfi ,  Mathew Wilkowski ,  John D. Weld

IPC分类号： H01F27/02

CPC分类号： H01F27/027 ,  H01F27/022 ,  H01F27/365

摘要： An encapsulatable package for a magnetic device that includes a magnetic core. In one embodiment, the encapsulatable package for the magnetic device includes a shielding structure located about the magnetic core configured to create a chamber thereabout and configured to limit an encapsulant entering the chamber. The encapsulatable package for the magnetic device also includes a baffle within the chamber configured to direct the encapsulant away from the magnetic core.

摘要翻译： 一种用于包括磁芯的磁性装置的可封装封装。 在一个实施例中，用于磁性装置的可封装封装包括围绕磁芯定位的屏蔽结构，所述屏蔽结构被配置为在其周围产生腔室并且被配置为限制进入腔室的密封剂。 用于磁性装置的可封装封装还包括在腔室内的挡板，其构造成将密封剂引导离开磁芯。

公开(公告)号：US6144789A

公开(公告)日：2000-11-07

申请号：US318011

申请日：1999-05-25

申请人： Jon W. Engelberth ,  David J. Kudelko ,  Paul J. Lemaire ,  Paul M. Rominski ,  John D. Weld

发明人： Jon W. Engelberth ,  David J. Kudelko ,  Paul J. Lemaire ,  Paul M. Rominski ,  John D. Weld

IPC分类号： G02B6/02 ,  G02B6/34

CPC分类号： G02B6/0218

摘要： A temperature compensating device for optical fiber gratings includes first and second expansion members having different coefficients of thermal expansion. The expansion members are elongated in a direction parallel to the fiber grating and levers are secured to both ends of the expansion members. Each lever has a first end flexibly secured to a respective end of the first expansion member and a middle portion flexibly secured to a respective end of the second expansion member. The other end of each lever is secured to a respective end of the fiber grating. The expansion members, the levers and the fiber grating all lie substantially in a single plane. There is also disclosed a package for holding four of the temperature compensating devices in two rows of two devices each, with their fiber gratings adjacent each other so that when viewed in a plane orthogonally to the longitudinal axes of the fiber gratings, the fiber gratings are each at a respective corner of a rectangle.

摘要翻译： 用于光纤光栅的温度补偿装置包括具有不同热膨胀系数的第一和第二扩展构件。 膨胀构件在与纤维光栅平行的方向上伸长，杠杆固定在膨胀构件的两端。 每个杠杆具有柔性地固定到第一膨胀构件的相应端部的第一端和柔性地固定到第二膨胀构件的相应端部的中间部分。 每个杠杆的另一端固定到光纤光栅的相应端。 扩展构件，杠杆和光纤光栅都基本上位于单个平面中。 还公开了一种用于将两个温度补偿装置中的四个温度补偿装置保持在两排两个装置中的包装，其中它们的光纤光栅彼此相邻，使得当在与光纤光栅的纵轴垂直的平面中观察时，光纤光栅是 每个都在矩形的相应角落。

公开(公告)号：US6110576A

公开(公告)日：2000-08-29

申请号：US173502

申请日：1998-10-16

申请人： Robert L. Decker ,  John D. Weld

发明人： Robert L. Decker ,  John D. Weld

IPC分类号： B29C45/16 ,  B32B7/02 ,  H05K1/09 ,  H05K3/00 ,  H05K3/10 ,  H05K3/28 ,  B32B5/06

CPC分类号： H05K3/101 ,  B29C45/16 ,  B29C45/1642 ,  B32B7/02 ,  H05K1/095 ,  B29C2045/169 ,  B29K2995/0005 ,  B29K2995/0007 ,  H05K2201/0129 ,  H05K2201/0281 ,  H05K2201/09118 ,  H05K2203/0113 ,  H05K3/0014 ,  H05K3/28 ,  Y10S428/901 ,  Y10T428/249948 ,  Y10T428/24995 ,  Y10T428/249951 ,  Y10T428/31507 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31609

摘要： An article comprising a molded circuit for providing a path for electrical current is disclosed. The molded circuit is formed of a first material layer and a second material layer. The first material layer is an electrically insulating material. The second material layer is an electrically conductive material. In an alternate embodiment, the second material layer is surrounded between two layers of the first material layer. The molded circuit can be formed using multi-material injection molding such as co-injection molding or two-shot injection molding. A printed circuit board can comprise the molded circuit.

摘要翻译： 公开了一种包括用于提供电流路径的模制电路的物品。 模制电路由第一材料层和第二材料层形成。 第一材料层是电绝缘材料。 第二材料层是导电材料。 在替代实施例中，第二材料层被包围在第一材料层的两层之间。 模制电路可以使用诸如共注射成型或双注射成型的多材料注射成型来形成。 印刷电路板可以包括模制电路。

公开(公告)号：US5607882A

公开(公告)日：1997-03-04

申请号：US359973

申请日：1994-12-20

申请人： William R. Lambert ,  John D. Weld

发明人： William R. Lambert ,  John D. Weld

IPC分类号： H01R11/01 ,  B29C45/14 ,  H01R12/52 ,  H01R12/70 ,  H01R43/00 ,  H05K7/10 ,  H01L21/60

CPC分类号： H01R43/007 ,  B29C45/14467 ,  B29C45/14639 ,  H01R12/7076 ,  H01R12/52

摘要： Electronic devices include at least two electronic components in electrical contact by connector means, the components being at least partially encased by a molded resin. Preferably, the connector means is a compression connector and the molded resin maintains a compressive force on the connector to ensure that reliable contact is maintained.

摘要翻译： 电子设备包括通过连接器装置电接触的至少两个电子部件，所述部件至少部分地被模制树脂封装。 优选地，连接器装置是压缩连接器，并且模制树脂在连接器上保持压缩力，以确保保持可靠的接触。

公开(公告)号：US08631560B2

公开(公告)日：2014-01-21

申请号：US11243537

申请日：2005-10-05

申请人： Ashraf W. Lotfi ,  Mathew A. Wilkowski ,  Trifon M. Liakopoulos ,  John D. Weld

发明人： Ashraf W. Lotfi ,  Mathew A. Wilkowski ,  Trifon M. Liakopoulos ,  John D. Weld

IPC分类号： H01F17/04 ,  H01F27/30

CPC分类号： H01F17/04 ,  H01F2027/2814 ,  H01L23/495 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/16 ,  H01L2224/37147 ,  H01L2224/40245 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/49096 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/01015 ,  H01L2924/01047 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19105 ,  H02M3/00 ,  Y10T29/4902 ,  Y10T29/49073 ,  Y10T29/49121 ,  H01L2924/00 ,  H01L2224/45147 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A method of forming a magnetic device by providing a conductive substrate and placing a magnetic core proximate the conductive substrate with a surface thereof facing the conductive substrate. The method also includes placing a conductive clip proximate a surface of the magnetic core and electrically coupling ends of the conductive clip to the conductive substrate to cooperatively form a winding therewith about the magnetic core.

摘要翻译： 一种形成磁性器件的方法，该方法是通过提供导电衬底并将磁芯放置在导电衬底附近，其表面面向导电衬底。 该方法还包括将导电夹子放置在靠近磁芯的表面并将导电夹子的端部电耦合到导电衬底上以协同地形成围绕磁芯的绕组。

公开(公告)号：US20080301929A1

公开(公告)日：2008-12-11

申请号：US12196062

申请日：2008-08-21

申请人： Ashraf W. Lotfi ,  Mathew Wilkowski ,  John D. Weld

发明人： Ashraf W. Lotfi ,  Mathew Wilkowski ,  John D. Weld

IPC分类号： H01F7/06

CPC分类号： H01F41/005 ,  H01F17/043 ,  H01F27/027 ,  H01F27/255 ,  H01F27/365 ,  H05K3/284 ,  Y10T29/49002 ,  Y10T29/4902 ,  Y10T29/49069 ,  Y10T29/49073 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49171

摘要： A method of manufacturing a power module on a substrate. In one embodiment, the method includes providing power conversion circuitry including providing a magnetic device having a magnetic core and at least one switch on the substrate. The method also includes placing a shielding structure over the magnetic core to create a chamber thereabout. The method also includes depositing an encapsulant about the power conversion circuitry. The shielding structure limits the encapsulant entering the chamber thereby allowing the encapsulant to surround a portion of the magnetic core within the chamber.

摘要翻译： 一种在基板上制造功率模块的方法。 在一个实施例中，该方法包括提供功率转换电路，包括提供具有磁芯和至少一个开关的磁性装置。 该方法还包括将屏蔽结构放置在磁芯上方以在其周围形成腔室。 该方法还包括在功率转换电路周围沉积密封剂。 屏蔽结构限制了进入腔室的密封剂，从而允许密封剂围绕室内的磁芯的一部分。

公开(公告)号：US07256674B2

公开(公告)日：2007-08-14

申请号：US10985826

申请日：2004-11-10

申请人： Ashraf W. Lotfi ,  Mathew Wilkowski ,  John D. Weld

发明人： Ashraf W. Lotfi ,  Mathew Wilkowski ,  John D. Weld

IPC分类号： H01F27/02

CPC分类号： H01F27/027 ,  H01F27/022 ,  H01F27/365 ,  H02M3/10

摘要： A power module located on a substrate. In one embodiment, the power module includes power conversion circuitry with a magnetic device and at least one switch. The magnetic device includes a magnetic core with a shielding structure located about the magnetic core configured to create a chamber thereabout. The power module also includes an encapsulant about the power conversion circuitry. The shielding structure is configured to limit the encapsulant entering the chamber thereby allowing the encapsulant to surround a portion of the magnetic core within the chamber.

摘要翻译： 位于基板上的功率模块。 在一个实施例中，功率模块包括具有磁性装置和至少一个开关的功率转换电路。 磁性装置包括具有围绕磁芯定位的屏蔽结构的磁芯，该磁芯配置成在其周围产生室。 功率模块还包括关于功率转换电路的密封剂。 屏蔽结构被配置为限制进入腔室的密封剂，从而允许密封剂围绕室内的磁芯的一部分。

公开(公告)号：US06839517B2

公开(公告)日：2005-01-04

申请号：US09781571

申请日：2001-02-12

申请人： Felix C. Anigbo ,  Gerard Edmond Henein ,  Anpei Pan ,  Moon Soo Park ,  Yong-Kwan Park ,  John D. Weld

发明人： Felix C. Anigbo ,  Gerard Edmond Henein ,  Anpei Pan ,  Moon Soo Park ,  Yong-Kwan Park ,  John D. Weld

IPC分类号： G02B6/34 ,  G02B6/42 ,  H04J14/02 ,  H04B10/24

CPC分类号： G02B6/2938 ,  G02B6/29362 ,  G02B6/4246

摘要： An apparatus for wavelength multiplexing optical signals, wherein the apparatus includes at least one optically conductive sleeve, at least one collimating lens positioned to receive a optical signal from the at least one sleeve, and at least one dichroic splitter positioned to receive the optical signal from the at least one collimating lens. A filter may further be positioned to receive the optical signal from the at least one dichroic splitter in order to further filter the optical signal. The apparatus for wavelength multiplexing is configured to provide optical isolation of at least 75 dB via the combination of the at least one dichroic splitter and filter elements.

摘要翻译： 一种用于波长复用光信号的装置，其中所述装置包括至少一个光导电套筒，至少一个准直透镜，定位成接收来自所述至少一个套筒的光信号，以及至少一个二向色分光器，其被定位成从 所述至少一个准直透镜。 还可以将滤波器定位成从至少一个二向色分光器接收光信号，以进一步滤光光信号。 用于波长多路复用的装置被配置为通过至少一个二向色分离器和滤波器元件的组合提供至少75dB的光隔离。

公开(公告)号：US06351033B1

公开(公告)日：2002-02-26

申请号：US09413605

申请日：1999-10-06

申请人： Ashraf W. Lotfi ,  John D. Weld

发明人： Ashraf W. Lotfi ,  John D. Weld

IPC分类号： H05K502

CPC分类号： H01L23/49541 ,  H01F2021/125 ,  H01L23/642 ,  H01L23/645 ,  H01L2924/0002 ,  Y10S257/924 ,  H01L2924/00

摘要： The present invention provides a lead frame for use in packaging a circuit having a discrete component, and a method of manufacture thereof. In one embodiment, the lead frame includes a lead support structure and a plurality of severable leads that are coupled to the lead support structure. The plurality of severable leads extend inward from the lead support structure to predetermined locations corresponding to terminals of the discrete component.

摘要翻译： 本发明提供一种用于封装具有分立元件的电路的引线框及其制造方法。 在一个实施例中，引线框架包括引线支撑结构和耦合到引线支撑结构的多个可分离引线。 多个可分离引线从引线支撑结构向内延伸到对应于分立元件的端子的预定位置。