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公开(公告)号：US07344760B1
公开(公告)日：2008-03-18
申请号：US10662162
申请日：2003-09-12
IPC分类号： C23C14/48
CPC分类号： C23C14/06 , C23C14/0605 , C23C14/221
摘要： A method for making a wear-resistant electrically conductive body having an electrically conductive diamond-like carbon coating, by ion-accelerating copper ions from a copper ion source onto a negatively charged electrically conductive body, and simultaneously ion-accelerating diamond-like carbon ions from a separate carbon ion source onto the negatively charged electrically conductive body. Also a dual ion-beam process for depositing a wear-resistant diamond-like carbon coating on a negatively charged electrically conductive surface by using an ion-beam to stabilize ionized carbon atoms that have been ion-accelerated onto the negatively charged electrically conductive surface.
摘要翻译： 一种制造具有导电类金刚石碳涂层的耐磨导电体的方法，通过将铜离子从铜离子源离子加速到带负电荷的导电体上，同时离子加速金刚石样碳离子 从单独的碳离子源到带负电的导电体。 还有一种双离子束工艺，用于通过使用离子束来稳定已经离子加速到带负电的导电表面上的电离碳原子，在负电荷的导电表面上沉积耐磨的类金刚石碳涂层。
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公开(公告)号：US07189335B1
公开(公告)日：2007-03-13
申请号：US11280033
申请日：2005-11-16
CPC分类号： H01L21/4817 , C23C4/185 , H01L23/552 , H01L2924/16152
摘要： Stand-alone conformal coverings for electronic devices and methods of making and using such coverings.
摘要翻译： 用于电子设备的独立适形覆盖物和制造和使用这种覆盖物的方法。
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公开(公告)号：US06287985B1
公开(公告)日：2001-09-11
申请号：US08549350
申请日：1995-10-27
IPC分类号： H01L2131
CPC分类号： H01L23/573 , H01L21/56 , H01L23/295 , H01L2224/48091 , H01L2924/00014
摘要： Disclosed is a method of forming an opaque coating on an integrated circuit or multichip module. A coating composition is prepared and then heated to a temperature sufficient to transform the coating composition to a molten state. Next, the molten coating composition is applied to a surface of the integrated circuit device to form an opaque coating that overlies active circuitry on the surface, to prevent optical and radiation based inspection and reverse engineering of the active circuitry.
摘要翻译： 公开了在集成电路或多芯片模块上形成不透明涂层的方法。 制备涂料组合物，然后加热至足以将涂料组合物转化为熔融状态的温度。 接下来，将熔融涂料组合物施加到集成电路器件的表面，以形成覆盖表面上的有源电路的不透明涂层，以防止基于光和辐射的检测和有源电路的反向工程。
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14.发明授权Multilayer protective coating for integrated circuits and multichip modules and method of applying same 失效用于集成电路和多芯片模块的多层保护涂层及其应用方法公开(公告)号：US06319740B1
公开(公告)日：2001-11-20
申请号：US08549349
申请日：1995-10-27
IPC分类号： B05D136
CPC分类号： H01L23/573 , H01L21/56 , H01L23/24 , H01L23/295 , H01L2224/48091 , H01L2224/8592 , H01L2924/00014 , H01L2924/16195 , H01L2924/3025 , H01L2924/00 , H01L2224/45099
摘要： Disclosed is a method of forming a multilayer opaque coating on an integrated circuit or multichip module. First, an opaque coating composition is heated to a molten state and the molten opaque coating composition is applied so as to form an opaque coating that overlies active circuitry on the surface of the integrated circuit or multichip module, to prevent optical and radiation based inspection and reverse engineering of the active circuitry. Further coatings are applied over the opaque coating to shield the active circuitry of the integrated circuit or multichip module from the adverse affects of electromagnetic interference and/or high energy radiation.
摘要翻译： 公开了一种在集成电路或多芯片模块上形成多层不透明涂层的方法。 首先，将不透明的涂料组合物加热至熔融状态，并施加熔融的不透明涂料组合物以形成覆盖在集成电路或多芯片模块的表面上的有源电路的不透明涂层，以防止基于光学和辐射的检查， 有源电路的逆向工程。 将其它涂层施加在不透明涂层上以屏蔽集成电路或多芯片模块的有源电路免受电磁干扰和/或高能量辐射的不利影响。
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公开(公告)号：US5762711A
公开(公告)日：1998-06-09
申请号：US751146
申请日：1996-11-15
CPC分类号： H01L21/6715 , B05B12/124 , B05B13/0242 , H01L23/573 , B05B7/20 , H01L2224/48091 , H01L2224/8592 , H01L27/02 , H01L2924/00014 , H01L2924/09701 , H01L2924/16195
摘要： Protective and security coatings are applied to an integrated circuit by periodically passing the integrated circuit through a flame spray containing molten particles of the coating composition. The integrated circuit is attached to a fixture that is cooled with a coolant that is applied to the integrated circuit. The distance between the flame spray gun and the integrated circuit is controlled so that the particles are molten when they strike the circuit but the circuit heating is minimized. A flame resistant mask retains the integrated circuit on the fixture. The mask is constructed of a low thermally conductive material and the fixture is constructed of a high thermally conducive material.
摘要翻译： 通过周期性地使集成电路通过包含涂料组合物的熔融颗粒的火焰喷涂而将保护和安全涂层施加到集成电路。 集成电路连接到用施加到集成电路的冷却剂冷却的固定装置。 控制火焰喷枪和集成电路之间的距离，使得当它们撞击电路时，颗粒熔融，但电路加热最小化。 阻燃面罩将集成电路保持在灯具上。 掩模由低导热材料构成，夹具由高导热材料构成。
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公开(公告)号：US07758911B2
公开(公告)日：2010-07-20
申请号：US10434440
申请日：2003-05-08
申请人： Kenneth H. Heffner
发明人： Kenneth H. Heffner
IPC分类号： B05D5/12
CPC分类号： H01L23/57 , G06F21/87 , G06F2221/2143 , G06K19/073 , G06K19/07372 , H01L2924/0002 , H05K1/0275 , Y10S428/901 , Y10S428/916 , Y10T428/249955 , H01L2924/00
摘要： A security coating on an electronic circuit assembly comprises a mesh coating that may have a unique signature pattern and comprise materials that easily produce an image of the signature so that it is possible to determine if reverse engineering has been attempted. Spaces in the mesh may include electrical components to erase circuit codes to destroy the functionality and value of the protected die if the mesh coated is disturbed. The voids may include compositions to enhance the mesh signature and abrade the circuit if tampering takes place.
摘要翻译： 电子电路组件上的安全涂层包括可以具有唯一签名图案的网格涂层，并且包括容易产生签名图像的材料，使得可以确定是否已经尝试逆向工程。 网格中的空间可能包括电气部件，以擦除电路代码，以破坏受保护的裸片的功能和价值。 如果发生窜改，空隙可以包括用于增强网格签名并磨擦电路的组合物。
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公开(公告)号：US20080132118A1
公开(公告)日：2008-06-05
申请号：US11565390
申请日：2006-11-30
IPC分类号： H01R13/66
CPC分类号： H01R13/6683 , H01R13/748 , Y10T70/8216
摘要： A secure connector is provided. The secure connector comprises a casing; a tamper sensor disposed inside the casing and configured to detect unauthorized tamper events; and one or more conductors configured to carry signals, the one or more conductors passing through the tamper sensor.
摘要翻译： 提供安全连接器。 固定连接器包括壳体; 篡改传感器，其设置在所述壳体内并且被配置为检测未授权的窜改事件; 以及配置成承载信号的一个或多个导体，所述一个或多个导体穿过篡改传感器。
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公开(公告)号：US20130235544A1
公开(公告)日：2013-09-12
申请号：US13416404
申请日：2012-03-09
CPC分类号： H01L23/481 , H01L23/49833 , H01L23/585 , H01L2224/16225 , H01L2224/73253 , H01L2924/1461 , H01L2924/15192 , H01L2924/15311 , Y10T29/49126 , H01L2924/00
摘要： In some examples, an integrated circuit system includes a plurality of integrated circuit layers. At least one of the integrated circuit layers includes an integrated circuit die, which may not include any through-silicon vias that provide a pathway to an adjacent integrated circuit layer, and an interposer portion, which includes electrically conductive through-vias. The interposer portion may facilitate communication of the integrated circuit die with other integrated circuit layers of the integrated circuit system. In some examples, the stacked integrated circuit system may include more than one integrated circuit die, which may be in the same integrated circuit layer as at least one other integrated circuit die, or may be in a different integrated circuit layer.
摘要翻译： 在一些示例中，集成电路系统包括多个集成电路层。 集成电路层中的至少一个包括集成电路管芯，其可以不包括提供到相邻集成电路层的通路的任何穿硅通孔，以及包括导电通孔的插入器部分。 插入器部分可以促进集成电路管芯与集成电路系统的其它集成电路层的通信。 在一些示例中，堆叠集成电路系统可以包括多于一个集成电路管芯，其可以与至少一个其它集成电路管芯在同一集成电路层中，或者可以在不同的集成电路层中。
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公开(公告)号：US07796036B2
公开(公告)日：2010-09-14
申请号：US11565390
申请日：2006-11-30
IPC分类号： G08B13/12
CPC分类号： H01R13/6683 , H01R13/748 , Y10T70/8216
摘要： A secure connector is provided. The secure connector comprises a casing; a tamper sensor disposed inside the casing and configured to detect unauthorized tamper events; and one or more conductors configured to carry signals, the one or more conductors passing through the tamper sensor.
摘要翻译： 提供安全连接器。 固定连接器包括壳体; 篡改传感器，其设置在所述壳体内并且被配置为检测未授权的窜改事件; 以及配置成承载信号的一个或多个导体，所述一个或多个导体穿过篡改传感器。
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20.发明授权公开(公告)号：US07460241B2
公开(公告)日：2008-12-02
申请号：US11291797
申请日：2005-11-30
IPC分类号： G01C19/72
CPC分类号： G01C19/722
摘要： A fiber optic sensor coil and method of forming a fiber optic sensor coil including a plurality of turns of a first segment of optical fiber wound in a clockwise direction and a plurality of turns of a second segment of optical fiber wound in the counterclockwise direction. The turns of the first segment and of the second segment together forming a plurality of layers of turns of the optical fiber. A restraining ring covers an outermost layer of the plurality of layers of turns of optical fiber. The restraining ring includes a plurality of openings formed therein and provides a compressive force to the plurality of turns of the optical fiber.
摘要翻译： 一种光纤传感器线圈和形成光纤传感器线圈的方法，所述光纤传感器线圈包括绕顺时针方向缠绕的第一光纤段的多个匝和沿逆时针方向缠绕的多个第二光纤段。 第一段和第二段的匝一起形成光纤的多个匝数。 限制环覆盖多个光纤圈的最外层。 限制环包括形成在其中的多个开口，并向光纤的多个匝提供压缩力。
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