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公开(公告)号：US20210294093A1
公开(公告)日：2021-09-23
申请号：US17207433
申请日：2021-03-19
Applicant: Obsidian Sensors, Inc.
Inventor： John HONG , Tallis CHANG , Bing WEN , Edward CHAN , Sean ANDREWS , Heesun SHIN
Abstract: Microelectromechanical system (MEMS) devices, methods of operating the MEMS device, and methods of manufacturing the MEMS device are disclosed. In some embodiments, the MEMS device includes a glass substrate; an electrode on the glass substrate; a hinge mechanically coupled to the electrode; a membrane mirror mechanically coupled to the hinge; a TFT on the glass substrate and electrically coupled to the electrode; and a control circuit comprising: a multiplexer configured to turn on or turn off the TFT; and a drive source configured to provide a drive signal for charging the electrode through the TFT. An amplitude of the drive signal corresponds to an amount of charge, and the amount of charge generates an electrostatic force for actuating the hinge and a portion of the membrane mirror mechanically coupled to the hinge.
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公开(公告)号：US10453766B2
公开(公告)日：2019-10-22
申请号：US15351180
申请日：2016-11-14
Applicant: OBSIDIAN SENSORS, INC.
Inventor： Yaoling Pan , Tallis Young Chang , John Hyunchul Hong
IPC: H01L51/56 , H01L23/31 , B81B7/00 , B81C1/00 , H01L21/56 , H01L21/683 , H01L21/768 , H01L23/522 , H01L23/528 , H01L27/12 , H01L33/52 , H01L33/62 , H01L51/00 , H01L51/52
Abstract: This disclosure provides devices and methods for 3-D device packaging with backside interconnections. One or more device elements can be hermetically sealed from an ambient environment, such as by vacuum lamination and bonding. One or more via connections provide electrical interconnection from a device element to a back side of a device substrate, and provide electrical interconnection from the device substrate to external circuitry on the back side of the device. The external circuitry can include a printed circuit board or flex circuit. In some implementations, an electrically conductive pad is provided on the back side, which is electrically connected to at least one of the via connections. In some implementations, the one or more via connections are electrically connected to one or more electrical components or interconnections, such as a TFT or a routing line.
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公开(公告)号：US10222265B2
公开(公告)日：2019-03-05
申请号：US15241742
申请日：2016-08-19
Applicant: OBSIDIAN SENSORS, INC.
Inventor： Edward Chan , Bing Wen
Abstract: Methods and devices are disclosed for sensing radiation emitted by an object. For example, one device includes a substrate and a movable layer coupled to the substrate. The movable layer is configured to receive radiation from the object and move relative to the substrate to a position in response to a change in temperature. The device also includes a sensor that is configured to produce a signal responsive to the position of the movable layer. The signal is indicative of the radiation emitted by the object.
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公开(公告)号：US20180138102A1
公开(公告)日：2018-05-17
申请号：US15351180
申请日：2016-11-14
Applicant: OBSIDIAN SENSORS, INC.
Inventor： Yaoling Pan , Tallis Young Chang , John Hyunchul Hong
IPC: H01L23/31 , H01L23/528 , H01L23/522 , H01L27/12 , H01L33/62 , H01L33/52 , H01L51/52 , B81B7/00 , H01L51/56 , H01L21/56 , H01L21/768 , H01L21/683 , H01L51/00 , B81C1/00
CPC classification number: H01L23/3121 , B81B7/0058 , B81C1/00238 , B81C1/00301 , B81C2203/0145 , B81C2203/0785 , B81C2203/0792 , H01L21/568 , H01L21/6835 , H01L21/76898 , H01L23/3135 , H01L23/5226 , H01L23/528 , H01L27/124 , H01L33/52 , H01L33/62 , H01L51/003 , H01L51/5203 , H01L51/5253 , H01L51/56 , H01L2933/005 , H01L2933/0066
Abstract: This disclosure provides devices and methods for 3-D device packaging with backside interconnections. One or more device elements can be hermetically sealed from an ambient environment, such as by vacuum lamination and bonding. One or more via connections provide electrical interconnection from a device element to a back side of a device substrate, and provide electrical interconnection from the device substrate to external circuitry on the back side of the device. The external circuitry can include a printed circuit board or flex circuit. In some implementations, an electrically conductive pad is provided on the back side, which is electrically connected to at least one of the via connections. In some implementations, the one or more via connections are electrically connected to one or more electrical components or interconnections, such as a TFT or a routing line.
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公开(公告)号：US20250123444A1
公开(公告)日：2025-04-17
申请号：US18915202
申请日：2024-10-14
Applicant: Obsidian Sensors, Inc.
Inventor： Karl JOHNSON , John HONG , Bing WEN , Sean ANDREWS , Heesun SHIN , Edward CHAN , Tallis CHANG
IPC: G02B6/35
Abstract: An integrated MEMS waveguide modulator, including: a static, non-suspended waveguide to guide light traveling through the waveguide; and a dielectric slab movable into and out of an evanescent field surrounding the waveguide using an actuation mechanism, wherein the dielectric slab is movable between a first position that is farthest away possible for the slab from the waveguide and a second position that is closest possible for the slab from the waveguide, wherein dispersion characteristic of the light is controlled by moving the dielectric slab from an unactuated mode that is at the first position to an actuated mode that is at the second position, and wherein the dielectric slab is layered to include non-uniform refractive index profile.
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Patent Agency Ranking
公开(公告)号：US20250042727A1
公开(公告)日：2025-02-06
申请号：US18737611
申请日：2024-06-07
Applicant: OBSIDIAN SENSORS, INC.
Inventor： John HONG , Tallis CHANG , Edward CHAN , Bing WEN , Yaoling PAN , Sean ANDREWS
Abstract: An electromechanical systems structure including: providing a stack, including a structural layer extending in a plane, a sidewall layer including a first portion lying in a plane parallel to the structural layer plane and a second portion lying in a plane transverse to the structural layer plane, an etch-stop layer, positioned between the sidewall layer and the structural layer, including an etch-selectivity different from an etch-selectivity of the structural layer and an etch-selectivity of the sidewall layer, and a mold comprising a wall parallel to the sidewall layer's second portion; etching the sidewall layer's first portion to expose the etch-stop layer; removing the mold; etching the etch-stop layer such that the sidewall layer's second portion masks a portion of the etch-stop layer; removing the sidewall layer's second portion; and etching the structural layer such that the portion of the etch-stop layer masks a portion of the structural layer.
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公开(公告)号：US20240359974A1
公开(公告)日：2024-10-31
申请号：US18750995
申请日：2024-06-21
Applicant: OBSIDIAN SENSORS, INC.
Inventor： John HONG , Tallis CHANG , Bing WEN , Edward CHAN , Sean ANDREWS , Heesun SHIN
IPC: B81C1/00
CPC classification number: B81C1/00373 , B81C1/00158
Abstract: Membrane fabrication including: depositing a bottom Molybdenum (Mo) layer; depositing a polyimide (PI) layer and defining a first release hole; curing the PI layer; depositing a top Mo layer; and defining and etching a second release hole within the first release hole.
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公开(公告)号：US12061331B2
公开(公告)日：2024-08-13
申请号：US17207433
申请日：2021-03-19
Applicant: Obsidian Sensors, Inc.
Inventor： John Hong , Tallis Chang , Bing Wen , Edward Chan , Sean Andrews , Heesun Shin
CPC classification number: G02B26/0833 , B81B7/02 , B81C1/00373 , B81B2201/042 , B81B2207/015
Abstract: Microelectromechanical system (MEMS) devices, methods of operating the MEMS device, and methods of manufacturing the MEMS device are disclosed. In some embodiments, the MEMS device includes a glass substrate; an electrode on the glass substrate; a hinge mechanically coupled to the electrode; a membrane mirror mechanically coupled to the hinge; a TFT on the glass substrate and electrically coupled to the electrode; and a control circuit comprising: a multiplexer configured to turn on or turn off the TFT; and a drive source configured to provide a drive signal for charging the electrode through the TFT. An amplitude of the drive signal corresponds to an amount of charge, and the amount of charge generates an electrostatic force for actuating the hinge and a portion of the membrane mirror mechanically coupled to the hinge.
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公开(公告)号：US11983953B2
公开(公告)日：2024-05-14
申请号：US17763591
申请日：2020-09-23
Applicant: Obsidian Sensors, Inc.
CPC classification number: G06V40/1318 , G06F3/041
Abstract: Methods and systems for sensing a user interaction (e.g., a fingerprint) with a display of an electronic device are disclosed. In some embodiments, the method includes illuminating, with a light source, a position of a user interaction on the display. In some embodiments, the method includes detecting, with a detector, a backscattered light from the position. In some embodiments, the light source and the detector are located on a same layer of the display.
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公开(公告)号：US11959806B2
公开(公告)日：2024-04-16
申请号：US18132773
申请日：2023-04-10
Applicant: Obsidian Sensors, Inc.
Inventor： John Hong , Bing Wen , Edward Chan , Tallis Chang , Sean Andrews
CPC classification number: G01J5/024 , B81B3/0029 , G01J5/20 , H04N23/11 , B81B2201/047
Abstract: Disclosed herein are MEMS devices and systems and methods of manufacturing or operating the MEMS devices and systems. In some embodiments, the MEMS devices and systems are used in imaging applications.
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