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公开(公告)号：US10514477B2
公开(公告)日：2019-12-24
申请号：US15370600
申请日：2016-12-06
Applicant: PixArt Imaging Incorporation
Inventor： En-Feng Hsu , Nien-Tse Chen
IPC: G01S7/481 , G01S17/02 , H01L31/02 , H01L31/0203 , H01L31/0216 , H01L31/14 , G01V8/12
Abstract: The present invention provides a package structure of an optical apparatus which includes a substrate, a light emitting device, a light sensing device, and a light barrier member. The light emitting device is disposed on the substrate and electrically connected to the substrate. The light emitting device is for emitting light. The light sensing device is disposed on the substrate and is a chip scale package (CSP) device. The light sensing device is for receiving light reflected by an object. The light barrier member is disposed around a periphery of the light sensing device.
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公开(公告)号：US20190303659A1
公开(公告)日：2019-10-03
申请号：US16444006
申请日：2019-06-18
Applicant: PixArt Imaging Incorporation
Inventor： Ren-Hau Gu , Chih-Yen Wu
Abstract: The present invention discloses an identification system which includes an image sensor, a storage unit and a comparing unit. The image sensor captures a plurality of images of the motion trajectory generated by a user at different timings. The storage unit has stored motion vector information of a group of users including or not including the user generating the motion trajectory. The comparing unit compares the plurality of images with the motion vector information to identify the user. The present invention also provides an identification method.
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公开(公告)号：US10283612B2
公开(公告)日：2019-05-07
申请号：US15911113
申请日：2018-03-03
Applicant: PixArt Imaging Incorporation
Inventor： Chih-Ming Sun , Hsin-Hui Hsu , Ming-Han Tsai
IPC: H01L21/308 , H01L21/762 , H01L29/51 , H01L29/40 , H01L29/423
Abstract: The present invention discloses a manufacturing method for a semiconductor device. The manufacturing method includes: providing a substrate; forming a semiconductor stacked structure on the substrate; forming at least apart of a stacked cap layer on the semiconductor stacked structure, wherein the part of the stacked cap layer includes a nitride layer; removing a part of the nitride layer; forming the rest part of the stacked cap layer; forming a protection layer on the stacked cap layer, and etching the protection layer to form an opening, wherein the nitride layer is not exposed by the opening; and introducing an etchant material into the opening to etch the substrate. The present invention also provides a semiconductor device made by the method.
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公开(公告)号：US10222457B2
公开(公告)日：2019-03-05
申请号：US15226599
申请日：2016-08-02
Applicant: PixArt Imaging Incorporation
Inventor： Nientse Chen
Abstract: A proximity sensor includes a transmitter unit, a receiver unit, and a housing. The transmitter unit transmits a light signal. The receiver unit receives the light signal reflected by an object to determine a proximity status of the object. The housing defines a first enclosed accommodation space for accommodating the receiver unit, wherein the portion of the housing defining the first enclosed accommodation space has a sealed light passage made of a light-transmissible material such that the receiver unit is capable of receiving the light signal reflected by the object through the light passage. The housing can further include a second enclosed accommodation space for accommodating the transmitter unit.
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公开(公告)号：US20180346320A1
公开(公告)日：2018-12-06
申请号：US16100447
申请日：2018-08-10
Applicant: PixArt Imaging Incorporation
Inventor： Chuan-Wei Wang
IPC: B81B7/00
CPC classification number: B81B7/0061 , B81B3/007 , B81B2201/0257 , B81B2201/0264 , B81B2203/0127 , B81B2203/0315 , B81B2203/04 , B81C1/00309 , B81C2201/0109 , G01L9/0073 , H01L28/00
Abstract: The present invention discloses a Micro-Electro-Mechanical System (MEMS) acoustic pressure sensor device and a method for making same. The MEMS device includes: a substrate; a fixed electrode provided on the substrate; and a multilayer structure, which includes multiple metal layers and multiple metal plugs, wherein the multiple metal layers are connected by the multiple metal plugs. A cavity is formed between the multilayer structure and the fixed electrode. Each metal layer in the multilayer structure includes multiple metal sections. The multiple metal sections of one metal layer and those of at least another metal layer are staggered to form a substantially blanket surface as viewed from a moving direction of an acoustic wave.
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Patent Agency Ranking
公开(公告)号：US10081538B2
公开(公告)日：2018-09-25
申请号：US15494535
申请日：2017-04-23
Applicant: PixArt Imaging Incorporation
Inventor： Chuan-Wei Wang
CPC classification number: B81B7/0061 , B81B3/007 , B81B2201/0257 , B81B2201/0264 , B81B2203/0127 , B81B2203/0315 , B81B2203/04 , B81C1/00309 , B81C2201/0109 , G01L9/0073 , H01L28/00
Abstract: The present invention discloses a Micro-Electro-Mechanical System (MEMS) acoustic pressure sensor device and a method for making same. The MEMS device includes: a substrate; a fixed electrode provided on the substrate; and a multilayer structure, which includes multiple metal layers and multiple metal plugs, wherein the multiple metal layers are connected by the multiple metal plugs. A cavity is formed between the multilayer structure and the fixed electrode. Each metal layer in the multilayer structure includes multiple metal sections. The multiple metal sections of one metal layer and those of at least another metal layer are staggered to form a substantially blanket surface as viewed from a moving direction of an acoustic wave.
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公开(公告)号：US20170138795A1
公开(公告)日：2017-05-18
申请号：US15249214
申请日：2016-08-26
Applicant: PixArt Imaging Incorporation
Inventor： Ming-Han Tsai , Shin-Lin Wang
IPC: G01J5/16
Abstract: The present invention discloses a thermal pile sensing structure integrated with one or more capacitors, which includes: a substrate, an infrared sensing unit and a partition structure. The infrared sensing unit includes a first and a second sensing structure. A hot junction is formed between the first and the second sensing structures at a location where the first and the second sensing structures are close to each other. A cold junction is formed between the partition structure and the first sensing structure at a location where these two structures are close to each other. Another cold junction is formed between the partition structure and the second sensing structure at a location where these two structures are close to each other. A temperature difference between the hot junction and the cold junction generates a voltage difference signal. Apart of the partition structure forms at least one capacitor.
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公开(公告)号：US09627286B1
公开(公告)日：2017-04-18
申请号：US15203068
申请日：2016-07-06
Applicant: PixArt Imaging Incorporation
Inventor： Kuo-Hsiung Li , Chi-Chih Shen , Jui-Cheng Chuang , Jen-Yu Chen
IPC: H01L23/48 , H01L23/52 , H01L29/40 , H01L23/16 , H01L23/055
CPC classification number: H01L23/16 , H01L23/04 , H01L23/055 , H01L23/10
Abstract: The invention provides a package structure which includes a substrate, at least one chip module, and a housing. The at least one chip module is located on the substrate. The housing includes an upper cover, a surrounding wall, and at least one adhesion enhancement structure. The surrounding wall is connected to the upper cover and encompasses the at least one chip module. The surrounding wall and the adhesion enhancement structure are bonded to the substrate by an adhesive. The adhesion enhancement structure includes an encircled hole or a semi-encircled hole.
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公开(公告)号：US20240159873A1
公开(公告)日：2024-05-16
申请号：US18418200
申请日：2024-01-19
Applicant: PixArt Imaging Incorporation
Inventor： Nientse Chen
CPC classification number: G01S7/4813 , G01S7/4811 , G01S17/04 , H01L2224/48091 , H01L2924/16153 , Y10T29/49016
Abstract: A proximity sensor includes: a transmitter unit for transmitting a light signal; a receiver unit for receiving the light signal reflected by an object to determine a proximity status of the object; and a housing defining a first enclosed accommodation space for accommodating the receiver unit, wherein the portion of the housing which defines the first enclosed accommodation space has a sealed light passage made of a light-transmissible material such that the receiver unit is capable of receiving the light signal reflected by the object through the light passage. The housing can further include a second enclosed accommodation space for accommodating the transmitter unit.
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公开(公告)号：US11885689B2
公开(公告)日：2024-01-30
申请号：US17067718
申请日：2020-10-11
Applicant: PixArt Imaging Incorporation
Inventor： Chih-Ming Sun , Ming-Han Tsai
IPC: G01J5/02 , B81B7/02 , B81B7/00 , G01J5/14 , G01J5/04 , G01J5/00 , H04N23/56 , A61B5/01 , A61B5/00 , G01K13/20 , A61B5/024 , A61B5/1455
CPC classification number: G01J5/0265 , A61B5/01 , A61B5/681 , B81B7/0025 , B81B7/0061 , B81B7/02 , G01J5/0025 , G01J5/027 , G01J5/04 , G01J5/046 , G01J5/14 , G01K13/20 , H04N23/56 , A61B5/02416 , A61B5/14551 , A61B2562/0233 , B81B2201/0214 , B81B2201/0235 , B81B2201/0242 , B81B2201/0278 , H01L2224/48091 , H01L2924/16151 , H01L2924/16153 , H01L2924/16235 , H01L2224/48091 , H01L2924/00014
Abstract: The present invention discloses a wearable device with combined sensing capabilities, which includes a wearable assembly and at least one multi-function sensor module. The wearable assembly is suitable to be worn on apart of a user's body. The wearable assembly includes at least one light-transmissible window. The multi-function sensor module is located inside the wearable assembly, for performing an image sensing function and an infrared temperature sensing function. The multi-function sensor module includes an image sensor module for sensing a physical or a biological feature of an object through the light-transmissible window by way of image sensing; and an infrared temperature sensor module for sensing temperature through the light-transmissible window by way of infrared temperature sensing.
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