公开(公告)号：US20130146913A1

公开(公告)日：2013-06-13

申请号：US13670418

申请日：2012-11-06

Applicant: Po-Jen Su ,  Yun-Li Li ,  Cheng-Yen Chen ,  Gwo-Jiun Sheu

Inventor： Po-Jen Su ,  Yun-Li Li ,  Cheng-Yen Chen ,  Gwo-Jiun Sheu

IPC: H01L33/60

CPC classification number: H01L23/3677 ,  H01L33/46 ,  H01L33/62 ,  H01L33/641 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/16 ,  H01L2924/19107

Abstract: An electronic device including an insulating substrate, a chip and a patterned conductive layer is provided. The insulating substrate has an upper surface and a lower surface opposite to each other. The chip is disposed above the upper surface of the insulating substrate. The patterned conductive layer is disposed between the upper surface of the insulating substrate and the chip. The chip is electrically connected to an external circuit via the patterned conductive layer. Heat generated by the chip is transferred to external surroundings via the patterned conductive layer and the insulating substrate.

Abstract translation: 提供了包括绝缘基板，芯片和图案化导电层的电子器件。 绝缘基板具有彼此相对的上表面和下表面。 芯片设置在绝缘基板的上表面之上。 图案化导电层设置在绝缘基板的上表面和芯片之间。 芯片通过图案化的导电层电连接到外部电路。 由芯片产生的热量经由图案化的导电层和绝缘基板转移到外部环境。

公开(公告)号：US08179704B2

公开(公告)日：2012-05-15

申请号：US12583349

申请日：2009-08-18

Applicant: Ryan Wang ,  Po-Jen Su

Inventor： Ryan Wang ,  Po-Jen Su

IPC: H02H7/125

CPC classification number: H05B33/0809 ,  H05B33/089 ,  Y02B20/341 ,  Y10S323/908

Abstract: An electronic device includes a circuit protection unit providing over-current protection to a main circuit and including a series connection of first and second current limiting circuits, and a normally-open branch circuit coupled in parallel to the first current limiting circuit and operable to conduct when a voltage across the first current limiting circuit reaches a first predetermined threshold voltage not greater than an endure voltage of the first current limiting circuit. Prior to conduction of the branch circuit, the first current limiting circuit maintains a current flowing therethrough at a first limit value when a current flowing through the main circuit reaches the first limit value. Upon conduction of the branch circuit, the second current limiting circuit maintains a current flowing therethrough at a second limit value greater than the first limit value when the current flowing through the main circuit reaches the second limit value.

Abstract translation: 电子设备包括电路保护单元，其向主电路提供过电流保护，并且包括第一和第二限流电路的串联连接以及与第一限流电路并联耦合的常开支路，并且可操作地导通 当第一限流电路两端的电压达到不大于第一限流电路的耐受电压的第一预定阈值电压时。 在分支电路导通之前，当流经主电路的电流达到第一极限值时，第一限流电路将流过其中的电流保持在第一极限值。 在分支电路导通时，当流过主电路的电流达到第二极限值时，第二限流电路保持流过其中的电流，大于第一极限值的第二极限值。

公开(公告)号：US20100165677A1

公开(公告)日：2010-07-01

申请号：US12583349

申请日：2009-08-18

Applicant: Ryan Wang ,  Po-Jen Su

Inventor： Ryan Wang ,  Po-Jen Su

IPC: H02H9/02

CPC classification number: H05B33/0809 ,  H05B33/089 ,  Y02B20/341 ,  Y10S323/908

Abstract: An electronic device includes a circuit protection unit providing over-current protection to a main circuit and including a series connection of first and second current limiting circuits, and a normally-open branch circuit coupled in parallel to the first current limiting circuit and operable to conduct when a voltage across the first current limiting circuit reaches a first predetermined threshold voltage not greater than an endure voltage of the first current limiting circuit. Prior to conduction of the branch circuit, the first current limiting circuit maintains a current flowing therethrough at a first limit value when a current flowing through the main circuit reaches the first limit value. Upon conduction of the branch circuit, the second current limiting circuit maintains a current flowing therethrough at a second limit value greater than the first limit value when the current flowing through the main circuit reaches the second limit value.

Abstract translation: 电子设备包括电路保护单元，其向主电路提供过电流保护，并且包括第一和第二限流电路的串联连接以及与第一限流电路并联耦合的常开支路，并且可操作地导通 当第一限流电路两端的电压达到不大于第一限流电路的耐受电压的第一预定阈值电压时。 在分支电路导通之前，当流经主电路的电流达到第一极限值时，第一限流电路将流过其中的电流保持在第一极限值。 在分支电路导通时，当流过主电路的电流达到第二极限值时，第二限流电路保持流过其中的电流，大于第一极限值的第二极限值。

公开(公告)号：US20070235739A1

公开(公告)日：2007-10-11

申请号：US11393819

申请日：2006-03-31

Applicant: Tsung-Ting Sun ,  Hung-Ta Laio ,  Tz-Shiuan Yan ,  Po-Jen Su

Inventor： Tsung-Ting Sun ,  Hung-Ta Laio ,  Tz-Shiuan Yan ,  Po-Jen Su

IPC: H01L33/00

CPC classification number: H01L33/642 ,  H01L33/486 ,  H01L2224/48091 ,  H05K1/0204 ,  H01L2924/00014

Abstract: A structure of heat dissipation of implant type light emitting diode package having a heat column and a method of manufacturing the same include a substrate, a heat column, and a light emitting diode chip, and the heat column is implanted directly onto a predetermined position of the light emitting diode chip of the substrate and penetrated through both surfaces of a circuit board, and a distal surface of the heat column is coupled with the light emitting diode chip to form a heat conducting end, so that the operating heat produced by a light emitting diode can be dispersed from the package structure through the heat column, so as to achieve an optimal heat dissipating effect.

Abstract translation: 具有热柱的注入型发光二极管封装的散热结构及其制造方法包括基板，热柱和发光二极管芯片，并且将热柱直接注入到 基板的发光二极管芯片穿过电路板的两个表面，并且热柱的远端表面与发光二极管芯片耦合以形成导热端，使得由光产生的工作热 发光二极管可以从封装结构通过散热柱分散，从而达到最佳散热效果。

公开(公告)号：US08895862B2

公开(公告)日：2014-11-25

申请号：US13572705

申请日：2012-08-13

Applicant: Sheng-Yuan Sun ,  Po-Jen Su

Inventor： Sheng-Yuan Sun ,  Po-Jen Su

IPC: H05K1/00

CPC classification number: H01L25/0753 ,  H01L23/3677 ,  H01L33/62 ,  H01L33/642 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A substrate structure for carrying plural heat generating elements is provided. The substrate structure includes a board, a patterned metal layer and plural heat dissipating channels. The board has an upper surface. The patterned metal layer is disposed on the board and includes a first electrode, a second electrode, plural first pads and plural second pads. The first pads and the second pads are alternatively disposed on the upper surface in parallel. Parts of the first (second) pads are electrically connected to the first (second) electrode. The other parts of first pads and the other parts of second pads are electrically connected to each other. Each first pad and the adjacent second pad define a device bonding area. The heat generating elements are respectively disposed in the device bonding areas. There are multiple trenches between the two adjacent device bonding areas. The heat dissipating channels are disposed in the trenches.

Abstract translation: 提供了用于承载多个发热元件的基板结构。 基板结构包括板，图案化金属层和多个散热通道。 电路板有一个上表面。 图案化金属层设置在板上，包括第一电极，第二电极，多个第一焊盘和多个第二焊盘。 第一焊盘和第二焊盘交替地平行布置在上表面上。 第一（第二）焊盘的部分电连接到第一（第二）电极。 第一焊盘的其他部分和第二焊盘的其它部分彼此电连接。 每个第一焊盘和相邻的第二焊盘限定一个器件接合区域。 发热元件分别设置在装置接合区域中。 两个相邻的器件接合区域之间有多个沟槽。 散热通道设置在沟槽中。

公开(公告)号：US08890217B2

公开(公告)日：2014-11-18

申请号：US13670418

申请日：2012-11-06

Applicant: Po-Jen Su ,  Yun-Li Li ,  Cheng-Yen Chen ,  Gwo-Jiun Sheu

Inventor： Po-Jen Su ,  Yun-Li Li ,  Cheng-Yen Chen ,  Gwo-Jiun Sheu

IPC: H01L23/48

CPC classification number: H01L23/3677 ,  H01L33/46 ,  H01L33/62 ,  H01L33/641 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/16 ,  H01L2924/19107

Abstract: An electronic device including an insulating substrate, a chip and a patterned conductive layer is provided. The insulating substrate has an upper surface and a lower surface opposite to each other. The chip is disposed above the upper surface of the insulating substrate. The patterned conductive layer is disposed between the upper surface of the insulating substrate and the chip. The chip is electrically connected to an external circuit via the patterned conductive layer. Heat generated by the chip is transferred to external surroundings via the patterned conductive layer and the insulating substrate.

Abstract translation: 提供了包括绝缘基板，芯片和图案化导电层的电子器件。 绝缘基板具有彼此相对的上表面和下表面。 芯片设置在绝缘基板的上表面之上。 图案化导电层设置在绝缘基板的上表面和芯片之间。 芯片通过图案化的导电层电连接到外部电路。 由芯片产生的热量经由图案化的导电层和绝缘基板转移到外部环境。

公开(公告)号：US20130285083A1

公开(公告)日：2013-10-31

申请号：US13798126

申请日：2013-03-13

Applicant: Sheng-Yuan Sun ,  Po-Jen Su

Inventor： Sheng-Yuan Sun ,  Po-Jen Su

IPC: H01L27/15

CPC classification number: F21K9/64 ,  F21V9/30 ,  F21V13/02 ,  F21V19/0025 ,  F21Y2101/00 ,  F21Y2113/10 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L27/15 ,  H01L33/20 ,  H01L33/50 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A light emitting module including a substrate, a plurality of first light emitting diode (LED) chips and a plurality of second LED chips is provided. The substrate has a cross-shaped central region and a peripheral region surrounding the cross-shaped central region. The first LED chips are disposed on the substrate and at least located in the cross-shaped central region. The second LED chips are disposed on the substrate and at least located in the peripheral region. A size of each second LED chip is smaller than a size of each first LED chip. The number of the first LED chips located in the peripheral region is smaller than that in the cross-shaped central region. The number of the second LED chips located in the cross-shaped central region is smaller than that in the peripheral region.

Abstract translation: 提供了包括基板，多个第一发光二极管（LED）芯片和多个第二LED芯片的发光模块。 衬底具有十字形中心区域和围绕十字形中心区域的周边区域。 第一LED芯片设置在基板上并且至少位于十字形中心区域中。 第二LED芯片设置在基板上并且至少位于周边区域中。 每个第二LED芯片的尺寸小于每个第一LED芯片的尺寸。 位于周边区域的第一LED芯片的数量小于十字形中心区域中的数量。 位于十字形中心区域的第二LED芯片的数量小于周边区域中的第二LED芯片的数量。

公开(公告)号：US20120218749A1

公开(公告)日：2012-08-30

申请号：US13348296

申请日：2012-01-11

Applicant: Po-Jen SU

Inventor： Po-Jen SU

IPC: F21V9/00

CPC classification number: H01L25/0753 ,  H01L33/50 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A light-emitting device including a substrate and a plurality of the semiconductor light-emitting diode dice having dominant wavelengths between 440 nm and 490 nm is disclosed. The semiconductor light-emitting diode dice are disposed on the substrate and electrically connected to the substrate. The difference in the wavelength of the semiconductor light-emitting diode dice between the maximum dominant wavelength and the minimum dominant wavelength is at least 10 nm and the average dominant wavelength is between 450 nm and 470 nm. Therefore, by the above arrangement, it not only homogenizes the light emitted from the light-emitting device of the present invention, but also depletes the surplus stocks of the semiconductor light-emitting diode dice on the production line.

Abstract translation: 公开了一种发光器件，其包括基板和多个具有440nm和490nm之间的主波长的半导体发光二极管芯片。 半导体发光二极管管芯设置在基板上并与基板电连接。 最大主波长和最小主波长之间的半导体发光二极管管芯的波长差异至少为10nm，平均主波长在450nm与470nm之间。 因此，通过上述结构，不仅使从本发明的发光装置发出的光均质化，而且消耗了生产线上的半导体发光二极管骰子的剩余原料。

公开(公告)号：US20120205707A1

公开(公告)日：2012-08-16

申请号：US13287441

申请日：2011-11-02

Applicant: Yun-Li LI ,  Po-Jen Su

Inventor： Yun-Li LI ,  Po-Jen Su

IPC: H01L33/62

CPC classification number: H01L33/486 ,  H01L24/32 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2924/12041 ,  H01L2933/0033 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light-emitting diode package includes: a frame unit, and at least one light-emitting diode chip including a chip body and a contact layer disposed between the chip body and the frame unit. One of the frame unit and the contact layer contains a magnetic material, and the other one of the frame unit and the contact layer contains a material capable of being magnetically attracted to the magnetic material.

Abstract translation: 一种发光二极管封装，包括：框架单元，以及至少一个发光二极管芯片，其包括芯片体和布置在芯片本体与框架单元之间的接触层。 框架单元和接触层中的一个包含磁性材料，框架单元和接触层中的另一个包含能够被磁性吸引到磁性材料的材料。

公开(公告)号：US20120205703A1

公开(公告)日：2012-08-16

申请号：US13371817

申请日：2012-02-13

Applicant: Po-Jen SU

Inventor： Po-Jen SU

IPC: H01L33/44 ,  H01L33/52

CPC classification number: H01L33/54 ,  H01L33/505 ,  H01L33/507 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2933/005 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light-emitting diode package device includes: a base unit defining a packaging space; a light-emitting diode die that is disposed inside the packaging space to electrically connect to the base unit and that is capable of emitting light; and an encapsulant that is filled in the packaging space to encapsulate the light-emitting diode die and that includes an upper surface to be exposed to external environment, and a plurality of microstructures formed on the upper surface.

Abstract translation: 发光二极管封装器件包括：限定封装空间的基座单元; 发光二极管管芯，其设置在所述封装空间内以电连接到所述基座单元并且能够发光; 以及密封剂，其填充在所述封装空间中以封装所述发光二极管管芯并且包括要暴露于外部环境的上表面，以及形成在所述上表面上的多个微结构。