Abstract:
In one embodiment, a communication system for a multi-blade server system includes a multi-drop serial bus network interconnecting a management module with each of a plurality of servers in a multi-server chassis. A first transceiver subsystem is configured for communicating over the serial bus network between the management module and each server within a first frequency band. A second transceiver subsystem is configured for simultaneously communicating over the serial bus network between the management module and the servers within a second frequency band higher than the first frequency band. A first signal-filtering subsystem substantially filters out signals in the second frequency band from the first transceiver subsystem. A second signal-filtering subsystem substantially filters out the signals in the first frequency band from the second transceiver subsystem.
Abstract:
A method of electrically qualifying high speed printed circuit board (PCB) connectors includes mounting a PCB connector on a test card, sending bit patterns through a first portion of the test card, evaluating a waveform on a sense signal on a second portion of the test card for the bit patterns launched on said first portion of the test card to measure common mode noise, and comparing the measured common mode noise of the second portion of the test card to a golden standard performed on a pre-qualified connector. The first portion of the test card comprises connectors to inject bit patterns. The second portion of the test card includes a split plane which induces common mode noise on a sense signal, the sense signal, and a termination pack. If the measured common mode noise on the PCB connector is worse than the golden standard, then the PCB connector is disqualified. If the measured common mode noise on the PCB connector is as good as or better than the golden standard, then the PCB connector is qualified. A first section of the PCB connector connects to the first portion of the test card and a second section of the PCB connector connects to the second portion of the test card. Transmission lines in the test card and the sense line are tightly coupled by shortening a distance between the sense line and the transmission lines.
Abstract:
A method for testing a printed circuit board to determining the dielectric loss associated with the circuit board material relative to a standard. Dielectric losses in the material generate heat when a high frequency electronic signal, such as a microwave frequency signal, is communicated through a microstrip that is embedded within the printed circuit board. The temperature or spectrum at the surface of printed circuit board is measured and compared against the temperature or spectrum of the standard to determine whether the material under test is acceptable. While various temperature measurement devices may be used, the temperature is preferably measured without contacting the surface, such as using an infrared radiation probe.
Abstract:
The present invention assesses memory (DIMM) strength by calculating frequency content of a radiated field which is collected by an apparatus, such as a dipole antenna. Radiated field is created by accelerated charge, which is a function of the slew rate or DIMM strength. Radiated power is directly proportional to the frequency at which bits are driven. By separating the radiated field from the near field or stored field, the DIMM strength content is isolated from other functional DIMM issues, such as tRCD latency, refresh cycles, addressing mode, etc. By examining the radiated power, the disadvantages of the prior art, such as by probing the DIMM's contacts, are avoided.
Abstract:
A design structure embodied in a machine readable storage medium for designing, manufacturing, and/or testing a memory module system and DIMM connector is provided. A DIMM connector includes a plurality of DIMM sockets for receiving a corresponding plurality of DIMMs in a radially oriented, angularly spaced orientation. The DIMM sockets are connected in parallel at a memory module junction so that socket terminals of each DIMM socket are joined to the same relative terminal of all the other DIMM sockets along electronic pathways of substantially equal length. A memory controller selectively communicates with the DIMMs via the DIMM junction. By virtue of the improved topology, impedance within the DIMM connector may be better matched to minimize reflections and improve signal quality.
Abstract:
Embodiments of the invention address deficiencies of the art in respect to digital signal transmissions and provide a novel and non-obvious fall time accelerator circuit for use in a USB interface. In one embodiment of the invention, the USB interface can include a USB port driver coupled to a host controller driver over a USB bus. The USB interface also can include a fall time accelerator circuit coupled to the USB bus between the USB port driver and the host controller driver. The fall time accelerator circuit can include a pulse signal generator coupled to an inbound signal path from the USB bus and arranged to generate a tunable pulse upon detecting a falling edge of a digital signal on the inbound signal path. The circuit further can include an active timer additionally coupled to the inbound signal path to hold the tunable pulse for a set period of time. Finally, the circuit can include a falling drive signal strengthener coupled to an outbound signal path from the pulse signal generator arranged to release the tunable pulse on the outbound signal path onto the USB bus.
Abstract:
Connector and methods of connector design and manufacture are disclosed for achieving a desired phase relationship between signals carried along conductors of different lengths, while maintaining a desired impedance of the conductors. In one embodiment, a PCB connector includes a first plurality of electronic terminals and a second plurality of electronic terminals disposed on a connector body. A substrate has a dielectric constant that varies with location within the substrate. A first electronic conductor follows a first pathway within the substrate to experience a first effective dielectric constant. A second electronic conductor follows a second pathway within the substrate to experience a second effective dielectric constant. The first electronic conductor is longer than the second electronic conductor and the first effective dielectric constant is less than the second effective dielectric constant, to at least reduce phase error between signals. By satisfying the relationship l1/l2=sqrt(ε2/ε1), a phase error may be avoided.
Abstract:
A DIMM riser card that includes a PCB having a first edge, a second edge, and one or more faces. The first edge of the PCB is configured for insertion into a main board DIMM socket. The first edge includes electrical traces that electrically couple to a memory bus. The DIMM riser card includes an angled DIMM socket mounted on one face of the PCB, where the angled DIMM socket is configured to accept a DIMM at an angle not perpendicular to the PCB and electrically couple the DIMM to the memory bus. The DIMM riser card includes a straddle mount DIMM socket mounted on the second edge of the PCB. The straddle mount DIMM socket is configured to accept a DIMM and electrically couple the DIMM to the memory bus through the electrical traces on the first edge of the PCB.
Abstract:
A solar cell interconnect assembly and a method for manufacturing the same are provided. In an embodiment, the method may include: providing a solar cell having an interconnect member formed thereon, the interconnect member comprising a metallic part formed on a surface of the solar cell and a first precursor layer formed over the metallic part; providing an interconnector comprising a second precursor layer at a surface thereof; heating the interconnector and the interconnect member to a temperature equal to or above a eutectic temperature of the materials of the first and second precursor layers and pressing one of them against the other so as to form a eutectic liquid phase; and isothermal solidifying the eutectic liquid to form a bonding layer of eutectic alloy.
Abstract:
The present invention in a preferred embodiment provides systems and methods for facilitation of recruitment or hiring on an online interface which provide the employer with the “jobseekers' search list” based on a predefined questionnaire or custom questionnaire comprising of direct questions or queries or multiple choice options, whereby any descriptive or elaborate answers or details are eliminated. Jobseekers' attributes are matched with employers' desired job attributes based on the predefined questionnaire or custom questionnaires. Matching of the attributes generates scores or ranks depending on a pre-defined system and weightage provided to specific job attributes.