Liquid Chemical for Forming Protective Film, and Cleaning Method for Wafer Surface
    11.
    发明申请
    Liquid Chemical for Forming Protective Film, and Cleaning Method for Wafer Surface 审中-公开
    用于形成保护膜的液体化学品和晶片表面的清洁方法

    公开(公告)号:US20130104931A1

    公开(公告)日:2013-05-02

    申请号:US13807708

    申请日:2011-06-15

    IPC分类号: C09D5/38

    摘要: Disclosed is a liquid chemical for forming a water repellent protective film at least on surfaces of recessed portions of a metal-based wafer, the liquid chemical for forming a water repellent protective film being characterized by comprising a surfactant which has an HLB value of 0.001-10 according to Griffin's method and includes a hydrophobic moiety having a C6-C18 hydrocarbon group and water, and characterized in that the concentration of the surfactant in the liquid chemical is not smaller than 0.00001 mass % and not larger than the saturated concentration relative to 100 mass % of the total amount of the liquid chemical. This liquid chemical can improve a cleaning step which tends to induce a metal-based wafer to cause a pattern collapse.

    摘要翻译: 公开了一种用于在至少在金属基晶片的凹部的表面上形成防水保护膜的液体化学品,用于形成防水保护膜的液体化学品的特征在于包含HLB值为0.001- 10,根据Griffin的方法,包括具有C6-C18烃基和水的疏水部分,其特征在于,液体化学品中表面活性剂的浓度不小于0.00001质量%且不大于相对于100的饱和浓度 液体化学品总量的质量%。 这种液体化学品可以改善易于引起金属基晶片导致图案塌陷的清洁步骤。

    Process for Cleaning Wafers
    13.
    发明申请
    Process for Cleaning Wafers 审中-公开
    清洗晶圆的工艺

    公开(公告)号:US20120164818A1

    公开(公告)日:2012-06-28

    申请号:US13032308

    申请日:2011-02-22

    IPC分类号: H01L21/322

    CPC分类号: H01L21/02057

    摘要: Disclosed is a process for cleaning a wafer having an uneven pattern at its surface. The process includes at least: a step of cleaning the wafer; a step of substituting a cleaning liquid retained in recessed portions of the wafer with a water-repellent liquid chemical after cleaning; and a step of drying the wafer. The process is characterized in that the cleaning liquid has a boiling point of 55 to 200° C., and characterized in that the water-repellent liquid chemical used for the substitution has a temperature of not lower than 40° C. and lower than a boiling point of the water-repellent liquid chemical thereby imparting water repellency at least to surfaces of the recessed portions. With this process, it is possible to provide a cleaning process for improving the cleaning step that tends to induce a pattern collapse.

    摘要翻译: 公开了一种在其表面上清洁具有不均匀图案的晶片的方法。 该方法至少包括:清洁晶片的步骤; 在清洁之后用拒水性液体化学品代替保留在晶片的凹陷部分中的清洁液体的步骤; 以及干燥晶片的步骤。 该方法的特征在于清洗液的沸点为55-200℃,其特征在于用于替代的拒水液体化学品的温度不低于40℃,低于 所述防水液体化学品的沸点至少赋予所述凹部的表面防水性。 通过该处理,可以提供改善倾向于引起图案塌陷的清洁步骤的清洁处理。

    Heat Ray Shielding Glass for Vehicle and Process for Producing the Same
    15.
    发明申请
    Heat Ray Shielding Glass for Vehicle and Process for Producing the Same 有权
    用于车辆的热射线屏蔽玻璃及其制造方法

    公开(公告)号:US20100227159A1

    公开(公告)日:2010-09-09

    申请号:US12377439

    申请日:2007-08-22

    IPC分类号: B32B17/06 B32B5/00 B05D5/06

    摘要: [Problems] To develop a heat ray shielding glass usable as a vehicle glass having up-and-down function, the heat ray shielding glass having a film hardness and generating no abnormal noise by friction due to up-and-down movement.[Means for Solving Problems] A heat ray shielding glass for vehicle, including a glass substrate and a heat ray shielding film formed on at least one surface of the glass substrate, in which the heat ray shielding film includes: conductive oxide ultrafine particles dispersed in the film; and a silica binder for binding the ultrafine particles to each other, the silica binder including solid contents produced by hydrolysis and polycondensation of tetraalkoxysilane and trialkoxysilane. In the heat ray shielding film, a ratio between the solid content made from the tetraalkoxysilane and the solid content made from the trialkoxysilane is within a range of from 55:45 to 85:15 on a weight percentage basis, and a ratio between the conductive oxide ultrafine particles and the silica binder is within a range of from 35:65 to 70:30 on a weight percentage basis.

    摘要翻译: [问题]为了开发可用作具有上下功能的车辆玻璃的热射线屏蔽玻璃,该热射线屏蔽玻璃具有膜硬度并且由于上下运动而不产生由摩擦产生的异常噪声。 解决问题的手段一种车辆用热线屏蔽玻璃,其特征在于,包括形成在玻璃基板的至少一个面上的玻璃基板和热射线屏蔽膜,其中,所述热射线屏蔽膜包括:导电性氧化物超微粒分散在 这个电影; 以及用于将超细颗粒彼此粘合的二氧化硅粘合剂,所述二氧化硅粘合剂包括通过四烷氧基硅烷和三烷氧基硅烷的水解和缩聚产生的固体内容物。 在热射线屏蔽膜中,由四烷氧基硅烷制成的固体含量与由三烷氧基硅烷制成的固体含量之间的比例以重量百分数计为55:45至85:15,导电性 氧化物超细颗粒和二氧化硅粘合剂的重量百分数在35:65至70:30的范围内。

    PROCESS FOR CLEANING WAFERS
    19.
    发明申请
    PROCESS FOR CLEANING WAFERS 有权
    清洗过程

    公开(公告)号:US20120211025A1

    公开(公告)日:2012-08-23

    申请号:US13350007

    申请日:2012-01-13

    CPC分类号: H01L21/02057

    摘要: A process for cleaning a wafer having an uneven pattern at its surface. The process includes at least the steps of: cleaning the wafer with a cleaning liquid; substituting the cleaning liquid retained in recessed portions of the wafer with a water-repellent liquid chemical after cleaning; and drying the wafer, wherein the cleaning liquid contains 80 mass % or greater of a solvent having a boiling point of 55 to 200° C., and wherein the water-repellent liquid chemical supplied in the substitution step has a temperature of not lower than 40° C. and lower than a boiling point of the water-repellent liquid chemical thereby imparting water repellency at least to surfaces of the recessed portions.

    摘要翻译: 一种在其表面上清洁具有不均匀图案的晶片的方法。 该方法至少包括以下步骤:用清洗液清洗晶片; 在清洁后用拒水液体化学品代替保留在晶片的凹陷部分中的清洁液体; 干燥晶片,其中,所述清洗液含有80质量%以上的沸点为55〜200℃的溶剂,其中,所述取代工序中供给的所述憎水性液体化学物质的温度不低于 40℃以下,并且低于防水液体化学品的沸点,从而至少对凹部的表面赋予防水性。

    Coating Fluid Applicable by Hand for Sol-Gel Film Formation
    20.
    发明申请
    Coating Fluid Applicable by Hand for Sol-Gel Film Formation 有权
    适用于溶胶 - 凝胶膜形成的涂布液

    公开(公告)号:US20100143600A1

    公开(公告)日:2010-06-10

    申请号:US12598876

    申请日:2008-04-28

    IPC分类号: B05D1/28 C08L83/06

    摘要: A coating solution for obtaining sol-gel films, the coating solution being composed of a solid matter and a solvent, the solid matter including a silicon oxide oligomer obtained by subjecting an alkoxysilane to hydrolysis and polycondensation in an acid aqueous solution; the solvent including an organic solvent having a boiling point of 100° C. or higher and a viscosity of 3.5 mPa·s or lower and the aqueous acid solution, the number average molecular weight of the silicon oxide oligomer in terms of polystyrene being 500-4000, the content of the solid matter in the coating solution being 8-30 weight %, and the content of the silicon oxide oligomer in the solid matter being 10 weight % or greater.

    摘要翻译: 一种用于获得溶胶 - 凝胶膜的涂布溶液,所述涂布溶液由固体物质和溶剂组成,所述固体物质包括通过使烷氧基硅烷在酸性水溶液中水解和缩聚得到的氧化硅低聚物; 溶剂包括沸点为100℃以上,粘度为3.5mPa·s以下的有机溶剂和酸水溶液,聚苯乙烯换算的氧化硅低聚物的数均分子量为500〜 4000,涂布溶液中固体成分的含量为8〜30重量%,固体成分中的氧化硅低聚物的含量为10重量%以上。