摘要:
Disclosed is a liquid chemical for forming a water repellent protective film at least on surfaces of recessed portions of a metal-based wafer, the liquid chemical for forming a water repellent protective film being characterized by comprising a surfactant which has an HLB value of 0.001-10 according to Griffin's method and includes a hydrophobic moiety having a C6-C18 hydrocarbon group and water, and characterized in that the concentration of the surfactant in the liquid chemical is not smaller than 0.00001 mass % and not larger than the saturated concentration relative to 100 mass % of the total amount of the liquid chemical. This liquid chemical can improve a cleaning step which tends to induce a metal-based wafer to cause a pattern collapse.
摘要:
A heat ray shielding glass for vehicle, including a glass substrate and a heat ray shielding film formed on at least one surface of the glass substrate, in which the heat ray shielding film includes: conductive oxide ultrafine particles dispersed in the film; and a silica binder for binding the ultrafine particles to each other, the silica binder including solid contents produced by hydrolysis and polycondensation of tetraalkoxysilane and trialkoxysilane.
摘要:
Disclosed is a process for cleaning a wafer having an uneven pattern at its surface. The process includes at least: a step of cleaning the wafer; a step of substituting a cleaning liquid retained in recessed portions of the wafer with a water-repellent liquid chemical after cleaning; and a step of drying the wafer. The process is characterized in that the cleaning liquid has a boiling point of 55 to 200° C., and characterized in that the water-repellent liquid chemical used for the substitution has a temperature of not lower than 40° C. and lower than a boiling point of the water-repellent liquid chemical thereby imparting water repellency at least to surfaces of the recessed portions. With this process, it is possible to provide a cleaning process for improving the cleaning step that tends to induce a pattern collapse.
摘要:
A cleaning agent for a silicon wafer (a first cleaning agent) contains at least a water-based cleaning liquid and a water-repellent cleaning liquid for providing at least a recessed portion of an uneven pattern with water repellency during a cleaning process. The water-based cleaning liquid is a liquid in which a water-repellent compound having a reactive moiety chemically bondable to Si element in the silicon wafer and a hydrophobic group, and an organic solvent including at least an alcoholic solvent are mixed and contained. With this cleaning agent, the cleaning process which tends to induce a pattern collapse can be improved.
摘要:
[Problems] To develop a heat ray shielding glass usable as a vehicle glass having up-and-down function, the heat ray shielding glass having a film hardness and generating no abnormal noise by friction due to up-and-down movement.[Means for Solving Problems] A heat ray shielding glass for vehicle, including a glass substrate and a heat ray shielding film formed on at least one surface of the glass substrate, in which the heat ray shielding film includes: conductive oxide ultrafine particles dispersed in the film; and a silica binder for binding the ultrafine particles to each other, the silica binder including solid contents produced by hydrolysis and polycondensation of tetraalkoxysilane and trialkoxysilane. In the heat ray shielding film, a ratio between the solid content made from the tetraalkoxysilane and the solid content made from the trialkoxysilane is within a range of from 55:45 to 85:15 on a weight percentage basis, and a ratio between the conductive oxide ultrafine particles and the silica binder is within a range of from 35:65 to 70:30 on a weight percentage basis.
摘要:
The invention relates to an article superior in slipping a waterdrop down a surface of the article. This article includes a substrate; and a functional film formed on a surface of the substrate. This functional film contains (a) a silica matrix; and (b) a component for providing the slipping. This component is dispersed in the silica matrix and contains a special, alkoxy group-terminated, dimethyl silicone.
摘要:
A liquid chemical for forming a water repellent protecting film on a wafer having at its surface an uneven pattern and containing at least one kind of element selected from the group consisting of titanium, tungsten, aluminum, copper, tin, tantalum and ruthenium at surfaces of recessed portions of the uneven pattern, the water repellent protecting film being formed at least on the surfaces of the recessed portions. The liquid chemical is characterized by including: a water repellent protecting film forming agent; and water, and characterized in that the water repellent protecting film forming agent is at least one selected from compounds represented by the following general formula [1] and salt compounds thereof and that the concentration of the water relative to the total quantity of a solvent contained in the liquid chemical is not smaller than 50 mass %.
摘要:
A liquid chemical for forming a water repellent protecting film on a wafer having at its surface an uneven pattern and containing at least one kind of element selected from the group consisting of titanium, tungsten, aluminum, copper, tin, tantalum and ruthenium at surfaces of recessed portions of the uneven pattern, the water repellent protecting film being formed at least on the surfaces of the recessed portions. The liquid chemical is characterized by including: a water repellent protecting film forming agent; and water, and characterized in that the water repellent protecting film forming agent is at least one selected from compounds represented by the following general formula [1] and salt compounds thereof and that the concentration of the water relative to the total quantity of a solvent contained in the liquid chemical is not smaller than 50 mass %.
摘要:
A process for cleaning a wafer having an uneven pattern at its surface. The process includes at least the steps of: cleaning the wafer with a cleaning liquid; substituting the cleaning liquid retained in recessed portions of the wafer with a water-repellent liquid chemical after cleaning; and drying the wafer, wherein the cleaning liquid contains 80 mass % or greater of a solvent having a boiling point of 55 to 200° C., and wherein the water-repellent liquid chemical supplied in the substitution step has a temperature of not lower than 40° C. and lower than a boiling point of the water-repellent liquid chemical thereby imparting water repellency at least to surfaces of the recessed portions.
摘要:
A coating solution for obtaining sol-gel films, the coating solution being composed of a solid matter and a solvent, the solid matter including a silicon oxide oligomer obtained by subjecting an alkoxysilane to hydrolysis and polycondensation in an acid aqueous solution; the solvent including an organic solvent having a boiling point of 100° C. or higher and a viscosity of 3.5 mPa·s or lower and the aqueous acid solution, the number average molecular weight of the silicon oxide oligomer in terms of polystyrene being 500-4000, the content of the solid matter in the coating solution being 8-30 weight %, and the content of the silicon oxide oligomer in the solid matter being 10 weight % or greater.