Abstract:
The invention relates to a perfumed consumer product a) an active base; b) at least one Zinc salt of formula Zn(RCOO)2 (I) wherein R is a hydrogen atom or a linear C1-C20 alkyl or linear C2-C20 alkenyl group; c) at least one sulfur-containing pro-fragrance compound; and d) one or more perfuming co-ingredients. The perfumed consumer product compositions can be advantageously used in methods of treatment of fabric and household surfaces, to impart thereto a fresh, odor stable and long-lasting fragrance. They also show a stable out of the bottle odor, without any off-odor notes, independently of the duration of storage of the bottled liquid products.
Abstract:
This disclosure relates to compositions containing 1) at least one water soluble polar aprotic organic solvent; 2) at least one quaternary ammonium hydroxide; 3) at least one carboxylic acid; 4) at least one Group II metal cation; 5) at least one copper corrosion inhibitor selected from the group consisting of 6-substituted-2,4-diamino-1,3,5-triazines; and 6) water. The compositions can effectively strip positive or negative-tone resists or resist residues, and be non-corrosive to bumps and underlying metallization materials (such as SnAg, CuNiSn, CuCoCu, CoSn, Ni, Cu, Al, W, Sn, Co, and the like) on a semiconductor substrate.
Abstract:
The present invention relates to an antimicrobial bar soap that contains zinc pyrithione and a metal-phosphonate complex and is characterized by enhanced discoloration resistance, extended shelf life and/or increased anti-microbial efficacy.
Abstract:
An acidic destaining composition for removing hard water and metal stains is disclosed. The composition comprises an acid in combination with a reducing agent and may preferably be formulated as a solid.
Abstract:
The invention relates to the manufacture and use of a cleaning agent, characterized in that the cleaning agent comprises a microemulsion or a fluid nanophase system, and has the following components: a) at least one non-water-soluble substance having a solubility in water of less than 4 g per liter, b) at least one amphiphile substance, NP-MCA, that has no tenside structure, does not form structures on its own, has a solubility in water or oil between 4 g and 1000 g per liter, and preferably does not accumulate at the oil-water boundary, with the provision that NP-MCA is not selected from among 2-Ethyl-1,3-Hexanediol, 2-Methyl-2,4-Pentanediol, 2-(n-Butyl)-2-Ethyl-1,3-Propanediol and/or 1,2-Diols; c) at least one anionic, cationic, amphoteric and/or non-ionic tenside; d) water and/or a water-soluble solvent having hydroxyl functionality and, optionally, additives.
Abstract:
The invention relates to novel liquid compositions, comprising: a) a liquid base intended for the treatment of surfaces, in particular fabrics or hard surfaces; b) at least one sulfur-containing compound of formula wherein R1 and R2 represent, separately and independently of each other, a hydrogen atom, a halogen atom, preferably chlorine, a C1-C4 linear or branched alkyl group, an amino group or a benzylamino group; or, alternatively, R1 and R2 are taken together to represent a phenyl or pyridine ring, possibly substituted with one to four C1-C4 linear or branched alkyl or alkenyl groups and/or one to two halogen atoms, preferably chlorine atoms; and R3 represents a hydrogen atom, an alkali metal atom, in particular Na or k, a phenyl or benzyl group possibly substituted with one or two halogen atoms and/or one or two methyl, trifluoromethyl, methoxy or amino groups, an amine group, or a C1-C8 unsaturated, linear, branched or cyclic hydrocarbon group possibly substituted with one or two nitrogen, oxygen or halogen atoms; c) at least one sulfur-containing pro-fragrance compound; and d) one or more perfuming co-ingredients; and wherein the composition has a pH comprised between 1 and 8. The compositions can be advantageously used in methods of treatment of fabric and household surfaces, to impart thereto a fresh, odor stable and long-lasting fragrance. They also show a stable out of the bottle odor, without any off-odor notes, independently of the duration of storage of the bottled liquid products.
Abstract:
A method and composition for removing bulk and ion-implanted photoresist and/or post-etch residue material from densely patterned microelectronic devices is described. The composition includes a co-solvent, a chelating agent, optionally an ion pairing reagent, and optionally a surfactant. The composition may further include dense fluid. The compositions effectively remove the photoresist and/or post-etch residue material from the microelectronic device without substantially over-etching the underlying silicon-containing layer(s) and metallic interconnect materials.
Abstract:
The invention relates to a cleaning agent, characterized in that the cleaning agent comprises a microemulsion or a fluid nanophase system, and has the following components: a) at least one non-water-soluble substance having a solubility in water of less than 4 g per liter; b) at least one amphiphile substance, NP-MCA, that has no tenside structure, does not form structures on its own, has a solubility in water or oil between 4 g and 1000 g per liter, and preferably does not accumulate at the oil-water boundary, with the provision that NP-MCA is not selected from among 2-Ethyl-1,3-Hexanediol, 2-Methyl-2,4-Pentanediol, 2-(n-Butyl)-2-Ethyl-1,3-Propanediol and/or 1,2-Diols; c) at least one anionic, cationic, amphoteric and/or non-ionic tenside; d) water and/or a water-soluble solvent having hydroxyl functionality and, optionally, additives.
Abstract:
Compositions and methods for removing and/or reducing incidental soils from fabric articles, especially articles of clothing, linen and drapery, wherein the compositions provide improved cleaning of incidental soils, either with or without a subsequent wash process or other entire fabric care process are provided. The compositions and methods are safe for use on a wide range of fabric articles, even in the home.
Abstract:
This disclosure discusses cleaning of semiconductor wafers after the Chemical-Mechanical Planarization (CMP) of the wafer during the manufacturing of semiconductor devices. Disclosed is an alkaline chemistry for the post-CMP cleaning of wafers containing metal, particularly copper, interconnects. Residual slurry particles, particularly copper or other metal particles, are removed from the wafer surface without significantly etching the metal, leaving deposits on the surface, or imparting significant contamination to the wafer while also protecting the metal from oxidation and corrosion. Additionally, at least one strong chelating agent is present to complex metal ions in solution, facilitating the removal of metal from the dielectric and preventing re-deposition onto the wafer.