公开(公告)号：US20050111848A1

公开(公告)日：2005-05-26

申请号：US10971890

申请日：2004-10-22

Applicant: Stephen Grubb ,  Charles Joyner ,  Frank Peters ,  Fred Kish ,  Drew Perkins

Inventor： Stephen Grubb ,  Charles Joyner ,  Frank Peters ,  Fred Kish ,  Drew Perkins

IPC: G02B6/34 ,  H04B10/18 ,  H04B10/12

CPC classification number: H04J14/0221 ,  G02B6/12007 ,  G02B6/12014 ,  G02B6/12019 ,  G02B6/12026 ,  G02B6/12033 ,  G02B6/2793 ,  G02B6/29391 ,  G02B6/29394 ,  H04B10/25133

Abstract: An optical equalizer/dispersion compensator (E/CDC) comprises an input/output for receiving a multiplexed channel signal comprising a plurality of channel signals of different wavelengths. An optical amplifier may be coupled to receive, as an input/output, the multiplexed channel signals which amplifier may be a semiconductor optical amplifier (SOA) or a gain clamped-semiconductor optical amplifier (GC-SOA). A variable optical attenuator (VOA) is coupled to the optical amplifier and a chromatic dispersion compensator (CDC) is coupled to the variable optical attenuator. A mirror or Faraday rotator mirror (FRM) is coupled to the chromatic dispersion compensator to reflect the multiplexed channel signal back through optical components comprising the chromatic dispersion compensator, the variable optical attenuator and the optical amplifier so that the multiplexed channel signal is corrected partially for equalization and chromatic dispersion compensation with respect to each pass through these optical components. The E/CDC components may be integrated in a photonic integrated circuit (PIC) chip. In several embodiments, a photonic integrated circuit (PIC) chip comprises an input into the chip that receives at least one channel signal having experienced chromatic dispersion, a chromatic dispersion compensator (CDC) that separates the at least one channel signal into separate wavelength components over a free spectral range (FSR) spanning only a signal channel width and subjects the wavelength components to a phase shift to change the wavelength group delay in the wavelength components and that recombines the wavelength components to reconstitute the at least one channel signal, and an output from the chip for the recombined at least one channel signal having reduced chromatic dispersion compared to the same channel signal received at the chip input. The CDC device may include a tuning section to vary the phase shift of wavelength components as they propagate through the device. Such a CDC device may include a Mach-Zehnder interferometer (MZI) or a cascaded group of Mach-Zehnder interferometers, or at least one arrayed waveguide grating (AWG) or at least one Echelle grating.

公开(公告)号：US20050025409A1

公开(公告)日：2005-02-03

申请号：US10852988

申请日：2004-05-25

Applicant: David Welch ,  Vincent Dominic ,  Fred Kish ,  Mark Missey ,  Radhakrishnan Nagarajan ,  Atul Mathur ,  Frank Peters ,  Robert Taylor ,  Matthew Mitchell ,  Alan Nilsson ,  Stephen Grubb ,  Richard Schneider ,  Charles Joyner ,  Jonas Webjorn ,  Ting-Kuang Chiang ,  Robert Grencavich ,  Vinh Nguyen ,  Donald Pavinski ,  Marco Sosa

Inventor： David Welch ,  Vincent Dominic ,  Fred Kish ,  Mark Missey ,  Radhakrishnan Nagarajan ,  Atul Mathur ,  Frank Peters ,  Robert Taylor ,  Matthew Mitchell ,  Alan Nilsson ,  Stephen Grubb ,  Richard Schneider ,  Charles Joyner ,  Jonas Webjorn ,  Ting-Kuang Chiang ,  Robert Grencavich ,  Vinh Nguyen ,  Donald Pavinski ,  Marco Sosa

IPC: G02B6/12 ,  G02B6/34 ,  G02F1/017 ,  H01L31/12 ,  H01S3/00 ,  H01S3/13 ,  H01S5/00 ,  H01S5/026 ,  H01S5/0625 ,  H01S5/0683 ,  H01S5/12 ,  H01S5/20 ,  H01S5/22 ,  H01S5/34 ,  H01S5/40 ,  H01S5/50 ,  H04B10/00 ,  H04B10/04 ,  H04B10/145 ,  H04B10/17 ,  H04J14/02

CPC classification number: G02B6/12011 ,  B82Y20/00 ,  G01R31/31728 ,  G01R31/318511 ,  G02B6/12004 ,  G02B6/12007 ,  G02B6/12019 ,  G02B6/12021 ,  G02B6/12023 ,  G02B6/12026 ,  G02B6/12028 ,  G02B6/12033 ,  G02B6/131 ,  G02B6/136 ,  G02B6/4204 ,  G02F1/01725 ,  G02F2001/0175 ,  G02F2001/01758 ,  G02F2203/69 ,  H01L31/125 ,  H01S5/0014 ,  H01S5/0085 ,  H01S5/02248 ,  H01S5/026 ,  H01S5/0262 ,  H01S5/0264 ,  H01S5/0265 ,  H01S5/0268 ,  H01S5/06256 ,  H01S5/06258 ,  H01S5/0683 ,  H01S5/06832 ,  H01S5/12 ,  H01S5/1228 ,  H01S5/2077 ,  H01S5/22 ,  H01S5/3408 ,  H01S5/4031 ,  H01S5/4087 ,  H01S5/50 ,  H04B10/2914 ,  H04B10/50 ,  H04J14/02 ,  H04J14/0246 ,  H04J14/025 ,  H04J14/0258 ,  H04J14/0265 ,  H04J14/0276 ,  H04J14/0282

Abstract: A photonic integrated circuit (PIC) chip with a plurality of electro-optic components formed on a major surface of the chip and a submount that includes a substrate that extends over the major surface of the chip forming an air gap between the substrate and the major surface, the substrate to support electrical leads for electrical connection to some of the electro-optic components on the chip major surface.

Abstract translation: 具有形成在芯片的主表面上的多个电光部件的光子集成电路（PIC）芯片和包括在芯片的主表面上延伸的基板的基板，该基板在基板和主体之间形成气隙 表面，基板支持电引线，用于电连接到芯片主表面上的一些电光元件。