Abstract:
An optical transmitter comprises a monolithic transmitter photonic integrated circuit (TxPIC) chip that includes an array of modulated sources formed on the PIC chip and having different operating wavelengths approximating a standardized wavelength grid and providing signal outputs of different wavelengths. A wavelength selective combiner is formed on the PIC chip having a wavelength grid passband response approximating the wavelength grid of the standardized wavelength grid. The signal outputs of the modulated sources optically coupled to inputs of the wavelength selective combiner to produce a combined signal output from the combiner. A first wavelength tuning element coupled to each of the modulated sources and a second wavelength tuning element coupled to the wavelength selective combiner. A wavelength monitoring unit is coupled to the wavelength selective combiner to sample the combined signal output. A wavelength control system coupled to the first and second wavelength tuning elements and to said wavelength monitoring unit to receive the sampled combined signal output. The wavelength control system adjusts the respective wavelengths of operation of the modulated sources to approximate or to be chirped to the standardized wavelength grid and for adjusting the optical combiner wavelength grid passband response to approximate the standardized wavelength grid.
Abstract:
Provided is an optical comb generator including a light source, a first waveguide region, a modulation region, and a second waveguide region. The light source is configured to output single-mode light. The first waveguide region divides an output of the light source into first light and second light. The modulation region includes a first modulator and a second modulator modulating the first light and the second light respectively. The second waveguide region combines outputs of the first modulator and the second modulator to output an optical comb. Here, the first modulator and the second modulator respectively include a first quantum well and a second quantum well having an asymmetric structure with respect to each other. The light source, the first waveguide region, the modulation region, and the second waveguide region are integrated into one substrate.
Abstract:
The refractive index of the at least one photonic structure having two separate photonic bands is modulated, so that light supplied to the at least one photonic structure and initially in one of the two photonic bands of the traveling along a forward direction in the at least one photonic structure is converted to light in a second one of the photonic bands, and light in the one photonic band traveling along a backward direction opposite to the forward direction in the at least one photonic structure is not converted and remains in the one photonic band, achieving non-reciprocity. An interferometer comprises a first and a second photonic structure coupled at two coupler regions. The first photonic structure has two separate photonic bands. The refractive index of the first photonic structure is modulated, so that light supplied to the first photonic structure and initially in a first one of the photonic bands traveling along a forward direction in the at least first photonic structure is converted to light in a second one of the photonic bands, and light in the first photonic band traveling along a backward direction opposite to the forward direction in the at least first photonic structure is not converted and remains in the first photonic band. Light supplied to a first end of the first photonic structure and initially in the first photonic band traveling along a forward direction in the photonic structures will pass to a second end of the first photonic structure, and light supplied to the second end of the first photonic structure and traveling along a backward direction in the photonic structures will pass to an end of the second photonic structure.
Abstract:
Method and apparatus for utilizing a probe card for testing in-wafer photonic integrated circuits (PICs) comprising a plurality of in-wafer photonic integrated circuit (PIC) die formed in the surface of a semiconductor wafer where each PIC comprises one or more electro-optic components with formed wafer-surface electrical contacts. The probe card has a probe card body with at least one row of downwardly dependent, electrically conductive contact probes. The probe body is transversely translated over the surface of the wafer to a selected in-wafer photonic integrated circuit (PIC) die. Then, the contact probes of the probe card are brought into engagement with surface electrical contacts of the selected photonic integrated circuit (PIC) die for testing the operation of electro-optic components in the selected in-wafer photonic integrated circuit (PIC) die.
Abstract:
An optical transmitter comprises a monolithic transmitter photonic integrated circuit (TxPIC) chip that includes an array of modulated sources formed on the PIC chip and having different operating wavelengths approximating a standardized wavelength grid and providing signal outputs of different wavelengths. A wavelength selective combiner is formed on the PIC chip having a wavelength grid passband response approximating the wavelength grid of the standardized wavelength grid. The signal outputs of the modulated sources optically coupled to inputs of the wavelength selective combiner to produce a combined signal output from the combiner. A first wavelength tuning element coupled to each of the modulated sources and a second wavelength tuning element coupled to the wavelength selective combiner. A wavelength monitoring unit is coupled to the wavelength selective combiner to sample the combined signal output. A wavelength control system coupled to the first and second wavelength tuning elements and to said wavelength monitoring unit to receive the sampled combined signal output. The wavelength control system adjusts the respective wavelengths of operation of the modulated sources to approximate or to be chirped to the standardized wavelength grid and for adjusting the optical combiner wavelength grid passband response to approximate the standardized wavelength grid.
Abstract:
A photonic integrated circuit (PIC) chip comprising an array of modulated sources, each providing a modulated signal output at a channel wavelength different from the channel wavelength of other modulated sources and a wavelength selective combiner having an input optically coupled to received all the signal outputs from the modulated sources and provide a combined output signal on an output waveguide from the chip. The modulated sources, combiner and output waveguide are all integrated on the same chip.
Abstract:
A method of calibrating a monolithic transmitter photonic integrated circuit (TxPIC) chip is disclosed where the chip contains integrated arrays of laser sources and electro-optic modulators forming a plurality of different wavelength signal channels where each laser source on the chip is sequentially selected and tested for the output power and operational wavelength. Calibration data is initially determined by checking an amount of output power of each laser output and any offset of each laser operational wavelength from a desired predetermined value. Then, adjustment of the operational wavelength of each laser source is accomplished to substantially match the desired predetermined value. The laser source output power and operational wavelength may then be rechecked to determine if there is any remaining offset of each laser operational wavelength from the desired predetermined value. If so, the laser source output power can be readjusted to a desired amount and its operational wavelength can be readjusted to the desired predetermined wavelength value. The final calibration data it then stored for future reference as a benchmark in later adjustment of laser source output power and operational wavelength for each laser source on the tested chip when the chip has been installed in the field.
Abstract:
A photonic integrated circuit (PIC) chip comprising an array of modulated sources, each providing a modulated signal output at a channel wavelength different from the channel wavelength of other modulated sources and a wavelength selective combiner having an input optically coupled to received all the signal outputs from the modulated sources and provide a combined output signal on an output waveguide from the chip. The modulated sources, combiner and output waveguide are all integrated on the same chip.
Abstract:
A photonic integrated circuit (PIC) chip comprising an array of modulated sources, each providing a modulated signal output at a channel wavelength different from the channel wavelength of other modulated sources and a wavelength selective combiner having an input optically coupled to received all the signal outputs from the modulated sources and provide a combined output signal on an output waveguide from the chip. The modulated sources, combiner and output waveguide are all integrated on the same chip.
Abstract:
A photonic integrated circuit (PIC) chip comprising an array of modulated sources, each providing a modulated signal output at a channel wavelength different from the channel wavelength of other modulated sources and a wavelength selective combiner having an input optically coupled to received all the signal outputs from the modulated sources and provide a combined output signal on an output waveguide from the chip. The modulated sources, combiner and output waveguide are all integrated on the same chip.