Abstract:
A semiconductor device includes a lower-layer substrate, a fuse above the lower-layer substrate and blown by radiation with light, a silicon oxide film on the fuse and on an exposed portion of the surface of the lower-layer substrate, and a silicon nitride film on the silicon oxide film. The portion of the silicon oxide film on the surface of the lower-layer substrate is thicker than the fuse, and the silicon oxide film has an opening opposite the fuse.
Abstract:
The invention provides an image forming apparatus connectable to a server via a network. The image forming apparatus includes a network controller for connecting the image forming apparatus to the network and a control unit capable of executing check processing for a server. At the time of the check processing for the server, the control unit transmits a connection request packet (SYN) to the server and performs port scan. The control unit checks a state of the server according to presence or absence of a response (ACK) from the server. When there is no response, the control unit reports a connection error to a user after elapse of an arbitrary timeout period set in the image forming apparatus.
Abstract:
A laminated film of a propylene resin layer and an ethylene resin layer is provided, which does not require solvent removal and recovery devices, etc., is low in influences against working environments and a danger of occurrence of fire, and has a high interlaminar adhesive force. That is, the invention relates to a laminated film prepared by melt extrusion laminating, without via an anchor coating agent, an ethylene based resin mainly comprising a linear ethylene/α-olefin copolymer having: a density of from 0.870 to 0.910 g/cm3; and an MFR of from 1 to 100 g/10 min., the copolymer being obtained by copolymerizing ethylene and an α-olefin having from 3 to 20 carbon atoms, on the surface of a propylene based resin film formed from a crystalline propylene based random copolymer resin having a melting peak temperature of not higher than 140° C., as prepared using a metallocene catalyst.
Abstract:
A method of manufacturing a semiconductor device includes forming a first insulating film supported by a semiconductor substrate, forming an aluminum layer supported by the first insulating film, etching the aluminum layer to form a bonding pad and fuse elements, depositing by plasma chemical vapor deposition a second insulating film covering the bonding pad and the fuse elements, the second insulating film having planar portions between the fuse elements and ridged portions opposite the fuse elements, depositing by plasma chemical vapor deposition a third insulating film covering the second insulating film, etching the third insulating film to form a first hole exposing a first region of the second insulating film, opposite the fuse elements, and a second hole exposing a second region of the second insulating film, opposite at least part of said bonding pad, and etching the second insulating film to form a third hole exposing at least part of the bonding pad.
Abstract:
A cam gear is formed from a resinous material containing 100 parts by weight of polyamide and 5 to 20 parts by weight of modified polyolefin.
Abstract:
A light source device in which the operating characteristic of the auxiliary light source can be improved, in which the starting property within the main discharge vessel is extremely advantageous and which has high reliability with respect to vibration resistance and impact strength without the disadvantage of a cost increase due to the complicated arrangement of the light source device, without reducing the proportion of good articles in the manufacture of the products, and without reducing the quality of the discharge lamp is achieved using a main discharge lamp mounted in a reflector with an auxiliary light source tightly held by the reflector or components which are adjacent to the reflector and without contact with the main discharge vessel.
Abstract:
A method for manufacturing a semiconductor device wherein a contact hole formed in an interlayer insulating film on a semiconductor substrate is filled with a plug for electrically connecting an overlying conductor layer with an underlying conductor layer. The plug fills the contact hole, and comprised a tungsten film the upper end whereof is positioned below the upper surface of the interlayer insulating film, and a tungsten film which is filled on the tungsten film in the contact hole and the upper surface whereof is on substantially the same level as the upper surface of the interlayer insulating film.
Abstract:
The present invention provides a short arc type mercury discharge lamp that, at lamp startup time, quickly shifts glow discharge to arc discharge, and quickly shifts the arc discharge position from the coil to the electrode tip, making it possible to maintain a stable discharge state, in the short arc type mercury discharge lamp 1, a coil 5 has been arranged on the side surface of an electrode 4, and 0.15 mg/mm3 or more of mercury has been sealed inside a discharge vessel, wherein the side part 51 of the coil 5 close to the tip side of the electrode is constructed so as to be fixed to the side surface of the electrode 4, and, at least, the part 52 of the coil 5 following the side part 52 is distanced from the side surface of the electrode.
Abstract translation:本发明提供一种短弧型汞放电灯,其在灯启动时迅速将辉光放电转移到电弧放电,并且将电弧放电位置从线圈快速移动到电极尖端,使得可以保持稳定的放电状态 在短弧型水银放电灯1中,在电极4的侧面配置有线圈5,在放电容器内密封有0.15mg / mm 3以上的汞,其中, 线圈5靠近电极的前端侧被构造成固定到电极4的侧面,并且至少线圈5的跟随侧面部分52的部分52远离电极4的侧表面 电极。
Abstract:
This invention relates to multiphase structured polymer particles comprising at least two rubber component phases (I) formed by copolymerization of monomer mixtures comprising an acrylate ester and a polyfunctional monomer, a thermoplastic resin component phase (II) formed by copolymerization of a monomer mixture comprising a methacrylate ester and other monomers, and satisfying the following conditions (1)-(5). (1) The number average molecular weight of the thermoplastic resin component forming the outermost phase is 30,000 or less. (2) The weight ratio of phase (I)/phase (II) is 30/70-80/20. (3) Of the adjacent phases (1), a specific relation holds regarding the solubility in water of the monomer mixtures forming the nth and n+1th phases. (4) A specific relation holds between the refractive index of phase (I) and the refractive index of phase (II). (5) The average particle size is 150 nm or less. When the multiphase structured polymer particles according to this invention are used alone to form molded products, molded products having excellent transparency and elastic recovery properties can be obtained.
Abstract:
In laminates prepared by laminating a base material and sandwich base material via a bonding layer, the adhesion strength between the sandwich base material and bonding layer is not less than 200 g/15 mm wide at 23 ° C. and the bonding layer is formed of a resin composition which comprises an ethylene/ &agr;-olefin copolymer resin, thus to provide useful laminates which are very excellent in adhesion properties to metal foil, deposited metal surfaces of metal-deposited films, and surfaces of other sandwich base materials and in tear properties such as unsealing properties, and have low smell and high strength as packaging films.