公开(公告)号：US20060071300A1

公开(公告)日：2006-04-06

申请号：US10957231

申请日：2004-09-30

Applicant: Michael Haverty ,  Tim Chen ,  Sadasivan Shankar

Inventor： Michael Haverty ,  Tim Chen ,  Sadasivan Shankar

IPC: H01L23/58

CPC classification number: H01L21/7682 ,  H01L21/02126 ,  H01L21/02203 ,  H01L21/02274 ,  H01L21/02304 ,  H01L21/314 ,  H01L21/31695 ,  H01L2221/1047

Abstract: Numerous embodiments of an apparatus and method of a dielectric material having a low dielectric constant and good mechanical strength are described. In one embodiment a dielectric material having multiple porous regions is disposed over a substrate. A caged structure is bridged within the plurality of pores. In one particular embodiment, the caged structure may be carborane or a carborane derivative.

Abstract translation: 描述具有低介电常数和良好机械强度的介电材料的装置和方法的许多实施例。 在一个实施例中，具有多个多孔区域的电介质材料设置在衬底上。 笼形结构桥接在多个孔内。 在一个具体实施方案中，笼状结构可以是碳硼烷或碳硼烷衍生物。

公开(公告)号：US06586843B2

公开(公告)日：2003-07-01

申请号：US09986409

申请日：2001-11-08

Applicant: Terry Sterrett ,  Tim Chen

Inventor： Terry Sterrett ,  Tim Chen

IPC: H01L2348

CPC classification number: H01L24/29 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/81 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05568 ,  H01L2224/05572 ,  H01L2224/1131 ,  H01L2224/11334 ,  H01L2224/13011 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/1319 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/293 ,  H01L2224/29339 ,  H01L2224/2939 ,  H01L2224/294 ,  H01L2224/29499 ,  H01L2224/2989 ,  H01L2224/73204 ,  H01L2224/81011 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/83141 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83856 ,  H01L2224/92125 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014

Abstract: A method and apparatus provides increased operative life for flip-chip devices that are produced from an integrated circuit formed with electrically conductive bumps bonded to a printed circuit board substrate. The bumps and the substrate are formed from similar materials that allow control of the degree of latency for each element and produce a covalently bonded laminate structure when the bumps and substrate are brought together. The covalently bonded structure decreases bump fatigue to lengthen the operative life of the flip-chip device.

Abstract translation: 一种方法和装置提供了从由与印刷电路板基板接合的导电凸块形成的集成电路产生的倒装芯片器件的增加的工作寿命。 凸块和衬底由类似的材料形成，当这些凸块和衬底组合在一起时，可以控制每个元件的潜在程度并产生共价键合的层压结构。 共价结合的结构减少了凸起疲劳，延长了倒装芯片器件的使用寿命。