公开(公告)号：US11203703B2

公开(公告)日：2021-12-21

申请号：US16247730

申请日：2019-01-15

Applicant: SAMSUNG DISPLAY CO., LTD. ,  UBmaterials Inc.

Inventor： Hyunjin Cho ,  Joonhwa Bae ,  Byoungkwon Choo ,  Woojin Cho ,  Jinhyung Park

IPC: H01L21/321 ,  H01L21/3105 ,  H01L21/306 ,  H01L21/302 ,  C09K3/14 ,  C09G1/04 ,  C09G1/02 ,  C09G1/00 ,  B24B37/04

Abstract: A polishing slurry includes an abrasive material, a first oxide polishing promoter, a first nitride polishing inhibitor, and a second nitride polishing inhibitor. The first oxide polishing promoter includes a polymer-based oxide polishing promoter. The first nitride polishing inhibitor includes an anionic nitride polishing inhibitor. The second nitride polishing inhibitor includes at least one selected from a cationic nitride polishing inhibitor and a non-ionic nitride polishing inhibitor.

公开(公告)号：US09834705B2

公开(公告)日：2017-12-05

申请号：US15047624

申请日：2016-02-18

Applicant: UBMATERIALS INC.

Inventor： Jin Hyung Park

IPC: C09K13/06 ,  C09G1/02 ,  H01L21/321

CPC classification number: C09G1/02 ,  C09K3/1436 ,  C09K3/1463 ,  H01L21/3212

Abstract: Provided are a slurry for polishing tungsten and a method of polishing a substrate. The slurry according to an exemplary embodiment includes an abrasive configured to perform polishing and include particles having a positive zeta potential, a dispersant configure to disperse the abrasive, an oxidizer configured to oxidize a surface of the tungsten, a catalyst configured to promote oxidation of the tungsten, and a selectivity control agent configured to control a polishing selectivity and include an organic acid containing a carboxyl group. According to the slurry of the exemplary embodiment, a polishing selectivity between the tungsten and the insulation layer may be improved by suppressing a polishing rate of the insulation layer.

公开(公告)号：US09790401B2

公开(公告)日：2017-10-17

申请号：US15095008

申请日：2016-04-08

Applicant: UBMATERIALS INC.

Inventor： Jin Hyung Park

IPC: C09G1/02 ,  C01F17/00 ,  C09K3/14

CPC classification number: C09G1/02 ,  C01F17/0043 ,  C01P2004/03 ,  C01P2004/32 ,  C01P2004/51 ,  C01P2004/64 ,  C09K3/1409 ,  C09K3/1454 ,  C09K3/1463

Abstract: The present disclosure relates to abrasive particles, a polishing slurry and a fabricating method of the abrasive particles. The fabricating method of abrasive particles in accordance with an exemplary embodiment of the present disclosure includes preparing a precursor solution in which a first precursor is mixed with a second precursor that is different from the first precursor, preparing a basic solution, mixing the basic solution with the precursor solution and forming a precipitate, and washing abrasive particles synthesized by precipitation.

公开(公告)号：US09567490B2

公开(公告)日：2017-02-14

申请号：US14519122

申请日：2014-10-20

Applicant: UBMATERIALS INC.

Inventor： Seung Won Jung

IPC: C09K13/00 ,  C09K13/02 ,  H01L21/302 ,  H01L21/461 ,  B44C1/22 ,  C03C15/00 ,  C03C25/68 ,  C09G1/02 ,  H01L21/321 ,  C09K3/14 ,  H01L21/304 ,  C23F3/06

CPC classification number: C09G1/02 ,  C09K3/1454 ,  C09K3/1463 ,  C23F3/06 ,  H01L21/304 ,  H01L21/3212

Abstract: A polishing slurry for tungsten and a substrate polishing method are disclosed. The polishing slurry includes an abrasive for performing polishing and having positive zeta potential, and a potential modulator for promoting the oxidation of the tungsten and for controlling the zeta potential of the abrasive.

Abstract translation: 公开了一种用于钨的抛光浆料和基材研磨方法。 抛光浆料包括用于进行抛光并具有正ζ电位的研磨剂，以及用于促进钨的氧化和用于控制研磨剂的ζ电位的电位调节器。

公开(公告)号：US20170002233A1

公开(公告)日：2017-01-05

申请号：US15095008

申请日：2016-04-08

Applicant: UBMATERIALS INC.

Inventor： Jin Hyung PARK

IPC: C09G1/02 ,  C09K3/14 ,  C01F17/00

CPC classification number: C09G1/02 ,  C01F17/0043 ,  C01P2004/03 ,  C01P2004/32 ,  C01P2004/51 ,  C01P2004/64 ,  C09K3/1409 ,  C09K3/1454 ,  C09K3/1463

Abstract: The present disclosure relates to abrasive particles, a polishing slurry and a fabricating method of the abrasive particles. The fabricating method of abrasive particles in accordance with an exemplary embodiment of the present disclosure includes preparing a precursor solution in which a first precursor is mixed with a second precursor that is different from the first precursor, preparing a basic solution, mixing the basic solution with the precursor solution and_forming a precipitate, and washing abrasive particles synthesized by precipitation.

Abstract translation: 本发明涉及磨料颗粒，抛光浆料和磨料颗粒的制造方法。 根据本公开的示例性实施方案的磨料颗粒的制造方法包括制备前体溶液，其中第一前体与不同于第一前体的第二前体混合，制备碱性溶液，将碱性溶液与 前体溶液和沉淀物，并洗涤通过沉淀合成的磨料颗粒。

公开(公告)号：US09493679B2

公开(公告)日：2016-11-15

申请号：US14874379

申请日：2015-10-02

Applicant: UBMATERIALS INC.

Inventor： Seung Won Jung

IPC: C09K13/00 ,  C09G1/02 ,  C09K3/14 ,  C01F17/00

CPC classification number: C09G1/02 ,  C01F17/0043 ,  C01P2004/40 ,  C01P2004/61 ,  C01P2004/62 ,  C01P2006/22 ,  C09K3/1409 ,  C09K3/1445 ,  C09K3/1463

Abstract: Provided is a method of manufacturing an abrasive particle including a mother particle and a plurality of auxiliary particles formed on a surface of the mother particle, and a method of manufacturing a polishing slurry in which the abrasive particle is mixed with a polishing accelerating agent and a pH adjusting agent.

公开(公告)号：US20160024350A1

公开(公告)日：2016-01-28

申请号：US14874379

申请日：2015-10-02

Applicant: UBMATERIALS INC.

Inventor： Seung Won JUNG

IPC: C09G1/02 ,  C09K3/14

CPC classification number: C09G1/02 ,  C01F17/0043 ,  C01P2004/40 ,  C01P2004/61 ,  C01P2004/62 ,  C01P2006/22 ,  C09K3/1409 ,  C09K3/1445 ,  C09K3/1463

Abstract: Provided is a method of manufacturing an abrasive particle including a mother particle and a plurality of auxiliary particles formed on a surface of the mother particle, and a method of manufacturing a polishing slurry in which the abrasive particle is mixed with a polishing accelerating agent and a pH adjusting agent.

公开(公告)号：US20150069291A1

公开(公告)日：2015-03-12

申请号：US14483140

申请日：2014-09-10

Applicant: UBMATERIALS INC.

Inventor： Seung Won JUNG

IPC: C09G1/02 ,  C09K3/14

CPC classification number: C09G1/02 ,  C01F17/0043 ,  C01P2004/40 ,  C01P2004/61 ,  C01P2004/62 ,  C01P2006/22 ,  C09K3/1409 ,  C09K3/1445 ,  C09K3/1463

Abstract: Provided is a method of manufacturing an abrasive particle including a mother particle and a plurality of auxiliary particles formed on a surface of the mother particle, and a method of manufacturing a polishing slurry in which the abrasive particle is mixed with a polishing accelerating agent and a pH adjusting agent.

Abstract translation: 提供一种制造包括母体颗粒和形成在母体颗粒表面上的多个辅助颗粒的磨料颗粒的方法，以及研磨浆料的制造方法，其中研磨颗粒与抛光促进剂和 pH调节剂。