Abstract:
A rotational rate sensor having a substrate and a Coriolis element is proposed, the Coriolis element being situated over a surface of a substrate; a driving arrangement being provided, by which the Coriolis element is induced to vibrations parallel to a first axis; a detection arrangement being provided, by which an excursion of the Coriolis elements is detectable on the basis of a Coriolis force in a second axis that is provided to be essentially perpendicular to the first axis; the first and second axis being parallel to the surface of the substrate; sensor elements that are designated to be at least partially movable with respect to the substrate being provided; a force-conveying arrangement being provided; the force-conveying arrangement being provided to convey a static force effect between the substrate and at least one of the sensor elements.
Abstract:
A yaw-rate sensor including a first and a second Coriolis element that are arranged side-by-side above a surface of a substrate. The Coriolis elements are induced to oscillate parallel to a first axis Y. Due to a Coriolis force, the Coriolis elements are deflected in a second axis X which is perpendicular to the first axis Y. The oscillations of the first and second Coriolis elements occur in phase opposition to each other on paths which, without the effect of a Coriolis force, are two straight lines parallel to each other.
Abstract:
A bonding pad structure, in particular for a micromechanical sensor, includes a substrate, an electrically insulating sacrificial layer provided on the substrate, a patterned conductor path layer buried in the sacrificial layer, a contact hole provided in the sacrificial layer, and a bonding pad base, composed of an electrically conductive material. The bonding pad base has a first region extending over the sacrificial layer, and a second layer in contact with the conductor path region and extending through the contact hole. A protective layer is provided at least temporarily on the sacrificial layer in a specific region beneath and around the bonding pad base to prevent underetching of the sacrificial layer beneath the bonding pad base during etching of the sacrificial layer in such a way that the substrate and/or the conductor path is exposed.
Abstract:
An integrated component having a substrate, the substrate having a cavity which surrounds a mechanical structure. The cavity is filled by a fluid of a specific composition under a specific pressure, and the mechanical properties of the mechanical structure are influenced by the fluid.
Abstract:
A method for manufacturing a micromechanical component, in particular, a surface-micromechanical yaw sensor, includes the following steps: providing a substrate having a front side and a back side; forming a micromechanical pattern on the front side; applying a protective layer on the micromechanical pattern on the front side; forming a micromechanical pattern on the back side, a resting on the micromechanical pattern on the front side taking place at least temporarily; removing the protective layer on the front side; and optionally further processing the micromechanical pattern on the front side and/or the micromechanical pattern on the back side.