公开(公告)号：US06187607B1

公开(公告)日：2001-02-13

申请号：US09292282

申请日：1999-04-15

Applicant: Michael Offenberg ,  Udo Bischof ,  Markus Lutz

Inventor： Michael Offenberg ,  Udo Bischof ,  Markus Lutz

IPC: H01L21302

CPC classification number: G01C19/5769 ,  B81B2201/025 ,  B81B2203/0136 ,  B81C1/00571 ,  B81C2201/014 ,  B81C2201/053

Abstract: A manufacturing method for a micromechanical component, and in particular for a micromechanical rotation rate sensor, which has a supporting first layer, an insulating second layer that is arranged on the first layer, and a conductive third layer that is arranged on the second layer. The method includes the following steps: provide the second layer, in the form of patterned first and second insulation regions, on the first layer; provide a first protective layer on an edge region of the first insulation regions and on a corresponding boundary region of the first layer; provide the third layer on the structure resulting from the previous steps; pattern out a structure of conductor paths running on the first insulation regions, and a functional structure of the micromechanical component above the second insulation regions, from the third layer; and remove the second layer in the second insulation regions, the second layer being protected in the first insulation regions by the first protective layer in such a way that it is essentially not removed there.

Abstract translation: 具有支撑第一层，布置在第一层上的绝缘第二层和布置在第二层上的导电第三层的微机械组件的制造方法，特别是用于微机械转速传感器的制造方法。 该方法包括以下步骤：在第一层上提供呈图案化的第一和第二绝缘区域的形式的第二层; 在所述第一绝缘区域的边缘区域和所述第一层的对应边界区域上提供第一保护层; 提供由上述步骤导致的结构上的第三层; 形成在第一绝缘区域上运行的导体路径的结构以及来自第三层的第二绝缘区域上方的微机械部件的功能结构; 并且在所述第二绝缘区域中移除所述第二层，所述第二层在所述第一绝缘区域中被所述第一保护层保护，使得其基本上不被去除。

公开(公告)号：US6117701A

公开(公告)日：2000-09-12

申请号：US907601

申请日：1997-08-08

Applicant: Nicholas Buchan ,  Horst Muenzel ,  Franz Laermer ,  Michael Offenberg ,  Udo Bischof ,  Markus Lutz

Inventor： Nicholas Buchan ,  Horst Muenzel ,  Franz Laermer ,  Michael Offenberg ,  Udo Bischof ,  Markus Lutz

IPC: G01C19/56 ,  G01C19/5755 ,  G01C19/5769 ,  G01P15/08 ,  H01L29/84 ,  H01L41/08 ,  H01L21/00 ,  G01P15/00

CPC classification number: G01C19/5755 ,  G01C19/5769 ,  G01P15/0802 ,  G01P2015/0814

Abstract: A rate-of-rotation sensor includes a three-layer system. The rate-of-rotation sensor and the conductor traces are patterned out of the third layer. The conductor traces are electrically insulated (isolated) by cutouts from other regions of the third layer and by a second electrically insulating layer from a first layer. Thus, a simple electrical contacting (configuration) is achieved that is patterned out of a three-layer system. Since the same etching process is used for the first and the third layer, an especially efficient manufacturing is possible.

Abstract translation: 旋转速度传感器包括三层系统。 转速传感器和导体迹线从第三层图案化。 导体迹线通过从第三层的其它区域的切口和与第一层的第二电绝缘层的切口电绝缘（隔离）。 因此，实现了由三层系统构图的简单的电接触（构造）。 由于在第一和第三层使用相同的蚀刻工艺，所以可以进行特别有效的制造。

公开(公告)号：US6140709A

公开(公告)日：2000-10-31

申请号：US306181

申请日：1999-05-06

Applicant: Horst Muenzel ,  Michael Offenberg ,  Udo Bischof ,  Eckhard Graf ,  Markus Lutz

Inventor： Horst Muenzel ,  Michael Offenberg ,  Udo Bischof ,  Eckhard Graf ,  Markus Lutz

IPC: H01L23/12 ,  B81B7/00 ,  B81C1/00 ,  G01C19/56 ,  G01P15/08 ,  H01L21/60 ,  H01L23/48 ,  H01L29/40 ,  H01L25/52

CPC classification number: G01P15/0802 ,  B81C1/00301 ,  B81C1/00801 ,  G01C19/56 ,  H01L24/02 ,  B81B2207/07 ,  B81B2207/097 ,  B81C2201/014 ,  B81C2201/053 ,  H01L2224/0401 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01072 ,  H01L2924/01074

Abstract: A bonding pad structure, in particular for a micromechanical sensor, includes a substrate, an electrically insulating sacrificial layer provided on the substrate, a patterned conductor path layer buried in the sacrificial layer, a contact hole provided in the sacrificial layer, and a bonding pad base, composed of an electrically conductive material. The bonding pad base has a first region extending over the sacrificial layer, and a second layer in contact with the conductor path region and extending through the contact hole. A protective layer is provided at least temporarily on the sacrificial layer in a specific region beneath and around the bonding pad base to prevent underetching of the sacrificial layer beneath the bonding pad base during etching of the sacrificial layer in such a way that the substrate and/or the conductor path is exposed.

Abstract translation: 特别是用于微机械传感器的焊盘结构包括衬底，设置在衬底上的电绝缘牺牲层，埋在牺牲层中的图案化导体通路层，设置在牺牲层中的接触孔，以及焊盘 基底，由导电材料组成。 焊盘基部具有在牺牲层上延伸的第一区域，以及与导体路径区域接触并延伸穿过接触孔的第二层。 保护层至少临时地设置在接合焊盘基座的下面和周围的特定区域中的牺牲层上，以防止牺牲层在蚀刻牺牲层期间的牺牲层的去抛光，使得衬底和/ 或导体路径露出。

公开(公告)号：US06368885B1

公开(公告)日：2002-04-09

申请号：US09641438

申请日：2000-08-17

Applicant: Michael Offenberg ,  Udo Bischof

Inventor： Michael Offenberg ,  Udo Bischof

IPC: G01R3126

CPC classification number: G01C19/5769 ,  B81C1/00801 ,  B81C2201/053 ,  G01P15/0802 ,  Y10S438/902 ,  Y10S438/928 ,  Y10S438/976

Abstract: A method for manufacturing a micromechanical component, in particular, a surface-micromechanical yaw sensor, includes the following steps: providing a substrate having a front side and a back side; forming a micromechanical pattern on the front side; applying a protective layer on the micromechanical pattern on the front side; forming a micromechanical pattern on the back side, a resting on the micromechanical pattern on the front side taking place at least temporarily; removing the protective layer on the front side; and optionally further processing the micromechanical pattern on the front side and/or the micromechanical pattern on the back side.

Abstract translation: 一种用于制造微机械部件，特别是表面微机械偏航传感器的方法包括以下步骤：提供具有前侧和后侧的基板; 在前侧形成微机械图案; 在前侧的微机械图案上施加保护层; 在后侧形成微机械图案，其至少暂时发生在正面上的微机械图案上; 去除前侧的保护层; 并且可选地进一步处理前侧上的微机械图案和/或后侧的微机械图案。

公开(公告)号：US07259436B2

公开(公告)日：2007-08-21

申请号：US10018180

申请日：2001-03-22

Applicant: Michael Offenberg ,  Markus Lutz

Inventor： Michael Offenberg ,  Markus Lutz

IPC: H01L29/76 ,  H01L29/94 ,  C30B23/00 ,  C30B25/00

CPC classification number: B81C1/00246 ,  B81C2203/0735

Abstract: A micromechanical component includes: a substrate; a micromechanical functional plane provided on the substrate; a covering plane provided on the micromechanical functional plane; and a printed circuit trace plane provided on the covering plane. The covering plane includes a monocrystalline region which is epitaxially grown on an underlying monocrystalline region, and the covering plane includes a polycrystalline region which is epitaxially grown on an underlying polycrystalline starting layer at the same time.

Abstract translation: 微机械部件包括：基板; 设置在基板上的微机械功能平面; 设置在微机械功能平面上的覆盖平面; 以及设置在覆盖平面上的印刷电路迹线平面。 覆盖平面包括在下面的单晶区域外延生长的单晶区域，并且覆盖平面包括同时在下面的多晶起始层上外延生长的多晶区域。

公开(公告)号：US06268232B1

公开(公告)日：2001-07-31

申请号：US09302224

申请日：1999-04-29

Applicant: Helmut Skapa ,  Horst Muenzel ,  Franz Laermer ,  Michael Offenberg ,  Heinz-Georg Vossenberg

Inventor： Helmut Skapa ,  Horst Muenzel ,  Franz Laermer ,  Michael Offenberg ,  Heinz-Georg Vossenberg

IPC: H01L2100

CPC classification number: G01P15/0802 ,  B81B2201/0235 ,  B81C1/00571 ,  B81C2201/0109 ,  B81C2201/014 ,  B81C2201/056 ,  B81C2203/0109 ,  G01P1/023

Abstract: A method for fabricating a micromechanical component, in particular a surface-micromechanical acceleration sensor, involves preparing a substrate and providing an insulation layer on the substrate, in which a patterned circuit trace layer is buried. A conductive layer, including a first region and a second region, is provided on the insulation layer, and a movable element is configured in the first region by forming a first plurality of trenches and by using an etching agent to remove at least one portion of the insulation layer from underneath the conductive layer. A contact element is formed and electrically connected to the circuit trace layer in the second region by configuring a second plurality of trenches, and the resultant movable element is encapsulated in the first region. The second plurality of trenches for forming the contact element in the second region is first formed after the encapsulation of the movable element formed in the first region.

Abstract translation: 用于制造微机械部件，特别是表面微机械加速度传感器的方法涉及准备衬底并在衬底上提供绝缘层，其中掩埋有图案化的电路迹线层。 包括第一区域和第二区域的导电层设置在绝缘层上，并且可移动元件通过形成第一多个沟槽而被构造在第一区域中，并且通过使用蚀刻剂去除至少一部分 绝缘层从导电层下面。 通过构造第二多个沟槽，形成接触元件并在第二区域中电连接到电路迹线层，并且所得到的可移动元件被封装在第一区域中。 在第二区域中形成接触元件的第二多个沟槽首先在形成在第一区域中的可移动元件的封装之后形成。

公开(公告)号：US5627317A

公开(公告)日：1997-05-06

申请号：US466841

申请日：1995-06-06

Applicant: Michael Offenberg ,  Wolfgang Buchholtz ,  Markus Lutz

Inventor： Michael Offenberg ,  Wolfgang Buchholtz ,  Markus Lutz

IPC: G01G3/00 ,  G01L1/14 ,  G01P15/08 ,  G01P15/125

CPC classification number: G01P15/0802 ,  G01P15/125

Abstract: A sensor in which the structure of a movable element is produced from an upper silicon layer of a laminated substrate. Individual regions of the upper layer are insulated from one another by insulation trenches which are bridged by conductor tracks coupled to at least one electrode on the movable element and at least one stationary electrode on the upper layer proximate to the at least one electrode on the movable element.

Abstract translation: 传感器，其中可移动元件的结构由层压基板的上硅层制成。 上层的单个区域通过绝缘沟槽彼此绝缘，所述绝缘沟槽由耦合到可移动元件上的至少一个电极的导体轨道桥接，并且在上层上的至少一个固定电极，靠近可移动的至少一个电极 元件。

公开(公告)号：US5467649A

公开(公告)日：1995-11-21

申请号：US278342

申请日：1994-07-21

Applicant: Eckart Reihlen ,  Jiri Marek ,  Frank Bantien ,  Guenther Findler ,  Michael Offenberg ,  Josef Kleinhans ,  Uwe Konzelmann ,  Botho Ziegenbein

Inventor： Eckart Reihlen ,  Jiri Marek ,  Frank Bantien ,  Guenther Findler ,  Michael Offenberg ,  Josef Kleinhans ,  Uwe Konzelmann ,  Botho Ziegenbein

IPC: G01F1/684 ,  G01F1/86 ,  G01F1/68

CPC classification number: G01F1/6845 ,  G01F1/86

Abstract: A mass flow sensor includes a measuring element arranged on a membrane that is clamped in a frame. The sensor is formed by introducing a recess into a silicon wafer. Through the application of a recess having perpendicular walls, the thickness of the frame can be reduced, thus allowing the required surface area of the wafer to also be reduced.

Abstract translation: 质量流量传感器包括布置在被夹在框架中的膜上的测量元件。 传感器通过将凹槽引入硅晶片而形成。 通过施加具有垂直壁的凹部，可以减小框架的厚度，从而允许晶片的所需表面积减小。

公开(公告)号：US5355569A

公开(公告)日：1994-10-18

申请号：US951169

申请日：1992-09-25

Applicant: Jiri Marek ,  Helmut Baumann ,  Guenther Findler ,  Michael Offenberg ,  Martin Willmann

Inventor： Jiri Marek ,  Helmut Baumann ,  Guenther Findler ,  Michael Offenberg ,  Martin Willmann

IPC: G01P15/08 ,  G01P15/125 ,  H01L29/84 ,  H01G5/16

CPC classification number: G01P15/0802 ,  G01P15/125 ,  G01P2015/0828 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/4979 ,  Y10T29/49792

Abstract: A method for producing capacitive sensors which is used in particular for the parallel production of capacitive sensors with exactly defined stray capacitance. For this purpose, troughs (15, 16, 17) are cut along or parallel to the splitting lines (6), so that adjustment errors in the position of the cut, during separation of the sensors, and variations in the cut width have no effect on the stray capacitance.

Abstract translation: 一种用于制造电容传感器的方法，其特别用于并行生产具有精确定义的杂散电容的电容式传感器。 为此，沿分离线（6）切割槽（15,16,17），从而在分离传感器期间切割位置的调节误差和切割宽度的变化没有 影响杂散电容。

公开(公告)号：US06318175B1

公开(公告)日：2001-11-20

申请号：US09585141

申请日：2000-06-01

Applicant: Joerg Muchow ,  Horst Muenzel ,  Michael Offenberg ,  Winfried Waldvogel

Inventor： Joerg Muchow ,  Horst Muenzel ,  Michael Offenberg ,  Winfried Waldvogel

IPC: G01P1500

CPC classification number: G01H11/06 ,  G01L9/0042 ,  G01L9/0054 ,  G01L9/0073 ,  G01P15/0802 ,  G01P15/123 ,  G01P15/125 ,  G01P2015/0814 ,  G01P2015/0817 ,  G01P2015/0828

Abstract: A micromechanical sensor includes a support of silicon substrate having an epitaxial layer of silicon applied on the silicon substrate. A part of the epitaxial layer is laid bare to form at least one micromechanical deflection part by an etching process. The bared deflection part is made of polycrystalline silicon which has grown in polycrystalline form during the epitaxial process over a silicon-oxide layer which has been removed by etching. In the support region and/or at the connection to the silicon substrate, the exposed deflection part passes into single crystal silicon. By large layer thicknesses, a large working capacity of the sensor is possible. The sensor structure provides enhanced mechanical stability, processability, and possibilities of shaping, and it can be integrated, in particular, in a bipolar process or mixed process (bipolar-CMOS, bipolar-CMOS-DMOS).

Abstract translation: 微机械传感器包括具有施加在硅衬底上的硅的外延层的硅衬底的支撑体。 通过蚀刻工艺将外延层的一部分裸露以形成至少一个微机械偏转部分。 裸露的偏转部分由多晶硅制成，该多晶硅在外延生长过程中在已通过蚀刻去除的氧化硅层上形成多晶体。 在支撑区域和/或与硅衬底的连接处，暴露的偏转部分进入单晶硅。 通过大层厚度，传感器的大工作容量是可能的。 该传感器结构提供增强的机械稳定性，可加工性和成形的可能性，并且其可以特别集成在双极工艺或混合工艺（双极CMOS，双极CMOS-DMOS）中。