摘要:
Heteroepitaxial growth of phosphorus-containing III/V semiconductor material (e.g., InGaAsP) on a non-planar surface of a different phosphorus-containing III/V semiconductor material (e.g., InP) is facilitated by heating the non-planar surface in a substantially evacuated chamber to a mass-transport temperature, and exposing the surface to a flux of at least phosphorus form a solid phosphorus source. This mass-transport step is followed by in situ growth of the desired semiconductor material, with at least an initial portion of the growth being done at a first growth temperature that is not greater than the mass transport temperature. Growth typically is completed at a second growth temperature higher than the first growth temperature. A significant aspect of the method is provision of the required fluxes (e.g., phosphorus, arsenic, indium, gallium) from solid sources, resulting in hydrogen-free mass transport and growth, which can be carried out at lower temperatures than is customary in the prior art. An exemplary and preferred application of the method is in grating formation and overgrowth in InP-based DFB lasers.
摘要:
A multiple reflectivity band reflector (MRBR) includes a stack of dielectric layers, arranged so that the reflector has a reflectivity profile comprising a plurality of reflectivity bands, e.g. at least first and second wavelength bands with reflectivity above a lasing threshold reflectivity, separated by a third wavelength band between the first and second wavelength bands having reflectivity below the lasing threshold reflectivity. A laser having at least a first mirror and an MRBR as the second mirror has a laser cavity, at least a portion of which is defined by the first mirror and the MRBR. An active region located within the laser cavity contains a material that is capable of stimulated emission at one or more wavelengths in the first and second wavelength bands. The gain spectrum of the laser is adjusted to select one of the first and second wavelength bands, thereby providing for lasing at a wavelength within the selected wavelength band. The laser may be, e.g., a monolithic VCSEL or a one-section or two-section external-cavity VECSEL having the MRBR as one of its cavity mirrors.
摘要:
A multiple reflectivity band reflector (MRBR) includes a stack of dielectric layers, arranged so that the reflector has a reflectivity profile comprising a plurality of reflectivity bands, e.g. at least first and second wavelength bands with reflectivity above a lasing threshold reflectivity, separated by a third wavelength band between the first and second wavelength bands having reflectivity below the lasing threshold reflectivity. A laser having at least a first mirror and an MRBR as the second mirror has a laser cavity, at least a portion of which is defined by the first mirror and the MRBR. An active region located within the laser cavity contains a material that is capable of stimulated emission at one or more wavelengths in the first and second wavelength bands. The gain spectrum of the laser is adjusted to select one of the first and second wavelength bands, thereby providing for lasing at a wavelength within the selected wavelength band. The laser may be, e.g., a monolithic VCSEL or a one-section or two-section external-cavity VECSEL having the MRBR as one of its cavity mirrors.
摘要:
A surface emitting, unipolar, quantum cascade semiconductor laser is constructed of a multilayer semiconductor structure on a substrate. The laser has doped semiconductor material only of one conductivity type. The laser includes a core region having a larger effective refractive index than cladding regions. The core region includes a plurality of repeat units, each repeat unit having a nominally identical active region and a carrier injection and relaxation region. The repeat units are for quantum cascade generation of a lasing resonance mode within a lasing resonance cavity of the multilayer semiconductor structure. A diffraction grating is fabricated within the multilayer semiconductor structure. The grating resonantly couples diverging counter-propagating traveling wave beams of the laser resonance mode while also diffracting light into an upward direction perpendicular to a grating plane and toward the substrate surface, and also into a downward direction. A mirror reflects the downwardly coupled light toward the upward direction again. The optical distance between reflecting mirror and the grating is selected to combine the reflected light with the upwardly coupled light in-phase as the output beam. A lens-like media structure having an effective refractive index profile that varies quadratically in a direction transverse to the laser resonance cavity is included in the multilayer semiconductor structure. The lowest value of the profile is located at a central portion of the laser. The profile monotonically increases moving away from the central portion. The lens-like media structure interacts with the counter-propagating traveling wave beams to provide single mode output.
摘要:
A metal bonded vertical-cavity surface-emitting laser (VCSEL) structure with a bottom dielectric distributed Bragg reflector (DBR) mirror, and method for fabricating the VCSEL structure. The VCSEL structure consists a metal bonding layer disposed on a submount at a bottom side of the metal bonding layer; a bottom cavity mirror comprising a bottom dielectric distributed Bragg reflector (DBR) disposed within the metal bonding layer, the bottom dielectric DBR having a reflectance band including the lasing wavelength; a bottom current-spreading layer disposed on said bottom dielectric DBR and on a substantially flat, annular top surface of said metal bonding layer; a semiconductor active region disposed on the bottom current-spreading layer, said active region capable of stimulated emission at the lasing wavelength; and a top cavity mirror disposed above the active region and having a reflectance band including the lasing wavelength.
摘要:
The present invention is directed a method of fabricating a VCSEL. First, a substrate with a back surface and a front surface is provided. Then, a first reflector, an active region, and a second reflector are disposed on the front surface. The first reflector is disposed on the front surface. The active region is interposed between the first reflector and the second reflector. Then, anti-reflection features are formed into the back surface of the substrate to reduce specular reflection of light into the active region.
摘要:
A substrate including a base substrate, an interfacial bonding layer disposed on the base substrate, and a thin film adaptive crystalline layer disposed on the interfacial bonding layer. The interfacial bonding layer is solid at room temperature, and is in liquid-like form when heated to a temperature above room temperature. The interfacial bonding layer may be heated during epitaxial growth of a target material system grown on the thin film layer to provide the thin film layer with lattice flexibility to adapt to the different lattice constant of the target material system. Alternatively, the thin film layer is originally a strained layer having a strained lattice constant different from that of the target material system but with a relaxed lattice constant very close to that of the target material system, which lattice constant is relaxed to its relaxed value by heating the interfacial bonding layer after the thin film layer is removed from the first semiconductor substrate, so that the thin film layer has an adjusted lattice constant equal to its unstrained, relaxed value and very close to the lattice constant of the target material system.
摘要:
A vertical-external-cavity surface-emitting laser (VECSEL) is formed by providing a monolithic portion having a first laser cavity mirror and an active region disposed on the first mirror. The cavity is completed with a second laser cavity mirror, such as a DBR, deposited onto the light-receiving end of an optical device, such as an optical fiber. The DBR-on-fiber-end is mounted with respect to the active region to complete the laser cavity and to provide automatic coupling of the output laser light into the fiber.
摘要:
The present invention is directed to a VCSEL and method of fabricating same. First, a substrate is provided. Then, a first reflector is disposed (where “disposed” includes being deposited or epitaxially grown) on the substrate, which is followed by an active region being disposed on the first reflector. Then, a second reflector is disposed on the active region such that the active region is interposed between the first reflector and the second reflector. Then, a polarizer is formed inside, or on the top or bottom of, the second reflector. The polarizer contains parallel stripes of material doped differently than that of the second reflector. The polarizer polarizes the light generated from the active region.
摘要:
A method for forming a UV transmission passivation coating on an integrated circuit, such as EPROM, after completion of the active device and metal routing circuitry comprises depositing a first barrier dielectric layer over the integrated circuit; smoothing out underlying features by applying a layer of flowable dielectric over the first dielectric layer; and depositing a second dielectric layer over the flowable dielectric. Next a photoresist pattern is made over the second dielectric coating, having an opening layer over the at least one conductive pad. A wet etch process is used to remove portions of the second dielectric layer exposed by the opening. A dry etch process is used to remove portions of the remaining layers exposed through the opening, including the remaining portions of the second dielectric layer, the flowable dielectric layer and the first dielectric layer, down to the conductive pad. Finally, the photoresist is removed. The second dielectric layer is composed of a first protective dielectric, such as silicon oxynitride, deposited using plasma enhanced chemical vapor deposition, to protect the flowable dielectric layer from the subsequent wet etch process. The second dielectric layer also includes a top layer deposited using plasma enhanced chemical vapor deposition and comprising phosphorus doped silica to provide a stress buffer, and to prevent penetration of mobile ions to the first dielectric layer. The phosphorus doped silica layer is deposited using both high frequency and low frequency power for plasma formation during the deposition to increase the quality of the layer.