Abstract:
A current measuring apparatus for measuring a power supply current received by an electronic device includes: a first current supplying unit for outputting a first current which is a part of the power supply current; a smoothing capacitor for smoothing the first current output by the first current supplying unit connected with one end thereof; a capacitor of device side for smoothing the power supply current, electrostatic capacity of the capacitor of device side being smaller than that of the smoothing capacitor and one end of the capacitor of device side being connected with the electronic device; a switch for making the first current flow from the smoothing capacitor to the capacitor of device side in case of being ON; a second current supplying unit for outputting a second current smaller than the first current to the capacitor of device side via a path parallel to the switch; and a power supply current acquiring unit for acquiring the power supply current on the basis of the second current output by the second current supplying unit.
Abstract:
A test pattern sequence is generated (101), then a logic simulation of the operation of an IC under test in the case of applying each test pattern of the test pattern sequence, and a logic signal value sequence occurring in each signal line of the IC under test (102). The logic signal value sequence in each signal line is used to register in a fault list parts (a logic gate, signal line or signal propagation path) in which a fault (a delay fault or an open fault) detectable by a transient power supply current testing using the test pattern sequence is likely to occur (103).
Abstract:
A particle monitoring device includes a light source for emitting a measurement light; and a light projecting/receiving unit, connected to a depressurized vessel of a processing apparatus, for projecting the emitted measurement light into the depressurized vessel and receiving a scattered light from a particle floating in the depressurized vessel. The light projecting/receiving unit is disposed such that the scattered light is received substantially parallel to the measurement light. The particle monitoring device further includes a received light intensity detection unit. The received light intensity detection unit has a received light intensity detection unit for determining whether or not the detected intensity is greater than a predetermined value and an instruction unit for instructing the processing apparatus to start, continue or stop a processing operation of the processing apparatus depending on the determined result.
Abstract:
A liquid crystal display device of the present invention is one in which unevenness of display, spots generated due to lowering of voltage retention because of impurity ions are sufficiently eliminated and reliability of long-time/long-term use is improved. A liquid crystal display device of the present invention is one comprising a first substrate and a second substrate configured via a liquid crystal layer and a seal, wherein at least one of the first substrate and the second substrate comprises, towards the liquid crystal layer, a color filter layer, a transparent electrode and an alignment layer in this order and at least one of the transparent electrode and the alignment layer covers the color filter layer in a non-display region.
Abstract:
A constant voltage source includes a constant voltage supplying circuit including an operational amplifier for supplying an output voltage to a load and a feedback circuit for feeding back the output voltage to the operational amplifier; a first inductance unit disposed between the constant voltage supplying circuit and the load; and a first bypass capacitor of which one terminal is coupled between the first inductance unit and the load and the other terminal is coupled to a constant voltage unit. The constant voltage source further includes a compensation circuit including a second resistor, a second inductance unit and a second bypass capacitor, one end of each of the second resistor, the second inductance unit and the second bypass capacitor being coupled to each other, wherein the other end of the second resistor is coupled to an end of the first inductance unit near the constant voltage supplying circuit, the other end of the second inductance unit is coupled to a load side end of the first inductance unit and the other end of the second bypass capacitor is coupled to the constant voltage unit.
Abstract:
An IC tester in which a voltage applied type current measuring circuit can be omitted is provided. A current detecting resistance element 21 is inserted into and in series with the output side of a driver 13 which is used in performing a function test for an IC, and a switch 41 is connected in parallel with the resistance element 21. In case of a function test, the switch 41 is turned on, and in case of measuring an input leakage current of a CMOS.IC 11, the switch 41 is turned off, and thereafter, switches 42 and 43 are sequentially turned on one after another to detect a voltage at each end of the resistance element 21 by an analog-to-digital converter 45. This procedure is performed for each of I/O blocks 12-1 to 12-n corresponding to pins of the CMOS.IC, and then, the difference between the detected voltages at the both ends of the resistance element 21 in each block is taken to find the presence/absence and/or the magnitude of the input leakage current.
Abstract:
A substrate to be coated with a thin film is placed inside a vacuum chamber, an ECR plasma is generated and introduced into the vacuum chamber by means of a specified magnetic field generated inside the vacuum chamber and a reaction gas, as well as an inert gas, is introduced into the vacuum chamber while a negative DC voltage superposed with a high-frequency pulse with frequency 25-250 kHz is applied to the substrate by a voltage applying device such that the voltage of the substrate reaches a positive value instantaneously. The frequency of the superposed pulse is selected by using an ammeter to determine an optimum frequency for minimizing the load current of the voltage-applying circuit.
Abstract:
A process for producing an optically active aminopolycarboxylic acid, such as S,S-ethylenediamine-N,N'-disuccinic acid, from a mixture of a diamine, such as ethylenediamine, with fumaric acid using a microorganism having a lyase activity, wherein at least one metal ion selected from the group consisting of an alkaline earth metal, iron, zinc, copper, nickel, aluminum, titanium and manganese is added to the reaction system. According to this process, aminopolycarboxylic acids, such as S,S-ethylenediamine-N,N'-disuccinic acid, or metal complexes thereof, can be appropriately and efficiently produced while improving the reaction yield.
Abstract:
A voltage generating circuit provides little fluctuation of voltage to an IC load when the dynamic character of the IC is tested. In order to achieve this aim, a resistance is inserted between a power supply line and a feedback circuit after the static character of the IC is tested, and a current supply is set to draw current from the connecting point of the inserted resistance. The current supply inversely decreases or increases the amount of current drawn based upon the increment or the decrement of load current which flows through the inserted resistance.
Abstract:
A method and apparatus for the direct heat treatment of medium- to high-carbon steel rods which provides an increased tensile strength and drawability by subjecting hot-rolled steel rods to controlled cooling with a coolant. Expanded spiral coils of hot-rolled medium- to high-carbon steel rod having an austenitic structure and which is continuously transported in a generally horizontal direction is cooled by passing the spiral coils through a vessel containing a coolant of a gas bubble-water mixed fluid under a strong turbulent action. The coolant fluid contains a uniform dispersion of oxidizing gas bubbles and is maintained at a temperature of not higher than 95.degree. C. Preferably, the coolant is caused to flow in the same direction as the direction of movement of the coil in the vessel. The surface of the rod may be oxidized by allowing it to cool in air before it is immersed in the coolant fluid.