公开(公告)号：US20160061653A1

公开(公告)日：2016-03-03

申请号：US14835280

申请日：2015-08-25

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jung-Hsuan Chang ,  Ying-Chung Chen ,  Chao-Lin Shih

IPC: G01J1/02 ,  H01L25/16 ,  H01L25/00

CPC classification number: H01L25/167 ,  G01J1/0209 ,  G01S7/4813 ,  G01S17/026 ,  G06F1/3231 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L27/14678 ,  H01L31/167 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/1815 ,  Y02D10/173 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The present disclosure relates to an optical module, including: a carrier, a emitter, a detector and an encapsulant. The carrier has a first surface. The emitter is disposed above the first surface. The detector is disposed above the first surface. The encapsulant is disposed on the first surface and exposes at least a portion of the emitter.

Abstract translation: 本公开涉及一种光学模块，包括：载体，发射器，检测器和密封剂。 载体具有第一表面。 发射极设置在第一表面之上。 检测器设置在第一表面上方。 密封剂设置在第一表面上并暴露出发射体的至少一部分。

公开(公告)号：US12085768B2

公开(公告)日：2024-09-10

申请号：US17465713

申请日：2021-09-02

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Shih-Chieh Tang ,  Lu-Ming Lai ,  Yu-Che Huang ,  Ying-Chung Chen

IPC: G02B6/42

CPC classification number: G02B6/4215 ,  G02B6/4214

Abstract: The present disclosure provides an optical module. The optical module includes an optical component disposed in or on a carrier and configured to receive a first light. The optical component is further configured to transmit a second light to a first portion of the carrier and transmit a third light to a second portion of the carrier.

公开(公告)号：US11682684B2

公开(公告)日：2023-06-20

申请号：US17066412

申请日：2020-10-08

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Cheng-Ling Huang ,  Lu-Ming Lai ,  Ying-Chung Chen

IPC: H01L27/146

CPC classification number: H01L27/14618 ,  H01L27/14623 ,  H01L27/14627 ,  H01L27/14685

Abstract: An optical package structure and a method for manufacturing an optical package structure are provided. The optical package structure includes a sensor, an optical component and a fixing element. The optical component directly contacts the sensor. An interfacial area is defined by a contacting region of the optical component and the sensor. The fixing element is disposed outside of the interfacial area for bonding the optical component and the sensor.

公开(公告)号：US11088054B2

公开(公告)日：2021-08-10

申请号：US16570841

申请日：2019-09-13

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chi Sheng Tseng ,  Lu-Ming Lai ,  Ying-Chung Chen ,  Hui-Chung Liu

IPC: H01L21/48 ,  H01L23/495

Abstract: A lead frame includes a die pad having a pad top surface and a pad bottom surface opposite to the top pad surface, a plurality of leads, each having a top lead surface and a bottom lead surface opposite to the top lead surface and disposed around the die pad, and a first molding compound disposed between the die pad and each of the leads. The first molding compound exposes the top pad surface of the die pad by covering a portion of the periphery of the top pad surface of the die pad. A method for manufacturing the lead frame is also disclosed.

公开(公告)号：US10910507B2

公开(公告)日：2021-02-02

申请号：US15619414

申请日：2017-06-09

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Cheng-Ling Huang ,  Ying-Chung Chen

IPC: H01L31/16 ,  A61B5/00 ,  A61B5/0408 ,  H01L31/0203

Abstract: A semiconductor package device comprises a substrate, a light emitter, a light detector and a transparent conductive film. The substrate as a first surface and a second surface opposite to the first surface. The light emitter is disposed on the first surface of the substrate and has a light emission area adjacent to the first surface of the substrate. The light detector is disposed on the first surface of the substrate and has a light receiving area adjacent to the first surface of the substrate. The transparent conducting film is disposed on the second surface of the substrate.

公开(公告)号：US10508935B2

公开(公告)日：2019-12-17

申请号：US14884065

申请日：2015-10-15

Applicant: ADVANCED SEMICONDUCTOR ENGINEERING, INC.

Inventor： Yung-Yi Chang ,  Ying-Chung Chen

IPC: G01D5/34

Abstract: The present disclosure provides an optical module and a manufacturing process thereof. The optical module includes a carrier, a light source, a light detector, a molding compound and a lid. The light source is disposed adjacent to a surface of the carrier. The light detector is disposed adjacent to the surface of the carrier. The molding compound encapsulates the light source and the light detector, and includes at least one guiding structure. The lid is disposed between the light source and the light detector, and surrounds the light source and the light detector.

公开(公告)号：US20180138099A1

公开(公告)日：2018-05-17

申请号：US15351241

申请日：2016-11-14

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yu-An FANG ,  Ying-Chung Chen ,  Cheng-Ling Huang

IPC: H01L23/053 ,  H01L23/10

CPC classification number: H01L23/053 ,  B81B7/0032 ,  B81B7/0061 ,  B81C1/00269 ,  B81C1/00309 ,  H01L21/6836 ,  H01L23/04 ,  H01L23/10 ,  H01L2221/68331

Abstract: A semiconductor device package comprises a carrier having a through hole. A lid is over the carrier and comprises a first side wall, a second side wall, and a connection wall. The second side wall is opposite the first side wall, and the connection wall is between the first side wall and the second side wall. The lid and the carrier form a plurality of chambers. The first side wall, the second side wall and the connection wall form a space to fluidly connect the plurality of chambers.

公开(公告)号：US12040321B2

公开(公告)日：2024-07-16

申请号：US17949139

申请日：2022-09-20

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsiang-Cheng Tsai ,  Ying-Chung Chen

IPC: H01L25/16 ,  G01J1/04

CPC classification number: H01L25/167 ,  G01J1/0403

Abstract: An optical device includes an optical component and an electrical component. The optical component has a sensing surface and a backside surface opposite to the sensing surface. The electrical component is disposed adjacent to the backside surface of the optical component and configured to support the optical component. A portion of the backside surface of the optical component is exposed from the electrical component.

公开(公告)号：US11835363B2

公开(公告)日：2023-12-05

申请号：US17684374

申请日：2022-03-01

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ying-Chung Chen ,  Hsun-Wei Chan ,  Lu-Ming Lai ,  Kuang-Hsiung Chen

IPC: G01C3/08

CPC classification number: G01C3/08

Abstract: An optical module includes: a carrier; an optical element disposed on the upper side of the carrier; and a housing disposed on the upper side of the carrier, the housing defining an aperture exposing at least a portion of the optical element, an outer sidewall of the housing including at least one singulation portion disposed on the upper side of the carrier, wherein the singulation portion of the housing is a first portion of the housing, and wherein the housing further includes a second portion and a surface of the singulation portion of the housing is rougher than a surface of the second portion of the housing.

公开(公告)号：US11784174B2

公开(公告)日：2023-10-10

申请号：US17168010

申请日：2021-02-04

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ying-Chung Chen

IPC: H01L25/16 ,  H01L33/52 ,  H01L33/00 ,  H01L31/16 ,  H01L31/02 ,  H01L31/18 ,  H01L33/62

CPC classification number: H01L25/167 ,  H01L31/02002 ,  H01L31/16 ,  H01L31/18 ,  H01L33/005 ,  H01L33/52 ,  H01L33/62 ,  H01L2933/005 ,  H01L2933/0066

Abstract: An optical package structure and a method for manufacturing an optical package structure are provided. The optical package structure includes a first die, a bumping structure, and a second die. The first die is on a carrier. The bumping structure is over the first die. The bumping structure includes a light-transmitting portion and a light-blocking portion embedded in the light-transmitting portion. The second die is electrically connected to the carrier. The light-blocking portion of the bumping structure is free from covering the second die.