公开(公告)号：US10300658B2

公开(公告)日：2019-05-28

申请号：US13628568

申请日：2012-09-27

Applicant: Apple Inc.

Inventor： Richard H. Dinh ,  Daniel W. Jarvis

IPC: C25D5/02 ,  B29C63/34 ,  B29L31/00 ,  B29L31/34 ,  B29C65/08 ,  B29C65/00

Abstract: Electronic device housing structures and other structures may be formed from molded plastic. Plastic structures such as injection molding housing structures and other structures may be provided with openings. An opening may have sidewall surfaces. Machining operations and other techniques may be used in forming the openings. Openings may be processed to enhance resistance to stress-induced cracking of the plastic structures along the sidewall surfaces. Cracking resistance may be obtained by activating the surface using heat or laser treatment and by electroplating the activated surface to form a metal liner structure. Surface treatments using applied liquid chemicals or heat may form a treated layer on the surface of an opening with enhanced cracking resistance. A plastic sleeve or other insert may form a liner structure in an opening that resists cracking. Liner structures may also be formed by applying heat or light to a coating in an opening.

公开(公告)号：US10225964B2

公开(公告)日：2019-03-05

申请号：US15250066

申请日：2016-08-29

Applicant: Apple Inc.

Inventor： James B. Smith ,  Daniel W. Jarvis ,  David A. Pakula ,  Gregory N. Stephens ,  Nicholas G. L. Merz ,  Shayan Malek ,  Sina Bigdeli

IPC: H05K9/00 ,  H05K1/18 ,  H01L23/552

Abstract: Electrical components may be shielded using a shielding can or other shielding structure that covers the electrical components. The electrical components and the shielding structure may be mounted on a substrate such as a printed circuit board using solder or other conductive material. The shielding structure may have one or more shielding layers. The shielding layers may include high conductivity material for providing shielding for radio-frequency electromagnetic interference and magnetic material for blocking magnetic flux. Shielding structures may be formed from materials such as ferritic stainless steel, coatings that enhance solderability, corrosion resistance, and conductivity, magnetic materials printed or otherwise formed on metal layers, and other shielding structures.

公开(公告)号：USD832267S1

公开(公告)日：2018-10-30

申请号：US29612834

申请日：2017-08-04

Applicant: Apple Inc.

Designer： Jody Akana ,  Molly Anderson ,  Bartley K. Andre ,  Shota Aoyagi ,  Anthony Michael Ashcroft ,  Marine C. Bataille ,  Jeremy Bataillou ,  Daniele De Iuliis ,  Markus Diebel ,  Ashley E. Fletcher ,  Douglas G. Fournier ,  M. Evans Hankey ,  Julian Hoenig ,  Richard P. Howarth ,  Jonathan P. Ive ,  Julian Jaede ,  Daniel W. Jarvis ,  Duncan Robert Kerr ,  Robert F. Meyer ,  David A. Pakula ,  Peter Russell-Clarke ,  Benjamin Andrew Shaffer ,  Mikael Silvanto ,  Christopher J. Stringer ,  Joe Sung Ho Tan ,  Tang Yew Tan ,  Clement Tissandier ,  Eugene Antony Whang ,  Rico Zörkendörfer

公开(公告)号：US10103423B2

公开(公告)日：2018-10-16

申请号：US14020676

申请日：2013-09-06

Applicant: Apple Inc.

Inventor： Daniel W. Jarvis ,  Richard Hung Minh Dinh ,  Miguel C. Christophy ,  Hao Xu ,  Jayesh Nath ,  Jared M. Kole ,  Mattia Pascolini ,  Ruben Caballero ,  Jennifer M. Edwards ,  Peter I. Bevelacqua ,  Robert W. Schlub

IPC: H01Q1/24 ,  G06F1/16 ,  H04M1/02 ,  H04M1/18

Abstract: A housing for a personal electronic device is described herein. The housing may include at least one modular subassembly configured to be arranged within an internal cavity of the housing. The at least one modular subassembly is aligned with a feature external to the housing, is affixed to an interior surface of the internal cavity, and is configured to function both as an antenna and as an internal support member of the housing.

公开(公告)号：US20180277936A1

公开(公告)日：2018-09-27

申请号：US15994853

申请日：2018-05-31

Applicant: Apple Inc.

Inventor： Richard Hung Minh Dinh ,  Hao Xu ,  Jayesh Nath ,  Peter I. Bevelacqua ,  Jennifer M. Edwards ,  Daniel W. Jarvis ,  Jared M. Kole ,  Mattia Pascolini ,  Robert W. Schlub ,  Ruben Caballero

IPC: H01Q1/24 ,  H01Q1/08 ,  H01Q1/44

CPC classification number: H01Q1/243 ,  H01Q1/085 ,  H01Q1/44 ,  Y10T29/49016

Abstract: A housing for a personal electronic device is described herein. The housing may include at least one modular subassembly configured to be arranged within an internal cavity of the housing. The at least one modular subassembly is aligned with a feature external to the housing, is affixed to an interior surface of the internal cavity, and is configured to function both as an antenna and as an internal support member of the housing. A hybrid antenna is also described herein. The hybrid antenna can include first and second flexible members capable of facilitating wireless communication, where the first and second flexible members are affixed to one another via a metal member.

公开(公告)号：US10015297B2

公开(公告)日：2018-07-03

申请号：US15260222

申请日：2016-09-08

Applicant: Apple Inc.

Inventor： Lee E. Hooton ,  Daniel W. Jarvis ,  Marwan Rammah ,  Ian A. Spraggs ,  Nicholas G. Merz

IPC: B32B3/02 ,  H04M1/02 ,  G06F1/16

CPC classification number: H04M1/0266 ,  G06F1/1613 ,  G06F1/1626 ,  G06F1/1637 ,  H04M1/0249

Abstract: An electronic device having a cover glass secured with a frame is disclosed. The electronic device includes a masking layer positioned between the cover glass and the frame. The masking layer may include several ink layers. The pigment composition of one of the ink layers may be altered in order to improve an adhesive bond between the ink layer and the cover glass. The frame can be modified to enhance an adhesive bond between the masking layer and the frame. For example, the frame can be altered to include a porous region to increase the surface area of the frame such that the adhesive can bond to the additional surface area. The frame may also include an extension, or rib, that may increase the surface area of the frame that receives an adhesive. The frame may include an opening or a cavity that assists in assembly between an insert-molded feature.

公开(公告)号：US09518333B2

公开(公告)日：2016-12-13

申请号：US14503009

申请日：2014-09-30

Applicant: Apple Inc.

Inventor： Stefan C. Mag ,  Derek C. Krass ,  Nicholas G. Merz ,  Daniel W. Jarvis ,  Matthew P. Rao ,  Vincent Yan ,  Michael Ngo ,  Richard Hung Minh Dinh ,  Thomas Johannessen

IPC: C25D11/02 ,  B23K26/32 ,  B32B37/02 ,  C25D11/04 ,  C25D11/24 ,  C25D11/26 ,  C25D11/30 ,  C25D11/34 ,  B29C65/78

CPC classification number: C25D11/022 ,  B23K26/322 ,  B23K2103/08 ,  B29C65/7847 ,  B32B37/02 ,  C25D11/02 ,  C25D11/04 ,  C25D11/243 ,  C25D11/26 ,  C25D11/30 ,  C25D11/34

Abstract: Methods and systems for manufacturing composite parts that include anodizable portions and non-anodizable portions such that an interface between the anodizable portions and non-anodizable portions are free of visible defects are described. The non-anodizable portions can be made of anodizable metals such as aluminum or aluminum alloy. The non-anodizable portions are made of material that do not generally form an anodic film, such as plastic, ceramic or glass materials. In particular, the methods described relate to manufacturing methods that are compatible with anodizing processes and avoid defects related to anodizing processes. In particular embodiments, the methods involve avoiding trapping of anodizing chemicals within a gap between an anodizable portion and a non-anodizable portion, which prevents the anodizing chemicals from disrupting the uptake of dye in a post-anodizing dyeing process.

Abstract translation: 描述了包括阳极化部分和非阳极氧化部分的复合部件的制造方法和系统，使得可阳极氧化部分和非阳极氧化部分之间的界面没有可见的缺陷。 非阳极氧化部分可以由诸如铝或铝合金的阳极化金属制成。 非阳极氧化部分由通常不形成阳极膜的材料制成，例如塑料，陶瓷或玻璃材料。 特别地，所描述的方法涉及与阳极氧化工艺兼容并避免与阳极氧化工艺相关的缺陷的制造方法。 在具体实施方案中，所述方法涉及避免在阳极氧化部分和非阳极化部分之间的间隙内捕获阳极化化学品，这防止阳极氧化化学品在后阳极氧化染色过程中破坏染料的吸收。

公开(公告)号：US20160260945A1

公开(公告)日：2016-09-08

申请号：US15156013

申请日：2016-05-16

Applicant: Apple Inc.

Inventor： Fletcher Rothkopf ,  David A. Pakula ,  Daniel W. Jarvis ,  John Raff ,  Jeremy C. Franklin

IPC: H01M2/10 ,  H01M2/02 ,  H01M10/647 ,  H01M10/6572 ,  H01M10/623 ,  H01L31/048 ,  H01M10/613

CPC classification number: H01M2/1066 ,  H01L31/048 ,  H01M2/0207 ,  H01M6/46 ,  H01M10/0436 ,  H01M10/425 ,  H01M10/613 ,  H01M10/623 ,  H01M10/647 ,  H01M10/657 ,  H01M10/6572 ,  H01M2220/30 ,  Y02E10/50 ,  Y10T156/10 ,  Y10T156/1082

Abstract: Flexible battery packs for use in electronic devices are disclosed. In one embodiment of the present disclosure, the flexible battery pack may include a plurality of cells, such as galvanic or photovoltaic cells. The battery pack also may include a plurality of laminate layers coupled to the cells that include a top laminate layer and a bottom laminate layer. An adhesive may be used to couple the top and bottom laminate layers together such that each of the plurality of cells is isolated from each other. This arrangement may allow the battery to be shaped to fit a form factor of the electronic device. This arrangement also may allow one or more of the cells to be selectively removed from the plurality, which may be desirable from a manufacturing perspective.

公开(公告)号：US09431699B2

公开(公告)日：2016-08-30

申请号：US14300704

申请日：2014-06-10

Applicant: Apple Inc.

Inventor： Nicholas G. L. Merz ,  Daniel W. Jarvis ,  Sawyer I. Cohen

IPC: H05K7/20 ,  H01Q1/50 ,  H01Q1/24 ,  H01Q1/48 ,  H01Q9/42 ,  H01Q13/10

CPC classification number: H01Q1/50 ,  H01Q1/243 ,  H01Q1/48 ,  H01Q9/42 ,  H01Q13/10

Abstract: Electronic devices may be provided that contain conductive paths. A conductive path may be formed from an elongated metal member that extends across a dielectric gap in an antenna. The antenna may be formed from conductive structures that form an antenna ground and conductive structures that are part of a peripheral conductive housing member in the electronic device. The gap may separate the peripheral conductive housing member from the conductive structures. A conductive path may also be formed using one or more springs. A spring may be welded to a conductive member and may have prongs that press against an additional conductive member when the spring is compressed. The prongs may have narrowed tips, curved shapes, and burrs that help form a satisfactory electrical contact between the spring prongs and the additional conductive member.

Abstract translation: 可以提供包含导电路径的电子设备。 导电路径可以由延伸穿过天线中的电介质间隙的细长金属构件形成。 天线可以由形成天线接地的导电结构和作为电子设备中的外围导电外壳构件的一部分的导电结构形成。 间隙可以将外围导电壳体构件与导电结构分离。 也可以使用一个或多个弹簧形成导电路径。 弹簧可以焊接到导电构件上，并且当弹簧被压缩时可以具有压靠附加的导电构件的插脚。 尖头可能具有变窄的尖端，弯曲形状和毛刺，这有助于在弹簧插脚和附加导电构件之间形成令人满意的电接触。

公开(公告)号：US09374919B2

公开(公告)日：2016-06-21

申请号：US14078368

申请日：2013-11-12

Applicant: Apple Inc.

Inventor： Daniel W. Jarvis ,  Stephen P. Zadesky ,  Pinida J. Moolsintong ,  Tang Yew Tan

IPC: G06F1/16 ,  H05K5/02 ,  B32B37/16 ,  H05K5/00

CPC classification number: H05K5/0208 ,  B32B37/16 ,  H05K5/0017 ,  H05K5/02 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49158

Abstract: Improved techniques for forming an electronic device housing in which an outer housing member can be assembled with one or more other housing members of the electronic device are disclosed. The one or more other housing members can together with a thin substrate layer (or thin substrate) form a frame to which the outer housing member can be secured. The thin substrate layer facilitates molding of the one or more other housing members adjacent to the outer housing member. In one embodiment, the outer housing member can be made of glass and the one or more other housing members can be made of a polymer, such as plastic. The substrate layer can, for example, be formed of a polymer or a metal. The resulting electronic device housing can be thin yet be sufficiently strong to be suitable for use in electronic devices, such as portable electronic devices.

Abstract translation: 公开了用于形成电子设备外壳的改进技术，其中外壳构件可以与电子设备的一个或多个其它外壳构件组装。 一个或多个其它壳体构件可以与薄的衬底层（或薄衬底）一起形成框架，外壳构件可以固定到框架上。 薄的衬底层有助于模制与外部壳体构件相邻的一个或多个其它壳体构件。 在一个实施例中，外部壳体构件可以由玻璃制成，并且一个或多个其它壳体构件可以由诸如塑料的聚合物制成。 衬底层可以例如由聚合物或金属形成。 所得到的电子器件外壳可以是薄的，但足够坚固以适合用于诸如便携式电子设备的电子设备中。