公开(公告)号：US20190088531A1

公开(公告)日：2019-03-21

申请号：US16103531

申请日：2018-08-14

Applicant: Applied Materials, Inc.

Inventor： Yogananda SARODE VISHWANATH ,  Steven E. BABAYAN ,  Stephen PROUTY ,  Andreas SCHMID

IPC: H01L21/687 ,  C23C16/458 ,  H01J37/32

Abstract: Aspects of the present disclosure generally relate to apparatuses and methods for edge ring replacement in processing chambers. In one aspect, a carrier for supporting an edge ring is disclosed. In other aspects, robot blades for supporting a carrier are disclosed. In another aspect, a support structure for supporting a carrier in a degassing chamber is disclosed. In another aspect, a method of transferring an edge ring on a carrier is disclosed.

公开(公告)号：US20230118651A1

公开(公告)日：2023-04-20

申请号：US17823702

申请日：2022-08-31

Applicant: Applied Materials, Inc.

Inventor： Timothy Joseph FRANKLIN ,  Jaeyong CHO ,  Alexander SULYMAN ,  Xue CHANG ,  Kartik RAMASWAMY ,  Steven E. BABAYAN ,  Anwar HUSAIN ,  David COUMOU

IPC: H01J37/32 ,  H01L21/683

Abstract: Embodiments of the present disclosure herein include an apparatus for processing a substrate. More specifically, embodiments of this disclosure provide a substrate support assembly that includes an electrostatic chuck (ESC) assembly. The ESC assembly comprises a cooling base having a top surface and an outer diameter sidewall, an ESC having a substrate support surface, a bottom surface and an outer diameter sidewall, the bottom surface of the ESC coupled to the top surface of the cooling base by an adhesive layer. The substrate support assembly includes a blocking ring disposed around the outer diameter sidewalls of the cooling base and ESC, the blocking ring shielding an interface between the bottom surface of the ESC and the top surface of the cooling base.

公开(公告)号：US20200152425A1

公开(公告)日：2020-05-14

申请号：US16189451

申请日：2018-11-13

Applicant: Applied Materials, Inc.

Inventor： Vahid FIROUZDOR ,  Imad YOUSIF ,  Steven E. BABAYAN ,  Rajinder DHINDSA ,  Changhun LEE ,  Khoi DOAN ,  John Anthony O'MALLEY, III

IPC: H01J37/32 ,  H01L21/683 ,  H01L21/67 ,  H01L21/687

Abstract: Embodiments disclosed herein relate to a substrate processing chamber component assembly with plasma resistant seal. In one embodiment, the semiconductor processing chamber component assembly includes a first semiconductor processing chamber component, a second semiconductor processing component, and a sealing member. The sealing member has a body formed substantially from polytetrafluoroethylene (PTFE). The sealing member provides a seal between the first and second semiconductor processing chamber components. The body includes a first surface, a second surface, a first sealing surface, and a second sealing surface. The first surface is configured for exposure to a plasma processing region. The second surface is opposite the first surface. The first sealing surface and the second sealing surface extend between the first surface and the second surface. The first sealing surface contacts the first semiconductor processing chamber component. The second sealing surface contacts the second semiconductor processing chamber component.

公开(公告)号：US20180061618A1

公开(公告)日：2018-03-01

申请号：US15684230

申请日：2017-08-23

Applicant: Applied Materials, Inc.

Inventor： Michael Thomas NICHOLS ,  Imad YOUSIF ,  John Anthony O'MALLEY, III ,  Rajinder DHINDSA ,  Steven E. BABAYAN

IPC: H01J37/32

CPC classification number: H01J37/32807 ,  H01J37/321 ,  H01J37/32449 ,  H01J37/32633 ,  H01J37/32715

Abstract: Embodiments of the present disclosure relate to a plasma screen used in a plasma processing chamber with improved flow conductance and uniformity. One embodiment provides a plasma screen. The plasma screen includes a circular plate having a center opening and an outer diameter. A plurality of cut outs formed through the circular plate. The plurality of cut outs are arranged in two or more concentric circles. Each concentric circle includes equal number of cut outs.

公开(公告)号：US20180019104A1

公开(公告)日：2018-01-18

申请号：US15244718

申请日：2016-08-23

Applicant: Applied Materials, Inc.

Inventor： Vahid FIROUZDOR ,  Imad YOUSIF ,  Steven E. BABAYAN ,  Rajinder DHINDSA ,  Changhun LEE ,  Khoi DOAN ,  Anthony O'MALLEY

IPC: H01J37/32 ,  H01L21/683 ,  H01L21/67

CPC classification number: H01J37/32495 ,  H01J37/3211 ,  H01J37/32513 ,  H01J37/32697 ,  H01J37/32724 ,  H01J2237/166 ,  H01J2237/334 ,  H01L21/67069 ,  H01L21/67126 ,  H01L21/6831 ,  H01L21/6833 ,  H01L21/68735

Abstract: Embodiments disclosed herein relate to a substrate processing chamber component assembly with plasma resistant seal. In one embodiment, the semiconductor processing chamber component assembly includes a first semiconductor processing chamber component, a second semiconductor processing component, and a sealing member. The sealing member has a body formed substantially from polytetrafluoroethylene (PTFE). The sealing member provides a seal between the first and second semiconductor processing chamber components. The body includes a first surface, a second surface, a first sealing surface, and a second sealing surface. The first surface is configured for exposure to a plasma processing region. The second surface is opposite the first surface. The first sealing surface and the second sealing surface extend between the first surface and the second surface. The first sealing surface contacts the first semiconductor processing chamber component. The second sealing surface contacts the second semiconductor processing chamber component.

公开(公告)号：US20170213758A1

公开(公告)日：2017-07-27

申请号：US15399809

申请日：2017-01-06

Applicant: Applied Materials, Inc.

Inventor： Michael R. RICE ,  Yogananda SARODE VISHWANATH ,  Sunil SRINIVASAN ,  Rajinder DHINDSA ,  Steven E. BABAYAN ,  Olivier LUERE ,  Denis M. KOOSAU ,  Imad YOUSIF

IPC: H01L21/687 ,  H01J37/32 ,  H01L21/683

CPC classification number: H01L21/68735 ,  H01J37/32082 ,  H01J37/32091 ,  H01J37/32715 ,  H01J2237/334 ,  H01L21/67017 ,  H01L21/6719 ,  H01L21/6831 ,  H01L21/68742

Abstract: Apparatuses including a height-adjustable edge ring, and methods for use thereof are described herein. In one example, a substrate support assembly includes a height-adjustable edge ring, and the substrate support assembly is located within a process chamber. The substrate support assembly includes an electrostatic chuck, an edge ring positioned on a portion of the electrostatic chuck, and one or more actuators to adjust the height of the edge ring via one or more push pins. The height-adjustable edge ring can be used to compensate for erosion of the edge ring over time. In addition, the height-adjustable edge ring can be removed from the process chamber via a slit valve opening without venting and opening the process chamber. The height-adjustable edge ring can be tilted by the one or more actuators in order to improve azimuthal uniformity at the edge of the substrate.

公开(公告)号：US20220406635A1

公开(公告)日：2022-12-22

申请号：US17352097

申请日：2021-06-18

Applicant: Applied Materials, Inc.

Inventor： Andrew MYLES ,  Andreas SCHMID ,  Phillip A. CRIMINALE ,  Steven E. BABAYAN

IPC: H01L21/67 ,  G05B23/02 ,  G01B9/02 ,  G01B11/27

Abstract: Examples disclosed herein are directed to a method and apparatus for determining a position of a ring within a process kit. In one example, a sensor assembly for a substrate processing chamber is provided. The sensor assembly includes a housing having a top surface, a bottom surface opposite the top surface, and a plurality of sidewalls connecting the top surface to the bottom surface. The housing also has a recess in the top surface, the recess forming an interior volume within the housing. The sensory assembly includes a bias member, and a contact member disposed on the bias member. The bias member and contact member are disposed within the recess. A sensor is configured to detect a displacement of the contact member. The displacement of the contact member corresponds to a relative position of an edge ring.

公开(公告)号：US20220319904A1

公开(公告)日：2022-10-06

申请号：US17843652

申请日：2022-06-17

Applicant: Applied Materials, Inc.

Inventor： Michael R. RICE ,  Yogananda SARODE VISHWANATH ,  Sunil SRINIVASAN ,  Rajinder DHINDSA ,  Steven E. BABAYAN ,  Olivier LUERE ,  Denis M. KOOSAU ,  Imad YOUSIF

IPC: H01L21/687 ,  H01J37/32 ,  H01L21/67 ,  H01L21/683

Abstract: Apparatuses including a height-adjustable edge ring, and methods for use thereof are described herein. In one example, a process kit for processing a substrate is provided. The process kit has a support ring comprising an upper surface having an inner edge disposed at a first height and an outward edge disposed at a second height less than the first height, the inner edge having a greater thickness than the outward edge. An edge ring is disposed on the support ring, an inner surface of the edge ring interfaced with the inner edge of the support ring. A cover ring is disposed outward of the edge ring, the edge ring independently moveable relative to the support ring and the cover ring. Push pins are disposed inward of the cover ring, the push pins operable to elevate the edge ring while constraining radial movement of the support ring.

公开(公告)号：US20200227242A1

公开(公告)日：2020-07-16

申请号：US16834814

申请日：2020-03-30

Applicant: Applied Materials, Inc.

Inventor： Timothy Joseph FRANKLIN ,  Steven E. BABAYAN ,  Philip Allan KRAUS

IPC: H01J37/32 ,  B05B1/00 ,  B05B1/18 ,  B05B12/10 ,  H01L21/67

Abstract: Embodiments described herein generally related to a substrate processing apparatus, and more specifically to an improved showerhead assembly for a substrate processing apparatus. The showerhead assembly includes a chill plate, a gas plate, and a gas distribution plate having a top surface and a bottom surface. A plurality of protruded features contacts the top surface of the gas distribution plate. A fastener and an energy storage structure is provided on the protruded features. The energy storage structure is compressed by the fastener and axially loads at least one of the protruded features to compress the chill plate, the gas plate and the gas distribution plate.

公开(公告)号：US20200152500A1

公开(公告)日：2020-05-14

申请号：US16741330

申请日：2020-01-13

Applicant: Applied Materials, Inc.

Inventor： Vijay D. PARKHE ,  Steven E. BABAYAN ,  Konstantin MAKHRATCHEV ,  Zhiqiang GUO ,  Phillip R. SOMMER ,  Dan A. MAROHL

IPC: H01L21/683 ,  H05B1/02 ,  H05B3/02 ,  H01L21/67

Abstract: Implementations described herein provide a substrate support assembly which enables both lateral and azimuthal tuning of the heat transfer between an electrostatic chuck and a heating assembly. The substrate support assembly comprises a body having a substrate support surface and a lower surface, one or more main resistive heaters disposed in the body, a plurality of spatially tunable heaters disposed in the body, and a spatially tunable heater controller coupled to the plurality of spatially tunable heaters, the spatially tunable heater controller configured to independently control an output one of the plurality of spatially tunable heaters relative to another of the plurality of spatially tunable heaters.