Scanning efficiency by individual beam steering of multi-beam apparatus

    公开(公告)号:US11031209B2

    公开(公告)日:2021-06-08

    申请号:US16729211

    申请日:2019-12-27

    Abstract: Systems and methods of observing a sample in a multi-beam apparatus are disclosed. A multi-beam apparatus may comprise an array of deflectors configured to steer individual beamlets of multiple beamlets, each deflector of the array of deflectors having a corresponding driver configured to receive a signal for steering a corresponding individual beamlet. The apparatus may further include a controller having circuitry to acquire profile data of a sample and to control each deflector by providing the signal to the corresponding driver based on the acquired profile data, and a steering circuitry comprising the corresponding driver configured to generate a driving signal, a corresponding compensator configured to receive the driving signal and a set of driving signals from other adjacent drivers associated with adjacent deflectors and to generate a compensation signal to compensate a corresponding deflector based on the driving signal and the set of driving signals.

    Method, apparatus, and system for wafer grounding

    公开(公告)号:US12051562B2

    公开(公告)日:2024-07-30

    申请号:US17753298

    申请日:2020-08-25

    CPC classification number: H01J37/20 H01L21/6833 H01J2237/0044

    Abstract: Systems and methods for wafer grounding and wafer grounding location adjustment are disclosed. A first method may include receiving a first value of an electric characteristic associated with the wafer being grounded by an electric signal; determining a first control parameter using at least the first value; and controlling a characteristic of the electric signal using the first control parameter and the first value. A second method for adjusting a grounding location for a wafer may include terminating an electric connection between the wafer and at least one grounding pin in contact the wafer; adjusting a relative position between the wafer and the grounding pin; and restoring the electric connection between the grounding pin and the wafer. A third method may include causing a grounding pin to penetrate through a coating on the wafer by impact; and establishing an electrical connection between the grounding pin and the wafer.

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