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公开(公告)号：US12045555B2
公开(公告)日：2024-07-23
申请号：US16960376
申请日：2019-01-22
Applicant: ASML NETHERLANDS B.V.
Inventor： Vahid Bastani , Alexander Ypma , Dag Sonntag , Everhardus Cornelis Mos , Hakki Ergün Cekli , Chenxi Lin
IPC: G06F30/30 , G06F30/398 , G06N5/01 , G06N5/04 , G06N20/20 , G06F119/18
CPC classification number: G06F30/398 , G06N5/01 , G06N5/04 , G06N20/20 , G06F2119/18
Abstract: Substrates to be processed are partitioned based on pre-processing data that is associated with substrates before a process step. The data is partitioned using a partition rule and the substrates are partitioned into subsets in accordance with subsets of the data obtained by the partitioning. Corrections are applied, specific to each subset. The partition rule is obtained using decision tree analysis on a training set of substrates. The decision tree analysis uses pre-processing data associated with the training substrates before they were processed, and post-processing data associated with the training substrates after being subject to the process step. The partition rule that defines the decision tree is selected from a plurality of partition rules based on a characteristic of subsets of the post-processing data. The associated corrections are obtained implicitly at the same time.
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公开(公告)号：US20210349402A1
公开(公告)日：2021-11-11
申请号：US17381817
申请日：2021-07-21
Applicant: ASML NETHERLANDS B.V.
Inventor： Marc HAUPTMANN , Everhardus Cornelis Mos , Weitian Kou , Alexander Ypma , Michiel Kupers , Hyunwoo Yu , Min-Sub Han
Abstract: A lithographic process is performed on a set of semiconductor substrates consisting of a plurality of substrates. As part of the process, the set of substrates is partitioned into a number of subsets. The partitioning may be based on a set of characteristics associated with a first layer on the substrates. A fingerprint of a performance parameter is then determined for at least one substrate of the set of substrates. Under some circumstances, the fingerprint is determined for one substrate of each subset of substrates. The fingerprint is associated with at least the first layer. A correction for the performance parameter associated with an application of a subsequent layer is then derived, the derivation being based on the determined fingerprint and the partitioning of the set of substrates.
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公开(公告)号：US11099487B2
公开(公告)日：2021-08-24
申请号：US16495416
申请日：2018-03-28
Applicant: ASML NETHERLANDS B.V.
Inventor： Marc Hauptmann , Everhardus Cornelis Mos , Weitian Kou , Alexander Ypma , Michiel Kupers , Hyunwoo Yu , Min-Sub Han
Abstract: A lithographic process is performed on a set of semiconductor substrates consisting of a plurality of substrates. As part of the process, the set of substrates is partitioned into a number of subsets. The partitioning may be based on a set of characteristics associated with a first layer on the substrates. A fingerprint of a performance parameter is then determined for at least one substrate of the set of substrates. Under some circumstances, the fingerprint is determined for one substrate of each subset of substrates. The fingerprint is associated with at least the first layer. A correction for the performance parameter associated with an application of a subsequent layer is then derived, the derivation being based on the determined fingerprint and the partitioning of the set of substrates.
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公开(公告)号：US11099485B2
公开(公告)日：2021-08-24
申请号：US16493326
申请日：2018-04-09
Applicant: ASML NETHERLANDS B.V.
Inventor： Alexander Ypma , Vahid Bastani , Dag Sonntag , Jelle Nije , Hakki Ergün Cekli , Georgios Tsirogiannis , Robert Jan Van Wijk
Abstract: A method of maintaining a set of fingerprints representing variation of one or more process parameters across wafers subjected to a device manufacturing method, the method including: receiving measurement data of one or more parameters measured on wafers; updating the set of fingerprints based on an expected evolution of the one or more process parameters; and evaluation of the updated set of fingerprints based on decomposition of the received measurement data in terms of the updated set of fingerprints. Each fingerprint may have a stored likelihood of occurrence, and the decomposition may involve: estimating, based the received measurement data, likelihoods of occurrence of the set of fingerprints in the received measurement data; and updating the stored likelihoods of occurrence based on the estimated likelihoods.
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15.发明申请公开(公告)号：US20180253015A1
公开(公告)日：2018-09-06
申请号：US15915674
申请日：2018-03-08
Applicant: ASML Netherlands B.V.
Inventor： Alexander Ypma , Jasper Menger , David Deckers , David Han , Adrianus Cornelis Matheus Koopman , Irina Lyulina , Scott Anderson Middlebrooks , Richard Johannes Franciscus Van Haren , Jochem Sebastiaan Wildenberg
CPC classification number: G03F7/70616 , G03F7/70508 , G03F7/70525 , G03F7/70625 , G03F7/70633 , G03F7/70641 , G03F9/7092 , G06F17/30572
Abstract: In a lithographic process, product units such as semiconductor wafers are subjected to lithographic patterning operations and chemical and physical processing operations. Alignment data or other measurements are made at stages during the performance of the process to obtain object data representing positional deviation or other parameters measured at points spatially distributed across each unit. This object data is used to obtain diagnostic information by performing a multivariate analysis to decompose a set of vectors representing the units in said multidimensional space into one or more component vectors. Diagnostic information about the industrial process is extracted using the component vectors. The performance of the industrial process for subsequent product units can be controlled based on the extracted diagnostic information.
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Patent Agency Ranking
16.发明授权公开(公告)号：US12287584B2
公开(公告)日：2025-04-29
申请号：US18232570
申请日：2023-08-10
Applicant: ASML Netherlands B.V.
Inventor： Alexander Ypma , Jasper Menger , David Deckers , David Han , Adrianus Cornelis Matheus Koopman , Irina Lyulina , Scott Anderson Middlebrooks , Richard Johannes Franciscus Van Haren , Jochem Sebastiaan Wildenberg
Abstract: In a lithographic process, product units such as semiconductor wafers are subjected to lithographic patterning operations and chemical and physical processing operations. Alignment data or other measurements are made at stages during the performance of the process to obtain object data representing positional deviation or other parameters measured at points spatially distributed across each unit. This object data is used to obtain diagnostic information by performing a multivariate analysis to decompose a set of vectors representing the units in the multidimensional space into one or more component vectors. Diagnostic information about the industrial process is extracted using the component vectors. The performance of the industrial process for subsequent product units can be controlled based on the extracted diagnostic information.
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公开(公告)号：US11592753B2
公开(公告)日：2023-02-28
申请号：US17715112
申请日：2022-04-07
Applicant: ASML NETHERLANDS B.V.
Inventor： Weitian Kou , Alexander Ypma , Marc Hauptmann , Michiel Kupers , Lydia Marianna Vergaij-Huizer , Erik Johannes Maria Wallerbos , Erik Henri Adriaan Delvigne , Willem Seine Christian Roelofs , Hakki Ergün Cekli , Stefan Cornelis Theodorus Van Der Sanden , Cédric Désiré Grouwstra , David Frans Simon Deckers , Manuel Giollo , Iryna Dovbush
IPC: G03F7/20
Abstract: A method of determining a correction for a process parameter related to a lithographic process, wherein the lithographic process includes a plurality of runs during each one of which a pattern is applied to one or more substrates. The method of determining includes obtaining pre-exposure metrology data describing a property of a substrate; obtaining post-exposure metrology data comprising one or more measurements of the process parameter having been performed on one or more previously exposed substrates; assigning, based on the pre-exposure metrology data, a group membership status from one or more groups to the substrate; and determining the correction for the process parameter based on the group membership status and the post-exposure metrology data.
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公开(公告)号：US11579534B2
公开(公告)日：2023-02-14
申请号：US17436113
申请日：2020-02-06
Applicant: ASML NETHERLANDS B.V.
Inventor： Maialen Larranaga , Dimitra Gkorou , Faegheh Hasibi , Alexander Ypma
Abstract: A method of extracting a feature from a data set includes iteratively extracting a feature from a data set based on a visualization of a residual pattern within the data set, wherein the feature is distinct from a feature extracted in a previous iteration, and the visualization of the residual pattern uses the feature extracted in the previous iteration. Visualizing the data set using the feature extracted in the previous iteration may include showing residual patterns of attribute data that are relevant to target data. Visualizing the data set using the feature extracted in the previous iteration may involve adding cluster constraints to the data set, based on the feature extracted in the previous iteration. Additionally or alternatively, visualizing the data set using the feature extracted in the previous iteration may involve defining conditional probabilities conditioned on the feature extracted in the previous iteration.
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公开(公告)号：US11520238B2
公开(公告)日：2022-12-06
申请号：US17479078
申请日：2021-09-20
Applicant: ASML NETHERLANDS B.V.
Inventor： Jelle Nije , Alexander Ypma , Dimitra Gkorou , Georgios Tsirogiannis , Robert Jan Van Wijk , Tzu-Chao Chen , Frans Reinier Spiering , Sarathi Roy , Cédric Désiré Grouwstra
IPC: G03F7/20
Abstract: A method of optimizing an apparatus for multi-stage processing of product units such as wafers, the method includes: receiving object data representing one or more parameters measured across the product units and associated with different stages of processing of the product units; and determining fingerprints of variation of the object data across the product units, the fingerprints being associated with different respective stages of processing of the product units. The fingerprints may be determined by decomposing the object data into components using principal component analysis for each different respective stage; analyzing commonality of the fingerprints through the different stages to produce commonality results; and optimizing an apparatus for processing product units based on the commonality results.
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公开(公告)号：US10474045B2
公开(公告)日：2019-11-12
申请号：US15737990
申请日：2016-06-28
Applicant: ASML NETHERLANDS B.V.
Inventor： Franciscus Godefridus Casper Bijnen , Arie Jeffrey Den Boef , Richard Johannes Franciscus Van Haren , Patricius Aloysius Jacobus Tinnemans , Alexander Ypma , Irina Anatolievna Lyulina , Edo Maria Hulsebos , Hakki Ergün Cekli , Xing Lan Liu , Loek Johannes Petrus Verhees , Victor Emanuel Calado , Leon Paul Van Dijk
Abstract: A method of characterizing a deformation of a plurality of substrates is described. The method includes: measuring, for a plurality of n different alignment measurement parameters λ and for a plurality of substrates, a position of the alignment marks; determining a positional deviation as the difference between the n alignment mark position measurements and a nominal alignment mark position; grouping the positional deviations into data sets; determining an average data set; subtracting the average data set from the data sets to obtain a plurality of variable data sets; performing a blind source separation method on the variable data sets, thereby decomposing the variable data sets into a set of eigenwafers representing principal components of the variable data sets; and subdividing the set of eigenwafers into a set of mark deformation eigenwafers and a set of substrate deformation eigenwafers.
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