公开(公告)号：US20210358823A1

公开(公告)日：2021-11-18

申请号：US16877197

申请日：2020-05-18

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chi Sheng TSENG ,  Lu-Ming LAI ,  Yu-Che HUANG ,  Shih-Chieh TANG ,  Yu-Min PENG ,  Hui-Chung LIU

IPC: H01L23/31 ,  H01L21/56

Abstract: A semiconductor package structure and a method for manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a semiconductor package structure includes a semiconductor die and a light absorbing layer. The semiconductor die has a first surface, a second surface and a third surface. An active layer of the semiconductor die is adjacent to the first surface. The second surface is opposite to the first surface. The third surface extends from the first surface to the second surface. The light absorbing layer covers the second surface and the third surface of the semiconductor die. The semiconductor die has a thickness defined from the first surface to the second surface, and the thickness of the semiconductor die is less than or equal to about 300 micrometers (μm).

公开(公告)号：US20200227365A1

公开(公告)日：2020-07-16

申请号：US16740168

申请日：2020-01-10

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chi Sheng TSENG ,  I Hung WU

IPC: H01L23/66 ,  H01L23/053 ,  H01L23/498 ,  H01L23/552 ,  H01L23/00 ,  H01L21/48 ,  H01Q1/22

Abstract: A semiconductor package structure includes a carrier, an antenna element, an electronic component, and a conductive structure. The antenna element, which includes an exposed portion, is disposed on the carrier. The conductive structure is disposed between the carrier and the exposed portion of the antenna element. The conductive structure electrically connects the electronic component to the carrier. The carrier, the exposed portion of the antenna element, and the conductive structure define an air space to accommodate the electronic component and to space the electronic component apart from the conductive structure.

公开(公告)号：US20190202686A1

公开(公告)日：2019-07-04

申请号：US16212609

申请日：2018-12-06

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chi Sheng TSENG ,  Lu-Ming LAI ,  Shih-Chieh TANG ,  Hsin-Ying HO ,  Hsun-Wei CHAN

IPC: B81B7/02 ,  H01L33/60

Abstract: A semiconductor device package is provided, which includes a carrier, a first reflective element, a second reflective element, a first optical component, a second optical component and a microelectromechanical system (MEMS) device. The carrier has a first surface. The first reflective element is disposed on the first surface of the carrier. The second reflective element disposed on the first surface of the carrier. The first optical component is disposed on the first reflective element. The second optical component is disposed on the second reflective element. The MEMS device is disposed on the first surface of the carrier to provide light beams to the first reflective element and the second reflective element. The light beams provided to the first reflective element are reflected to the first optical component and the light beams provided to the second reflective element are reflected to the second optical component.

公开(公告)号：US20190131195A1

公开(公告)日：2019-05-02

申请号：US15795203

申请日：2017-10-26

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yu-An FANG ,  Chi Sheng TSENG

IPC: H01L23/10 ,  H01L23/13 ,  H01L23/498 ,  H01L23/053 ,  H01L23/34 ,  H01L21/48 ,  H01L33/48 ,  H01L33/62 ,  H01L31/0203 ,  H01L31/024 ,  H01L31/02

CPC classification number: H01L23/10 ,  H01L21/4803 ,  H01L23/053 ,  H01L23/13 ,  H01L23/34 ,  H01L23/49811 ,  H01L23/49838 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L25/0655 ,  H01L25/165 ,  H01L25/167 ,  H01L31/02002 ,  H01L31/0203 ,  H01L31/024 ,  H01L33/483 ,  H01L33/62 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15313 ,  H01L2924/16251 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/00014

Abstract: A semiconductor package device comprises a substrate, an electronic component and a protection layer. The substrate has a first surface and a second surface opposite to the first surface. The substrate defines a first opening penetrating the substrate. The electronic component is disposed on the first surface of the substrate. The protection layer is disposed on the second surface of the substrate. The protection layer has a first portion adjacent to the first opening and a second portion disposed farther away from the first opening than is the first portion of the protection layer. The first portion of the protection layer has a surface facing away from the second surface of the substrate. The second portion of the protection layer has a surface facing away from the second surface of the substrate. A distance between the surface of the first portion of the protection layer and the second surface of the substrate is greater than a distance between the surface of the second portion of the protection layer and the second surface of the substrate.